Yearly Archives: 2015

Just one century ago, entanglement was at the center of intense theoretical debate, leaving scientists like Albert Einstein baffled. Today, however, entanglement is accepted as a fact of nature and is actively being explored as a resource for future technologies including quantum computers, quantum communication networks, and high-precision quantum sensors.

Entanglement is also one of nature’s most elusive phenomena. Producing entanglement between particles requires that they start out in a highly ordered state, which is disfavored by thermodynamics, the process that governs the interactions between heat and other forms of energy. This poses a particularly formidable challenge when trying to realize entanglement at the macroscopic scale, among huge numbers of particles.

“The macroscopic world that we are used to seems very tidy, but it is completely disordered at the atomic scale. The laws of thermodynamics generally prevent us from observing quantum phenomena in macroscopic objects,” said Paul Klimov, a graduate student in the University of Chicago’s Institute for Molecular Engineering and lead author of new research on quantum entanglement. The institute is a partnership between UChicago and Argonne National Laboratory.

Previously, scientists have overcome the thermodynamic barrier and achieved macroscopic entanglement in solids and liquids by going to ultra-low temperatures (-270 degrees Celsius) and applying huge magnetic fields (1,000 times larger than that of a typical refrigerator magnet) or using chemical reactions. In the Nov. 20 issue of Science Advances, Klimov and other researchers in David Awschalom’s group at the Institute for Molecular Engineering have demonstrated that macroscopic entanglement can be generated at room temperature and in a small magnetic field.

The researchers used infrared laser light to order (preferentially align) the magnetic states of thousands of electrons and nuclei and then electromagnetic pulses, similar to those used for conventional magnetic resonance imaging (MRI), to entangle them. This procedure caused pairs of electrons and nuclei in a macroscopic 40 micrometer-cubed volume (the volume of a red blood cell) of the semiconductor SiC to become entangled.

“We know that the spin states of atomic nuclei associated with semiconductor defects have excellent quantum properties at room temperature,” said Awschalom, Liew Family Professor in Molecular Engineering and a senior scientist at Argonne National Laboratory. “They are coherent, long-lived and controllable with photonics and electronics. Given these quantum ‘pieces,’ creating entangled quantum states seemed like an attainable goal.”

In addition to being of fundamental physical interest, “the ability to produce robust entangled states in an electronic-grade semiconductor at ambient conditions has important implications on future quantum devices,” Awschalom said.

In the short-term, the techniques used here in combination with sophisticated devices enabled by advanced SiC device-fabrication protocols could enable quantum sensors that use entanglement as a resource for beating the sensitivity limit of traditional (non-quantum) sensors. Given that the entanglement works at ambient conditions and the fact that SiC is bio-friendly, one particularly exciting application is biological sensing inside a living organism.

“We are excited about entanglement-enhanced magnetic resonance imaging probes, which could have important biomedical applications,” said Abram Falk of IBM’s Thomas J. Watson Research Center and a co-author of the research findings.

In the long term, it might even be possible to go from entangled states on the same SiC chip to entangled states across distant SiC chips. Such efforts could be facilitated by physical phenomena that allow macroscopic quantum states, as opposed to single quantum states (in single atoms), to interact very strongly with one another, which is important for producing entanglement with a high success rate. Such long-distance entangled states have been proposed for synchronizing global positioning satellites and for communicating information in a manner that is fundamentally secured from eavesdroppers by the laws of physics.

In certain nanomaterials, electrons are able to race through custom-built roadways just one atom wide. To achieve excellent efficiency, these one-dimensional paths must be paved with absolute perfection–a single errant atom can stop racing electrons in their tracks or even launch it backwards. Unfortunately, such imperfections are inevitable.

Now, a pair of scientists from the U.S. Department of Energy’s Brookhaven National Laboratory and Ludwig Maximilian University in Munich have proposed the first solution to such subatomic stoppage: a novel way to create a more robust electron wave by binding together the electron’s direction of movement and its spin. The trick, as described in a paper published November 16 in Physical Review Letters and featured as an Editor’s Selection, is to exploit magnetic ions lacing the electron racetrack. The theory could drive advances in nanoscale engineering for data- and energy-storage technologies.

“One-dimensional materials can only be very good conductors if they are defect-free, but nothing in this world is perfect,” said Brookhaven physicist Alexei Tsvelik, one of two authors on the paper. “Our theory, the first of its kind, lays out a way to protect electron waves and optimize these materials.”

The work relies on a model system called a Kondo chain, where flowing electrons interact with local magnetic moments within a material. Properly harnessed, this powerful interaction could allow materials to behave like perfect conductors and offer high efficiency.

Protecting the transport

Atom-wide channels only allow motion in one of two opposing directions: right or left. Electrons traveling through such a narrow path–racing along in what are called charge-density waves–can be easily reversed by virtually any obstacle.

“The wave rises like an electronic tsunami that is expected to carry electrons smoothly in one direction,” Tsvelik said. “But it turns out that this tsunami can be very easily pinned by disorder, by impurities in the material.”

This “tsunami” shifts direction through a conductivity-smothering phenomenon called backscattering–like a wave breaking against sheer cliffs. But while direction is easily reversed, another feature of the electron is much more resilient: spin. The spin of an electron–like a perpetually spinning quantum top–can only be described as either up or down, and it is impervious to simple imperfections in the material. The trick, then, is to teach the directional wave to lean on spin for support.

“As the electrons flow, they interact with magnetic moments embedded in the material–these pockets of intrinsic magnetism are the key to producing the bound state,” said Ludwig Maximilian University physicist Oleg Yevtushenko, the other collaborator on the paper. “The magnetic moments bind spin and direction tightly together, so any disturbance would need to flip the electron’s spin in order to change its direction.”

These rolling electron waves could then be described as right-moving with spin up, left-moving with spin down, and so on. In each instance, the direction is bolstered by spin.

Building an electron bicycle

Imagine walking along a narrow path barely wide enough for both feet. In such a simple system, turning around is easy–one can pivot around at the slightest provocation.

“But what if we give our pedestrian a bicycle?” Tsvelik said. “It suddenly becomes very difficult to break that angular momentum and change directions–especially on such a narrow path. This bound spin-direction state is like our electron’s bicycle, keeping it rolling along powerfully enough to overcome bumps in the one-dimensional road.”

To verify the efficacy of this theoretical electron bicycle, scientists will need to apply this theory to stringent tests.

“The magnetic ions in materials such as cesium, iron, and manganese all make excellent candidates for generating and exploring this promising bound state,” Yevtushenko said.

The process of synthesizing functional one-dimensional materials–as thin metallic wires or paths conjured by chemistry–continues to evolve and push both theory and industry forward. Scientists in Brookhaven Lab’s Condensed Matter Physics and Materials Science Department and Center for Functional Nanomaterials specialize in similar one-of-a-kind atomic architectures.

“We hope our colleagues will leap at this challenge, especially as it’s the only method proposed to enhance flow at this 1D scale,” Tsvelik said. “Who knows where these fundamental concepts might lead? The wonder of science is that it brings surprise.”

The MEMS industry today is in the age of sensing and interacting. The wide diffusion of MEMS and sensors gives us a better, safer perception of the external environment. In its latest report, Status of the MEMS Industry (Yole Développement, May 2015), the “More than Moore” market research and strategy consulting company, Yole Développement (Yole) estimates that 14 billion devices were produced in 2015. Almost 30 billion will be made annually by 2020. For inertial MEMS devices, Yole’s analysts highlight that IMU manufacturing volumes will grow about 23% between 2015 and 2020. Gyroscope and accelerometer production volumes are also growing, with the following CAGR: 7.9% and 1.6% respectively over the same period. Every sector will keep growing. So, what’s next?

The French Inertial MEMS community, including Yole, will gather on November 27 in Saclay, France. There they will discuss technological evolution and the latest market trends, identify business opportunities and share visions of the future. The conference, entitled “4ème Journée Micro & Nano Technologies pour l’Inertiel,” is backed by the Club des Micro & Nanotechnologies. The Organizing Committee has arranged 19 presentations and is expecting about 100 attendees.

“This event showcases the strength of our national ecosystem in the strategic inertial MEMS area, which covers a wide range of applications, from consumer to automotive, including civil aerospace and military,” said Stéphane Renard, President of the Club NanoMicroTechnologie and Chief Technology Officer at Tronics Microsystems. “Based on this packed program, I am convinced this event will be a huge opportunity for fruitful discussions and exchanges.”

Yole has been actively following the inertial MEMS market’s evolution for more than 17 years. Yole’s analysts conduct thousands of direct interviews in this area every year, with device and system manufacturers, designers, equipment and materials suppliers, and technology developers.

“Most of the discussions we have with the key players in this industry highlight the progressive introduction of more degrees of freedom,” said Dr. Eric Mounier, Senior Technology & Market Analyst, MEMS & Sensors at Yole. “2014 was a successful year for consumer IMU sensors. At Yole, we see high volume adoption in platforms such as the Apple iPhone 6s PlusTM. Clearly, the 6-axis IMU has been adopted in a growing number of platforms. In parallel, 9-axis solutions are gradually being proposed by MEMS device manufacturers with a major target: the wearable market.”

In its MEMS technology and market analysis, Yole estimates that the IMU market was worth US$966 million in 2014, and will grow to US$3 billion in 2020. Consumer smartphones and tablets are driving IMU development. However, business opportunities remain for discrete sensors including accelerometers and gyroscopes for camera module stabilization.

The conference welcomes presentations from leaders of the inertial industry: Thales, iXBlue, Sagem, Club Nano, Dolphin Integration, Asygn, l’Onera, IES Université de Montpellier, Airbus DS, la Direction Générale des Armées (DGA) and more are part of the “4ème Journée Micro & Nano Technologies pour l’Inertiel” program.

There have been a lot of important announcements made by inertial MEMS manufacturers this year that illustrate progress in market volumes and innovations. Some of them will present their vision and highlight the technical evolution during the conference.

For example, Colibrys has recently released its dedicated accelerometer targeting crucial up-and-coming industrial applications, described in an interview available on i-micronews.com. It will be part of the “Perspectives & Applications session” and will share its expertise with the conference’s attendees.

The Executive & Marketing team from Tronics, another major player of the inertial MEMS market, will present progress made on its high performance standard product range GYPRO & AXO. It will also discuss the latest technologies and improvements for future applications, including the M&NEMS platform, developed in collaboration with LETI and dedicated to consumer and automotive applications.

By 2020, the inertial MEMS device market landscape should look very different.

“The next opportunity should come from wearable electronics, where long-term market potential is huge, and autonomous driving,” explained Dr. Guillaume Girardin, Technology & Market Analyst, MEMS & Sensors at Yole.

As part of the third level in assisted driving, the dead reckoning function could be a valuable market opportunity for the inertial MEMS community. This function includes inertial sensors for relative motion associated with cars, such as wheel odometers, encoders, accelerometers and gyroscopes. In the new report “Sensors & Data Management for Autonomous Vehicles” (Yole Développement, October 2015), Yole draws a detailed sensor technology roadmap and describes the associated autonomous functions that will be relevant from 2012 to 2040 and beyond. This covers the numerous sensors and related technologies that could be embedded in vehicles for assisted and autonomous driving.

By Sue Davis, Director of Business Development & Senior Analyst, Techcet

IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with 8 co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene. IDTechEx completely occupied the Santa Clara Convention Center; throughout the day attendees and exhibitors commented attendance was up over prior years. To the dismay of some late arrivals, parking spaces were at a premium.

A venue with >200 exhibitors showcasing new technologies and applications connected conference attendees with equipment and materials suppliers, OEMs, end users, research institutes and academia.

Raghu Das, CEO of IDTechEx, kicked off the conference by sharing a key trends including:

  • Structural electronics are here now!
  • The Fashion industry is converging with technology (and evidenced by a number of exhibitors from this sector)
  • Stretchable electronics R&D has ramped significantly in the last 12 months
  • Printed and flexible electronics manufacturing is becoming center stage

Dr. Mounir Zok, a keynote speaker and biomedical engineering specialist for the US Olympic committee started his talk with a quote “The blink of an eye dictates gold vs no medal.” He emphasized that technology is a key enabler to continually improve sports performance.

Highlights from exhibitors and speakers follow.

Keith McMillen, founder and CEO of BeBop Sensors and avid musician, shared his journey of developing smart fabric cylindrical sensors to analyze a violinist’s bow movement led to utilizing this technology for the Internet of Things and the founding of BeBop Sensors.

BeBop Sensor Examples

BeBop Sensor Examples

Dream car in every facet; aesthetics, functionality and environmental impact understates the design of the Blade Car. Keith Czinger, CEO and Founder of Divergent discussed the foundation for Blade’s development was deeply rooted in reducing environmental impact while ensuring high performance. Divergent reports that manual chassis assembly can be completed within 30 minutes utilizing its’ node network. Nodes are manufactured of a metal alloy and produced using 3D printers. The light and strong chassis is comprised of these nodes and with carbon fiber tubes.

Divergent Blade utilizing 3D printing for node-tube chassis

Divergent Blade utilizing 3D printing for node-tube chassis

Printed Circuit Boards (PCBs) manufactured via additive 3D printing technology, vs. conventional processing labor, material and time intensive processes was demonstrated at NanoDimension’s booth. Simon Fried, CMO and Co-Founder of NanoDimension discussed the benefit of 3D printed circuit boards (prototyping in hours vs weeks, design flexibility, process repeatability, …). In addition to development the DragonFly 3D printer, NanoDimension has developed a line of specialty conductive inks.

NanoDimension DragonFly 200 3D Printer

NanoDimension DragonFly 200 3D Printer

Sensoria Fitness has developed a line of wear fitness clothing and integrated running system that communicates with iOS and Android apps. A key use case is the gait analysis capability to assist with performance running and to assist clinicians with treatment plans for dysfunctional gait patterns.

Sensoria Fitness Socks (Innovation Awards at CES 2015 & IDTechEx 2015 USA)

Sensoria Fitness Socks (Innovation Awards at CES 2015 & IDTechEx 2015 USA)

View Technologies, a joint venture between Stanley Black & Decker, Inc. and RF Controls, has developed the inView Platform that enables 3rd party applications to run more efficiently and accurately. This platform is comprised of Echo antenna(s) and three tiers of service that allow you Locate, Track and Act depending on business needs. Location service provide as real-time stream of 3D position data for Passive UHF RFID tags.

View Technologies - Manufacturing Application

View Technologies – Manufacturing Application

Valencell develops high-performance biometric sensor technology and licenses its technology to a variety of consumer electronics manufacturers, mobile device and accessory makers, sports and fitness brands, gaming companies, and first-responder/military suppliers for integration into their products.

Products utilizing Valencell’s Biometric Sensor Technolgy

Products utilizing Valencell’s Biometric Sensor Technolgy

Another show highlight was Demonstration Street, a dedicated area on the show floor for product demonstrations in various stages of development – prototype to commercialization- featured printed flexible displays including posters, e-readers, audio paper, interactive games, OLED displays, electronics in fabrics, interactive printed controls and menus, printed RFID and more.

IDTechEx 2015 USA offered a myriad of opportunities to interact with technologists and exhibitors attend hundreds of insightful presentations. Master classes covering an array of topics and company tours bookended the two-day conference and exhibition. The main challenge was to create a “show plan” in hopes that one would be able to attend desired presentations and exhibits.

North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in October 2015 (three-month average basis) and a book-to-bill ratio of 0.98, according to the October EMDS Book-to-Bill Report published today by SEMI. A book-to-bill of 0.98 means that $98 worth of orders were received for every $100 of product billed for the month.

SEMI reports that the three-month average of worldwide bookings in October 2015 was $1.33 billion. The bookings figure is 14.7 percent lower than the final September 2015 level of $1.55 billion, and is 20.3 percent higher than the October 2014 order level of $1.10 billion.

The three-month average of worldwide billings in October 2015 was $1.36 billion. The billings figure is 9.1 percent lower than the final September 2015 level of $1.50 billion, and is 14.7 percent higher than the October 2014 billings level of $1.18 billion.

“Both bookings and billings weakened for the second consecutive month; however, year-to-date bookings and billings levels remain above last year’s levels,” said Denny McGuirk, president and CEO of SEMI. “SEMI will update its 2016 equipment outlook during SEMICON Japan next month.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

  Billings
(3-mo. avg)
Bookings
(3-mo. avg)
Book-to-Bill
May 2015 $1,557.3 $1,546.2 0.99
June 2015 $1,554.9 $1,517.4 0.98
July 2015 $1,556.2 $1,587.3 1.02
August 2015 $1,575.9 $1,670.1 1.06
September 2015 (final) $1,495.0 $1,554.9 1.04
October 2015 (prelim) $1,358.4 $1,325.8 0.98

Source: SEMI (www.semi.org), November 2015

Inotera appoints new president


November 19, 2015

Inotera’s board of directors announced this week that they have approved the appointment of Mr. Rod Morgan as president, succeeding Dr. Scott Meikle. The change is effective January 1, 2016.

Mr. Morgan is currently Special Assistant of Inotera. Prior to joining Inotera, he was vice president of Procurement at Micron Technology, Inc. Before that, he served as co-executive officer of IM Flash Technologies, LLC. Mr. Morgan joined Micron in 1984 and held numerous leadership roles in manufacturing operations, including Fab Manager, Manufacturing Integration Manager, Key Equipment Group Director, and Site Director.

The board of directors announced that Dr. Pei-Ing Lee, currently serving as president of Nanya Technology Corporation, was elected to be the new chairman of the company. The election is effective November 10, 2015.

Inotera is a DRAM manufacturing venture between US memory giant Micron Technology Inc. and DRAM chipmaker Nanya Technology.

Inotera plans to fully convert all its production to 20nm chips by the end of the second quarter next year. At end of this year, the chipmaker plans to convert 80 percent of its 30nm chips into 20nm.

Qualcomm Incorporated today announced that Cristiano Amon has been promoted to executive vice president, Qualcomm Technologies, Inc. and president of QCT, effective immediately.

During Amon’s 18-year tenure, his leadership has been instrumental in driving revenue growth in the core business and now the expansion into adjacent areas. In its official release, Qualcomm said this promotion is a recognition of Amon’s unique mix of business, engineering and operational skills.

“Cristiano has been managing QCT’s product roadmap since 2008 – a period of unprecedented growth and innovation for Qualcomm and the industry. He is the right person to lead QCT for a new era of expansion in our semiconductor business,” said Steve Mollenkopf, CEO of Qualcomm Incorporated.

Amon joined Qualcomm in 1995 as an engineer and has subsequently held numerous business and technical leadership roles. For the past three years, Amon has been responsible for Qualcomm’s semiconductor business as co-president of QCT and a member of Qualcomm’s executive committee. He also previously served as the chief technical officer of Vésper, a wireless operator in Brazil and held positions in NEC, Ericsson and Velocom Inc. Amon holds a Bachelor of Science degree in electrical engineering from UNICAMP – Universidade Estadual de Campinas, São Paulo, Brazil.

Murthy Renduchintala, who has served as QCT co-president for the past three years, will be leaving Qualcomm.

GLOBALFOUNDRIES today announced it has been presented with an Award of Excellence from INOVA Semiconductors GmbH, a specialist in the development of products for Gigabit/s serial data communication for in-vehicle Display- and Driver Assistance Systems.

This award acknowledges GLOBALFOUNDRIES for its ability to achieve top quality and yield performance for the silicon wafers produced specifically for the customer’s RF communication products used in the automotive market. Driven by “Zero Excursion, Zero Defect” (ZEZD) mindset, this is a testament to GLOBALFOUNDRIES’ continuous strive for improvement to increase initial product quality and reduce wafer failure rate after delivery.

“Achieving zero defect is our goal and GLOBALFOUNDRIES’ proven expertise in the automotive semiconductor supply chain plays an important role in helping us to reach that goal,” said Robert Kraus, INOVA Semiconductors CEO.

“It is a great honor for GLOBALFOUNDRIES to receive this award from INOVA. This award further solidifies our position in serving the automotive market over a decade with high quality and reliability standard, and propel us to become a leading foundry in this segment,” said KC Ang, SVP and General Manager for GLOBALFOUNDRIES Singapore.

GLOBALFOUNDRIES completes a range of industry certifications and audits every year in its continuous commitment to semiconductor quality and reliability. Every fab in Singapore are certified or exceeding ISO-TS 16949, ISO 9001, ISO 14001 and OHSAS 18001, including the customer-led VDA6.3 audits that exceed the TS16949 standard. GLOBALFOUNDRIES is also a member of the Automotive Electronics Council (AEC) which sets global industry standards for automotive semiconductor quality.

By Sue Davis, Director of Business Development & Senior Analyst, Techcet

IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with 8 co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene. IDTechEx completely occupied the Santa Clara Convention Center; throughout the day attendees and exhibitors commented the attendance was indeed up over prior years. To the dismay of some late arrivals, parking spaces were at a premium.

A venue with >200 exhibitors showcasing new technologies and applications connected conference attendees with equipment and materials suppliers, OEMs, end users, research institutes and academia.

Raghu Das, CEO of IDTechEx, kicked off the conference by sharing a key trends including:

  • Structural electronics are here now!
  • The Fashion industry is converging with technology (and evidenced by a number of exhibitors from this sector)
  • Stretchable electronics R&D has ramped significantly in the last 12 months
  • Printed and flexible electronics manufacturing is becoming center stage

Dr. Mounir Zok, a keynote speaker and biomedical engineering specialist for the US Olympic committee started his talk with a quote: “The blink of an eye dictates gold vs no medal.” He emphasized that technology is a key enabler to continually improve sports performance.

I had the opportunity to meet with several exhibitors:

  • Keith McMillen, founder and CEO of BeBop Sensors and avid musician, shared his journey of developing cylindrical sensors to analyze a violinist’s bow movement led to utilizing this technology for the Internet of Things and the founding of BeBop Sensors. Smart fabric is the core for Bebop’s sensor platform.
  • Dream car in every facet; aesthetics, functionality and environment understates the design of the Blade Keith Czinger, CEO and Founder of Divergent, discussed the foundation for Blade’s development was deeply rooted in reducing environmental impact while ensuring high performance.
  • Printed Circuit Boards (PCBs) – manufactured via additive 3D printing technology vs. conventional processing labor, material and time intensive processes was demonstrated at NanoDimesion’s booth. Simon Fried, CMO and Co-Founder of NanoDimension discussed the benefit of 3D printed circuit boards (prototyping in hours vs weeks, design flexibility, process repeatability, …). In addition to development the 3D printers, NanoDimension has developed a line of specialty inks.

Another show highlight was Demonstration Street, a dedicated area on the show floor for product demonstrations in various stages of development – prototype to commercialization- featured printed flexible displays including posters, e-readers, audio paper, interactive games, OLED displays, electronics in fabrics, interactive printed controls and menus, printed RFID and more.

Stay tuned: Day 2 promises to be equally exciting! The main challenge is navigating IDTechEx to see all the great technology.

Today, SEMI announced details about the SEMI Industry Strategy Symposium (ISS) on January 10-13 where semiconductor executives will discuss “Integrating for Growth: Markets, Technology, and Ecosystem” in Half Moon Bay, Calif.  Industry leaders present the current status of their major technological and economic challenges while economists and industry analysts discuss their views of global economic and industry forecasts. Attendees hear diverse perspectives from IC design, manufacturing, foundry, R&D, and consumer electronics.

Emerging applications are broadening the scope of the traditional semiconductor business, resulting in advanced capabilities and expanded ecosystems. Growing semiconductor complexity serves diverse markets, sophisticated technologies, and expanding ecosystems, while escalating costs related to innovation and investment requirements remain a concern. Still Moore’s Law continues to relentlessly push both silicon and the industry to new limits associated with physics and economics.  With an era of disruptive innovation on the horizon, the industry is focusing on creating value and achieving growth using an integrative platform approach. ISS will focus on a breakthrough approach that fosters greater sharing of resources and more effective strategies for accomplishing mutual goals, industry-wide.

Highlights of the conference include:

  • Keynotes: Mary J. Miller, U.S. Army; Haruyoshi Kumura, Nissan; and Ken Hansen, Semiconductor Research Corporation
  • ISS CxO Panel on “It’s 2050… Moore’s Law is Dead… What’s the New Business Model?” with panelists from Brewer Science, Intel, Synopsys, and more
  • Economic Trends: Keynote by Duncan Meldrum, Hilltop Economics; with presentations from Gartner, IC Insights, McKinsey & Company, Pacific Crest Securities, SEMI, and VLSI Research
  • Market Perspectives: Presentations from AnandTech, International Business Strategies, Jefferies, Robert Bosch LLC, and SanDisk
  • Technology and Manufacturing: Presentations from Amkor Technology, ASM International, GLOBALFOUNDRIES, IM Flash Technologies, Intel, Qualcomm, SMIC, and SUNY Poly/CNSE
  • Collaboration Towards Success: Presentations from ASML, Intel Capital, and Micron

For more information on the SEMI Industry Strategy Symposium, please visit: www.semi.org/iss.