Yearly Archives: 2015

Worcester, MA — November 3, 2015 — Allegro MicroSystems, LLC announced the release of a unique dual-channel Hall-effect latch featuring two-dimensional (2D) sensing via a combination of vertical Hall and planar Hall elements. The quadrature outputs of the A1262 allow rotation direction and position to be determined, such as when sensing a rotating ring-magnet target. The unique 2D operation of the combined planar and vertical Hall elements allows the end user to achieve an ideal 90° of phase separation between channels that is inherently independent of ring magnet geometry (pole pitch). This enables system designers to achieve new mechanical configurations not feasible with traditional planar Hall sensors, including replacing through-hole SIP devices with tiny surface-mount SOT23 ICs, saving space and cost. This new device is targeted at applications in the automotive, industrial, and consumer markets such as motor commutation and rotary position sensing, e.g., window blinds, garage door openers, scroll wheels, power window lifts, sunroof/sliding door/trunk/tailgate motors, white goods, etc.

Allegro’s A1262 is available in two options that allow flexibility in end-system magnetic design. Both options feature a planar Hall element that is sensitive to magnetic fields perpendicular to the face of the package (Z). The other channel comes from a vertical Hall element that is sensitive in either the X or Y direction. The Y option features a vertical Hall plate that is sensitive to magnetic fields parallel with the face of the package across the leaded edges of the package. The X option features a vertical Hall plate that is sensitive to magnetic fields parallel with the face of the package across the leadless edges of the package, resulting in lower total effective air gap than can be achieved with competing solutions.

On a single silicon chip, the device includes: two Hall plates (one planar and one vertical), a multiplexer, a small-signal amplifier, chopper stabilization, a Schmitt trigger, and two short-circuit-protected NMOS output transistors to sink up to 20 mA. The on-board regulator permits operation with supply voltages of 3 to 24 V and adds EMC robustness such as greater protection against high voltage transient events. The A1262 is qualified to AEC-Q100 standards and includes Zener clamps, output short-circuit protection, and reverse-battery protection. Superior high-temperature performance is made possible through dynamic offset cancellation, which reduces the residual offset voltage normally caused by device overmolding, temperature dependencies, and thermal stress.

The device is highly sensitive (BOP = 17 G typical) and its magnetic operating characteristics are specified across the operating voltage and temperature ranges. Package designator “LH5” is a modified SOT23-W surface-mount package, magnetically optimized for a variety of orientations. This package is lead (Pb) free, with 100% matte-tin leadframe plating.

HILLSBORO, Ore. — October 27, 2015 — FEI Company and DCG Systems, Inc. today announced a definitive agreement under which FEI would acquire DCG for $160 million in an all cash transaction. DCG is a leading supplier of electrical fault characterization, localization and editing equipment, serving process development, yield ramp and failure analysis applications for a wide range of semiconductor and electronics manufacturers. Headquartered in Fremont, California, DCG is a profitable private company and was the recipient of Deloitte’s Technology Fast 500 award in 2013 and 2014.

The deal combines FEI’s leading physical failure analysis capabilities for the semiconductor lab with DCG’s complementary portfolio of electrical failure analysis solutions.  DCG’s offerings expand FEI’s served available market through the addition of optical imaging, thermal imaging and nano-probing technologies.  The combined company’s solutions will offer a more complete workflow for customers as they deal with the increasing complexities from process development to advanced 3D packaging.

“The acquisition of DCG expands FEI’s presence and capability in the semiconductor lab and enhances our ability to provide a complete workflow solution,” commented Don Kania, president and CEO of FEI. “The combination brings together leaders in physical and electrical failure analysis and will enable our customers to better connect workflows to improve time to data and efficiency.”

“Together with FEI we have a tremendous opportunity to offer our customers an integrated defect analysis solution,” commented Israel Niv, CEO of DCG. “The DCG team is excited to join forces with FEI and tap into FEI’s strong global presence and significant R&D capabilities to drive further penetration of DCG’s leading electrical failure analysis solutions.  We look forward to working together with FEI to provide integrated solutions to help our customers successfully execute on their future technology roadmaps.”

DCG generated revenue of $76 million in its fiscal year ended January 31, 2015.  The transaction is expected to be slightly accretive to FEI’s 2016 GAAP EPS.  FEI intends to fund the acquisition with cash on hand.

The transaction is expected to close by the end of 2015 and is subject to certain regulatory approvals and customary closing conditions.

Hillsboro, Ore. — November 2, 2015 — FEI today announced the new Helios™ G4 DualBeam series, which offers the highest throughput ultra-thin TEM lamella preparation for leading-edge semiconductor manufacturing and failure analysis applications. The new DualBeam series, which includes FX and HX models, takes a significant leap forward in both technological capability and ease-of-use.

The new Phoenix focused ion beam (FIB) makes finer cuts with higher precision and simplifies the creation of ultra-thin (sub 10nm) lamella for transmission electron microscopy (TEM) imaging. The FX is a flexible system that delivers dramatically improved STEM resolution – down to sub-three Ångströms – and significantly shortens the time to data for failure analysis. Images can now be obtained within minutes of completing the lamella, rather than the hours or days required previously to finalize the images on a stand-alone S/TEM system. The HX model is geared specifically for high-throughput TEM lamella production. It features an automated QuickFlip holder that reduces sample preparation times.

“FEI is the first to market with a TEM sample preparation solution capable of making 7nm thick lamella, addressing the needs of our customers who are developing next-generation devices,” states Rob Krueger, vice president and general manager of FEI’s semiconductor business. “In addition, by offering the ability to achieve sub-three Ångström image resolution in a DualBeam, failure analysis labs can now dramatically cut ‘time to data’ without compromising image quality. And, by combining high-resolution imaging and sample preparation on one system, we have reduced the amount of valuable lab real estate required.”

Innovative Micro Technology (IMT), the largest pure-play MEMS manufacturer in the USA, announced today the signing of a partner agreement with Silicon Catalyst, the world’s only startup incubator focused exclusively on semiconductor solutions. The partnership with Silicon Catalyst offers the opportunity for IMT to provide MEMS-related technical consulting, manufacturing expertise and prototypes to the Silicon Catalyst portfolio of startup companies that are considering MEMS sensors and solutions.

“MEMS (micro-electromechanical systems) technology provides the sensing interface to advanced semiconductor devices that are the core of the ‘Internet of Things.’ We believe the infrastructure Silicon Catalyst is establishing to enable the incubation of semiconductor devices provides numerous links with MEMS devices for the sensing of personal health, environment, energy consumption, agriculture and medical treatment. Additional applications for MEMS technologies also improve cellular phone performance, GPS navigation and smart phone battery consumption. We are pleased to partner with Silicon Catalyst to provide these fundamental sensing technologies to their portfolio companies,” said Craig Ensley, CEO of IMT.

The two organizations plan to work together to provide startup companies that are focused on solutions that require MEMS technology with design and process expertise, prototyping, shuttle wafers and office facilities. IMT has a broad range of expertise in the area of MEMS technology. For more than 15 years, IMT has worked with hundreds of companies to assist them with early stage planning, process integration and volume manufacturing. More than 450 MEMS designs have been implemented and run in the IMT manufacturing facilities. Portfolio companies can benefit from the IMT manufacturing experience and participate in various wafer shuttle opportunities for quick turn prototypes and accelerated market introduction of new MEMS devices.

“As we move into the era of IoT, sensors and other innovative MEMS devices become critical for new applications,” said Dan Armbrust, CEO of Silicon Catalyst. “IMT’s impressive MEMS development capability is the ideal resource for our portfolio companies as they innovate in IoT. We look forward to a long and exciting partnership with IMT.”

WASHINGTON — Nov. 2, 2015 — The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $85.2 billion during the third quarter of 2015. This total marks an increase of 1.5 percent compared to the previous quarter, but is 2.8 percent lower than the third quarter of last year. Global sales for the month of September 2015 were $28.4 billion, 1.9 percent more than last month’s sales, but 2.8 percent less than sales from September 2014. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

WWSemiSalesSept15Source: WSTS

“Global semiconductor sales showed signs of resilience in September, increasing compared to the previous month across all regional markets for the first time in more than a year,” said John Neuffer, president and CEO, Semiconductor Industry Association. “However, softening demand and currency devaluation caused year-to-year sales to dip for the third straight month.”

Regionally, sales were up compared to last month in the Americas (4.0 percent), China (2.6 percent), Europe (2.2 percent), Japan (0.5 percent), and Asia Pacific/All Other (0.1 percent). Year-to-year sales increased in China (5.0 percent), but decreased in Asia Pacific/All Other (-3.5 percent), the Americas (-3.9 percent), Europe (-10.6 percent), and Japan (-11.4 percent).

WWSemiSalesSept15GraphSource: WSTS

“One thing proven to spur semiconductor sales globally is maintaining free and open markets,” Neuffer continued. “In June, SIA successfully encouraged policymakers to approve legislation to facilitate free trade agreements. In July, a major deal was struck in Geneva at the World Trade Organization to expand the Information Technology Agreement to eliminate tariffs on next-generation semiconductors called MCOs and a wide range of tech products. And in October, negotiators from around the Asia-Pacific region reached an agreement on a massive trade agreement called the Trans-Pacific Partnership (TPP). The TPP would spur growth and promote innovation in our industry and throughout the U.S. economy, and Congress should approve it.”

 

Today, in conjunction with the 41st International Symposium for Testing and Failure Analysis (ISTFA), DCG Systems® announced the release of EBIRCH™, a new, unique technology for localizing shorts and other low-resistance faults that may reside in the interconnect structures or the polysilicon base layer of integrated circuits. Named for Electron Beam Induced Resistance Change, EBIRCH offers fault analysis (FA) engineers and yield experts the ability to detect and isolate low-resistance electrical faults without resorting to brute-force binary search approaches that rely on successive FIB* cuts. Its unparalleled ability to quickly isolate low-resistance faults enables EBIRCH to boost the success rate of physical failure analysis (PFA) imaging techniques to well above 90%, accelerating time-to-results and establishing the FA lab as a critical partner organization in solving yield and reliability problems.

“At foundries and IDM* fabs, the process has become more difficult to control using traditional inline measures,” said Mike Berkmyre, business unit manager of the Nanoprobing Group at DCG Systems. “More yield issues are remaining undetected until they show up at final test — and land on the desk of the FA lab manager. The FA engineers must be equipped to localize the fault and supply images of the root cause to process or yield engineers in a timely manner. The ability to quickly and reliably localize low-resistance faults was missing before we developed EBIRCH. With the introduction of EBIRCH, we are helping to solve an FA problem that has been growing in prevalence and importance with each new device node.”

Available on DCG’s current SEM*- based nanoprobing systems, EBIRCH offers the following capabilities:

  • Detects and isolates electrical faults with resistances from < 10 ohm to > 50 Mohm;
  • Finds faults at surface and several levels below concurrently, significantly accelerating the existing work flow; and
  • Can scan areas as large as 1mm by 1mm, and zoom in to areas as small as 50nm by 50nm, providing accurate and actionable fault localization within minutes.

To collect an EBIRCH image, the operator lands two nanoprobes on surface metal layers, straddling the suspected defect site. A bias is applied, and the electron beam rasters across the region of interest. As the e-beam interrogates the defect site, localized heating from the e-beam changes the resistance of the defect, thereby changing the current sensed by the nanoprobe. The EBIRCH map displays the change in current as a function of the e-beam position—typically showing a bright spot at the site of the resistance change. The simultaneously acquired SEM image, together with knowledge of the circuit layout, allows the engineer to determine the exact defect location. The depth at which the defect lies can be explored by optimizing the landing energy as a function of the EBIRCH signal.

Available exclusively on the flexProber™, nProber™ and nProber II™ nanoprobers from DCG Systems, EBIRCH is part of an integrated electron beam current (EBC) module that offers seamless switching from EBAC to EBIRCH, with no re-cabling needed.

11/3/2015 Update: The deadline for papers has been extended to November 11, 2015

SEMI announced today that the deadline for presenters to submit an abstract for the 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is November 2. ASMC, which takes place May 16-19, 2016 in Saratoga Springs, New York, will feature technical presentations of more than 90+ peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features keynotes, a panel discussion, networking events, technical sessions on advanced semiconductor manufacturing, as well as educational tutorials.

ASMC continues to fill a critical need in our industry and provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts. Selected speakers have the opportunity to present in front of IC manufacturers, equipment manufacturers, materials suppliers, chief technology officers, operations managers, process engineers, product managers and academia. Technical abstracts are due November 2, 2015. 

This year SEMI is including two new technology areas: 3D/TSV/Interposer and Fabless Experience. SEMI is soliciting technical abstracts in these key technology areas:

  • 3D/TSV/Interposer
  • Advanced Metrology
  • Advanced Equipment Processes and Materials
  • Advanced Patterning / Design for Manufacturability
  • Advanced Process Control (APC)
  • Contamination Free Manufacturing (CFM)
  • Data Management and Data Mining Tools
  • Defect Inspection and Reduction
  • Discrete Power Devices
  • Enabling Technologies and Innovative Devices
  • Equipment Reliability and Productivity Enhancements
  • Fabless Experience
  • Factory Automation
  • Green Factory
  • Industrial Engineering
  • Lean Manufacturing
  • Yield Methodologies

Complete descriptions of each topic and author kit can be accessed at http://www.semi.org/en/node/38316. If you would like to learn more about the conference and the selection process, please contact Margaret Kindling at [email protected] or call 1.202.393.5552.   

Papers co-authored between device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing are highly encouraged. To submit an abstract, visit http://semi.omnicms.com/semi/asmc2016/collection.cgi

Technical abstracts are due November 2, 2015. To learn more about the SEMI Advanced Semiconductor Manufacturing Conference, visit http://www.semi.org/asmc2016.

Plasma-Therm announced that it has acquired an innovative High Density Radical Flux plasma technology, which enables low-temperature Bosch polymer removal.

High Density Radical Flux — HDRF® —was developed by Nanoplas France as a superior plasma process for low-temperature removal of photoresists and organic polymer residues. These capabilities are especially important for device fabrication steps in the MEMS, LED, and advanced packaging markets.

Plasma-Therm is integrating HDRF technology into its existing suite of plasma etching, deposition, and wafer-dicing products. The Nanoplas-developed HDRF low-temperature photoresist stripping capability is also applicable to Bosch polymer removal after DRIE processing.

“We are eager to make the HDRF technology available to our existing customers and potential customers,” said Ed Ostan, vice president of marketing for Plasma-Therm. “HDRF fits very well into our etch and deposition product line, because this will allow Plasma-Therm to provide multi-step solutions to specialized device manufacturers for both R&D and production use.”

Plasma-Therm will also offer ongoing support to Nanoplas customers. The Nanoplas installed baseis primarily made up of DSB 6000 and DSB 9000 HDRF systems.

HDRF enables removal of photoresist, as well as organic polymers left on trench sidewalls following DRIE processes. These applications are sought for advanced packaging, MEMS, and power devices.

HDRF systems incorporate a multi-zone, remote, inductively coupled plasma (ICP) source, which produces up to 1,000 times greater chemical concentration than a conventional ICP source.

HDRF provides better performance than wet processing and regular plasma processing in terms of selectivity, low damage, flexibility, and high-aspect-ratio efficiency. HDRF provides superior polymer removal efficiency for high-aspect-ratio (greater than 50:1) structures.

With operating temperatures lower than 80° C., and with high selectivity to TiN, Al, Au, SiO2, and Si3N4, HDRF provides damage-free residue removal for ultra-sensitive devices.

Nanoplas introduced the semi-automatic DSB 6000 system in 2008. It was followed in 2011by the fully automatic 200mm DSB 9000 system, which accommodates one or two process modules. Both systems are capable of chemical downstream etching, stripping and cleaning applications. The company also designed the HDRF300 system for advanced cleans for 3D-IC fabrication. Nanoplas customers include global companies utilizing the systems in volume production, and also R&D and pilot line facilities, company officials said.

November 2, 2015 — Tsinghua Unigroup Ltd., a Chinese government-owned chipmaker will make a $600 million investment in Powertech Technology of Taiwan, according to multiple reports. Powertech Technology, which specializes in chip packaging and testing, will hand over 25% of the company in exchange, after new shares are issued.

According to the Wall Street Journal, Powertech will use the funds to “help it expand its assembly capacity in Taiwan, develop advanced production processes and recruit talent. It would also become Tsinghua Unigroup’s major chip assembly and testing partner.”

Tsinghua is the largest chip design company in China, and earlier this year attempted to acquire Micron Technology with a $23 billion bid. That bid ultimately failed, but it hasn’t stopped Tsinghua from investing in other US companies in the industry, including Western Digital ($3.78 billion for 15%) and Hewlett-Packard’s data-networking business (51%, $2.3 billion).

This continues the unprecedented consolidation that has come to the semiconductor industry in 2015. A trend that has shown no signs of slowing as we enter 2016.

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To help readers follow this constantly changing situation, Solid State Technology is keeping a running scorecard of all the significant transactions in the semiconductor market here: Historic era of consolidation for chipmakers.

 

 

Kuala Lumpur, Malaysia and Erfurt, Germany, Nov. 2, 2015 – X-FAB Silicon Foundries, a leading More-than-Moore foundry, today announced it will expand the capacity and capabilities of its Kuching-based foundry operation, X-FAB Sarawak Sdn. Bhd., to meet accelerating demand for its core technologies – the 0.18µm and 0.35µm process platforms. With revenue having grown 25 percent for each of the past two years, and similar growth expected for the next two years, X-FAB plans to invest a total of US-Dollar 114 million between 2015 and 2017. This includes capex spending amounting to US-Dollar 29 million in the current year.

X-FAB Group with its clear focus on automotive, industrial, and medical applications has transitioned X-FAB Sarawak from a manufacturing facility for commodity-type products into a high-value-add business for products with a long life cycle. Since it became part of the X-FAB Group in 2006, the site in Kuching has undergone a complete change in most of its technology portfolio, its application focus, its customer base, product life cycles and quality systems.

YB. Dato’ Sri Mustapa Mohamed, Minister of International Trade and Industry said, ”We are very excited that X-FAB Sarawak, one of the two pure-play semiconductor wafer foundries in Malaysia, continues to be at the forefront of our local semiconductor manufacturing industry.  The decision made by X-FAB to expand its operation in Malaysia is testament to the country’s strong economic fundamentals and the capabilities of our local talent.”

“X-FAB’s operation in Sarawak has been driving the growth of local economy. They are employing more than 1,000 staff where more than 80 percent of them are considered to be high income earners. We believe that this expansion will act as a catalyst in attracting other high technology firms to establish their operations in Malaysia as they will be able to leverage on the wafer fabrication services provided by X-FAB,” he added.

“The State of Sarawak as a major shareholder is very satisfied with the recent development of both the X-FAB Group and, more specifically, the profitable growth of X-FAB Sarawak, said Dato’ Seri Tarmizi Hj. Sulaiman, Chairman of the Board of X-FAB Silicon Foundries SE. “We are pleased that X-FAB Sarawak developed from a small nucleus into a competitive industrial enterprise with the competence and help of X-FAB.”

Rudi De Winter, CEO of X-FAB Group said, “We are looking back at nine years of successful conversion and expansion of our Sarawak foundry operation. During this period, we changed the digital business into a more future-oriented business with our complex analog/mixed-signal technologies. These technologies primarily used for automotive, industrial and medical applications enabled us to build a stable and sustainable customer base. In 2016, we expect X-FAB Sarawak for the first time to represent more than 50 percent of X-FAB Group’s total revenue.”

Mike Young, CEO of X-FAB Sarawak, added, “I am very impressed by the site’s evolution over the past several years and the success we accomplished thanks to the dedication and commitment of all our employees here at X-FAB Sarawak. Our continuous efforts to excel have paid off, as confirmed by the two awards we received in 2015 for our outstanding HR achievements, namely ‘The Prime Minister’s Award for Excellence in Human Resources’ and ‘The 1Malaysia Employer Award for Big Companies.'”