Yearly Archives: 2015

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October 20, 2015

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By Tom Abate, Stanford Engineering

Stanford chemical engineering Professor Zhenan Bao and her team have created a skin-like material that can tell the difference between a soft touch and a firm handshake. The device on the "golden fingertip" is the skin-like sensor developed by Stanford engineers.

Stanford chemical engineering Professor Zhenan Bao and her team have created a skin-like material that can tell the difference between a soft touch and a firm handshake. The device on the “golden fingertip” is the skin-like sensor developed by Stanford engineers. (Photo: Bao Lab, Stanford)

Stanford engineers have created a plastic “skin” that can detect how hard it is being pressed and generate an electric signal to deliver this sensory input directly to a living brain cell.

Zhenan Bao, a professor of chemical engineering at Stanford, has spent a decade trying to develop a material that mimics skin’s ability to flex and heal, while also serving as the sensor net that sends touch, temperature and pain signals to the brain. Ultimately she wants to create a flexible electronic fabric embedded with sensors that could cover a prosthetic limb and replicate some of skin’s sensory functions.

Bao’s work, reported today in Science, takes another step toward her goal by replicating one aspect of touch, the sensory mechanism that enables us to distinguish the pressure difference between a limp handshake and a firm grip.

“This is the first time a flexible, skin-like material has been able to detect pressure and also transmit a signal to a component of the nervous system,” said Bao, who led the 17-person research team responsible for the achievement.

Benjamin Tee, a recent doctoral graduate in electrical engineering; Alex Chortos, a doctoral candidate in materials science and engineering; and Andre Berndt, a postdoctoral scholar in bioengineering, were the lead authors on the Science paper.

Digitizing Touch

Stanford sensor closeup

A closeup of the sensor. (Photo: Bao Lab, Stanford)

The heart of the technique is a two-ply plastic construct: the top layer creates a sensing mechanism and the bottom layer acts as the circuit to transport electrical signals and translate them into biochemical stimuli compatible with nerve cells. The top layer in the new work featured a sensor that can detect pressure over the same range as human skin, from a light finger tap to a firm handshake.

Five years ago, Bao’s team members first described how to use plastics and rubbers as pressure sensors by measuring the natural springiness of their molecular structures. They then increased this natural pressure sensitivity by indenting a waffle pattern into the thin plastic, which further compresses the plastic’s molecular springs.

To exploit this pressure-sensing capability electronically, the team scattered billions of carbon nanotubes through the waffled plastic. Putting pressure on the plastic squeezes the nanotubes closer together and enables them to conduct electricity.

This allowed the plastic sensor to mimic human skin, which transmits pressure information to the brain as short pulses of electricity, similar to Morse code. Increasing pressure on the waffled nanotubes squeezes them even closer together, allowing more electricity to flow through the sensor, and those varied impulses are sent as short pulses to the sensing mechanism. Remove pressure, and the flow of pulses relaxes, indicating light touch. Remove all pressure and the pulses cease entirely.

The team then hooked this pressure-sensing mechanism to the second ply of their artificial skin, a flexible electronic circuit that could carry pulses of electricity to nerve cells.

Importing the Signal

Bao’s team has been developing flexible electronics that can bend without breaking. For this project, team members worked with researchers from PARC, a Xerox company, which has a technology that uses an inkjet printer to deposit flexible circuits onto plastic. Covering a large surface is important to making artificial skin practical, and the PARC collaboration offered that prospect.

Finally the team had to prove that the electronic signal could be recognized by a biological neuron. It did this by adapting a technique developed by Karl Deisseroth, a fellow professor of bioengineering at Stanford who pioneered a field that combines genetics and optics, called optogenetics. Researchers bioengineer cells to make them sensitive to specific frequencies of light, then use light pulses to switch cells, or the processes being carried on inside them, on and off.

For this experiment the team members engineered a line of neurons to simulate a portion of the human nervous system. They translated the electronic pressure signals from the artificial skin into light pulses, which activated the neurons, proving that the artificial skin could generate a sensory output compatible with nerve cells.

Optogenetics was only used as an experimental proof of concept, Bao said, and other methods of stimulating nerves are likely to be used in real prosthetic devices. Bao’s team has already worked with Bianxiao Cui, an associate professor of chemistry at Stanford, to show that direct stimulation of neurons with electrical pulses is possible.

Bao’s team envisions developing different sensors to replicate, for instance, the ability to distinguish corduroy versus silk, or a cold glass of water from a hot cup of coffee. This will take time. There are six types of biological sensing mechanisms in the human hand, and the experiment described in Science reports success in just one of them.

But the current two-ply approach means the team can add sensations as it develops new mechanisms. And the inkjet printing fabrication process suggests how a network of sensors could be deposited over a flexible layer and folded over a prosthetic hand.

“We have a lot of work to take this from experimental to practical applications,” Bao said. “But after spending many years in this work, I now see a clear path where we can take our artificial skin.”

SITRI, the innovation center for accelerating the development and commercialization of “More than Moore” (MtM) solutions to power the Internet of Things (IoT), today announced the opening of SITRI Innovations in Belmont, California. This new kind of hardware accelerator was launched into the Bay Area’s rich technology ecosystem during a recent event attended by many of Silicon Valley’s leading investors, technologists, entrepreneurs, and incubators.

SITRI Innovations addresses a gap that exists in the current “More than Moore” and IoT innovation ecosystem and provides a path for new entrepreneurs in the hardware space to bring their ideas to fruition. “More than Moore” is the next wave of semiconductor innovations such as MEMS, Sensors, Optoelectronics, RF, Bio, and micro-Energy that do not depend on feature-size driven CMOS technology (the “Moore’s Law”). The first of its kind for “More than Moore” and IoT hardware startups, SITRI provides entrepreneurs a full spectrum of services and resources designed to help them succeed in their development and commercialization phases.

“The Internet of Things represents a vast opportunity and ‘More than Moore’ technologies are at the heart of it,” said Charles Yang, CEO of SITRI Group. “However, the MtM silicon innovations needed requires a fusion of multi-disciplinary technologies which raises a new set of challenges in engineering and manufacturing, leaving the market open to only the largest and most sophisticated companies. SITRI Innovations addresses this by speeding up MtM innovation and commercialization, opening the IoT market to a much broader range of players and their ideas.”

By tapping into the global ecosystem for the MtM industry, SITRI Innovations can provide startups with the resources of large corporations to access the R&D platform and critical supply chain partners needed to achieve high efficiency and fast time to market. SITRI’s unique 360-degree platform offers support to the startups in all areas, from proof of concept to engineering to fab to market studies and industry supply chain.

“As a leading factor in the transition to the ‘More than Moore’ era, MEMS represent a huge future opportunity in the consumer, mobile, wearables, healthcare, biotech, and IoT markets,” said Dr. Kurt Peterson of the Silicon Valley Band of Angels, a veteran in the semiconductor and MEMS industry. “By serving as an innovation catalyst to the ‘More than Moore’ community, SITRI will be a key element in the future growth of the MEMS industry as well as the overall semiconductor market.”

“China is playing a vital part in the development of IoT and this is evident by the significant investment in creating a Shanghai technology cluster where SITRI is located,” said Jérémie Bouchaud, Senior Director, MEMS & Sensors at IHS. “SITRI plays a key role in fostering MEMS and sensor innovation in China to enable new IoT applications. By opening this new office, SITRI replicates the accelerator model of Shanghai and bridges innovation between China and Silicon Valley.”

A group of venture funds will be co-located with SITRI Innovations in its Belmont, California, offices including SummitView Capital, SVC Angel, Tsing Capital, Nautilus Ventures, TEEC Angel Fund, Oriza Ventures, Cenova Ventures, Magic Stone Alternative Investments, Cybernaut Investment, and Jiading Ventures.

We are in a historic era for consolidation among semiconductor manufacturers. Included in the announced mergers and acquisitions this year alone are:

Semiconductor Market Consolidation. (Slide from: Dr. Rutger Wijburg, Sr. Vice President and General Manager, GLOBALFOUNDRIES; keynote at Semicon Europa

Semiconductor Market Consolidation. (Slide from: Dr. Rutger Wijburg, Sr. Vice President and General Manager, GLOBALFOUNDRIES; keynote at Semicon Europa)

According to a recent article in the Wall Street Journal by Don Clark, the reasons for this market consolidation are relatively new to the industry: slowing growth and rising costs.

In the past, chip makers used acquisitions to obtain new technology. But, Clark writes that a different reason is becoming more prominent: “Many recent deals resemble consolidation waves in older industries, motivated mainly by trimming costs in areas like manufacturing, sales and engineering.”

For example, Avago projects that it can gain $750 million in annual savings starting in 2017 after it integrates Broadcom, according to Clark.

The article cites figures from Dealogic stating that the industry has seen $100.6 Billion in mergers and acquisitions in 2015 so far, compared to $37.7 Billion for all of 2014.

And that total is poised to go higher.

“Bloomberg reported last week that four chip companies — Analog Devices Inc., Maxim Integrated Products Inc., SanDisk Corp. and Fairchild Semiconductor International Inc. — were in talks concerning different deal options… ‘It’s buy or be sold,’ summed up Alex Lidow, chief executive of Efficient Power Conversion Corp., a startup he co-founded in 2007 after 30 years leading chip maker International Rectifier Corp,” Clark writes.

In the early 90s Siborg Systems Inc. released MicroTec: a semiconductor device and process simulator that has become used by more than 140 Universities and more than 40 semiconductor companies for computationally extensive simulations. Siborg has recently made a new version available particularly targeting educational use of the software. Examples are created for a few popular semiconductor process and device text books including “Solid State Electronic Devices” by Ben Streetman, Sanjay Banerjee, Pearson Education, March 9, 2014; “Modern Semiconductor Devices for Integrated Circuits” by Chenming C. Hu, Pearson Education, March 22, 2009; and “Fabrication Engineering at the Micro- and Nanoscale” by Stephen A. Campbell, Oxford University Press, September 5, 2007.

Microtec is a significantly simplified semiconductor TCAD tool while still being a powerful modeling tool for industrial semiconductor process/device design. It is an efficient tool for computationally extensive simulations arising in modeling of power semiconductor devices with large dimensions, and is particularly useful for devices made of SiC, GaN and other materials with a wide bandgap.

The program was widely used in education, including Universities such as UC Berkeley, Waseda University, Tokyo Institute of Technology, and the University of Waterloo; it allows students to learn basic ideas about the modern semiconductor device design in a realistic model environment and create their own virtual devices using realistic process flow and test their performance. MicroTec is an easy-to-use simplified TCAD tool that can be learned Microtec within a few hours while still offering robustness and realistic semiconductor process and device simulation. The program also is an asset to those who need to understand the physics of semiconductor devices without knowing much about computers or numerical methods and who do not have much time for learning new process/device simulation tools.

A simplified limited version of MicroTec semiconductor device simulator was also published by John Wiley and Sons, 2000-02-08, in “Semiconductor Devices Explained: Using Active Simulation”, by Ton Mouthaan, Professor of the Twente University in the Netherlands.

MicroTec is able to simulate 2D silicon process modeling including epitaxy, oxidation, diffusion and implantation and 2D steady-state semiconductor device simulation including SOI-MOSFET, MOSFET, BJT, JFT,IGBT, DMOS, Schottky devices, Solar Cells, etc.

Based on the diffusion-drift model, Microtec employs finite difference technique on a rectangular, automatically generated mesh.

One of the features of MicroTec is the ability to run on virtually any PC. Being a true 32-bit application for Windows, MicroTec needs very little RAM allocation. With no memory threshold, the program can be even be run on computers with only a few Mbytes of memory if a modest number of mesh nodes is used. Typical simulation only take minutes of CPU time on a regular PC.

Microtec includes three main software tools:

  • SiDif for 2D semiconductor process simulation including implantation, diffusion, oxidation and epitaxy
  • SemSim for steady-state 2D semiconductor device simulation
  • SiBGraf for 2D and 1D graphics

Microsemi Corporation a provider of semiconductor solutions differentiated by power, security, reliability, and performance, today announced that it submitted an offer to acquire PMC-Sierra, Inc in a cash and stock transaction. Based on the closing stock price of Microsemi on Oct. 16, 2015, the transaction is valued at $11.50 per PMC share, representing a premium of approximately 50 percent to the closing price on Oct. 5, 2015, the last trading day prior to the announcement of PMC’s proposed acquisition with Skyworks Solutions, Inc.

Microsemi believes its cash and stock proposal would provide PMC shareholders with a substantial premium and immediate cash value, as well as the opportunity to participate in the significant upside potential of a global analog and mixed-signal leader with a highly diversified platform for growth and profitability. Microsemi believes its proposal constitutes a “Superior Proposal” under the terms of PMC’s merger agreement with Skyworks.

Under the terms of Microsemi’s proposal, PMC shareholders will receive $8.75 in cash and 0.0736 of a share of Microsemi common stock for each share of PMC common stock held at the close of the transaction. The implied total transaction value is approximately $2.4 billion and the implied enterprise value is $2.2 billion, net of PMC’s net cash balance as of June 27, 2015.

“Based on extensive discussions with PMC over the past 18 months and comprehensive analysis, we believe this transaction offers compelling strategic and financial benefits for the shareholders of both Microsemi and PMC,” said James J. Peterson, Microsemi’s chairman and CEO. “This acquisition will provide Microsemi with a leading position in high performance and scalable storage solutions targeted for data center and cloud applications, while also adding a complementary portfolio of high-value communications products. Microsemi has a strong track record of integrating acquisitions and driving profitability, and we will benefit from increased scale, industry-leading margins, diversified market exposure, consolidated infrastructure and substantial cost savings in a combination with PMC.”

The proposal was conveyed in an offer letter to PMC’s board of directors on Oct. 19, 2015, together with a copy of a merger agreement, which is on substantially the same terms as the Skyworks merger agreement that Microsemi is prepared to sign. Microsemi is also prepared to amend the transaction structure to an “exchange offer” paving the way for a closing as early as late December 2015, assuming swift action by PMC’s board. Microsemi’s proposal is not subject to any financing contingency and has been approved by Microsemi’s board of directors.

The transaction is expected to be immediately accretive to Microsemi’s non-GAAP EPS and free cash flow. Microsemi anticipates achieving more than $100 million in annual cost synergies with greater than $75 million of those to be realized in the first full quarter of combined operations. Microsemi currently estimates more than $0.60 of non-GAAP EPS accretion in the first full year after closing the transaction.

Microsemi intends to fund the transaction and repay its existing credit facility with existing cash, $2.7 billion in new transaction debt and $0.6 billion in Microsemi common stock. Shareholders of Microsemi and PMC will own approximately 85 percent and 15 percent, respectively, of the combined entity post completion of the transaction.

The transaction with Microsemi will only be subject to domestic regulatory approvals (as opposed to approvals by foreign government entities including China, which is required under the Skyworks merger agreement and likely to result in additional uncertainty and delays) and customary closing conditions, as well as the approval of PMC’s shareholders.

German chemical company Evonik Industries AG and Japanese FPD production equipment manufacturer SCREEN Finetech Solutions Co., Ltd. have signed a contract for a strategic partnership in order to offer best performance of perfectly matched iXsenic (R) semiconductor material, equipment, and process.

iXsenic is a solution-processable inorganic metal oxide semiconductor which is applied under ambient conditions. No vacuum environment is needed which results in process simplifications, high yield and cost advantages. iXsenic is best applied via slot-die coating.

The Japanese company SCREEN Finetech Solutions Co., Ltd. provides a wide range of equipment and services for the FPD industry including high-quality coating machines like slot-die/slit coater (Linearcoater*). In the FPD industry SCREEN FT is the global technology and market leader for such equipment. Evonik and SCREEN FT have been running application tests with iXsenic on Linearcoater for years. Now they have signed a contract for a strategic partnership to jointly promote the iXsenic technology. “With SCREEN FT we have found the perfect partner”, says Prof. Ralf Anselmann, Vice President at Evonik. “The advantages are obvious: Evonik offers the semiconductor iXsenic, SCREEN FT provides the production equipment. Thus, material, equipment and process can be perfectly matched to the customer’s needs. With this setup we will offer optimal service and performance to our customers.”

Material layers like photo resists are already coated today in the Electronics industry but semiconductive layers are normally applied via vapor deposition (CVD or PVD). With the solution-processable iXsenic material it is now possible to coat the semiconductor. “With our partnership we expect faster and easier integration of the iXsenic technology at the customer’s site including higher reliability for mass production” comments Mitsumasa Kodama, Deputy General Manager at SCREEN Holdings. “And not to forget: with perfectly matched material and equipment mobilities above 10 cm²/Vs are not just a champion’s value but reality.”

The strategic partnership of Evonik and SCREEN FT is the consequent next step to strengthen the commercialization of the iXsenic technology.

UCLA professor Yang Yang, member of the California NanoSystems Institute, is a world-renowned innovator of solar cell technology whose team in recent years has developed next-generation solar cells constructed of perovskite, which has remarkable efficiency converting sunlight to electricity.

Despite this success, the delicate nature of perovskite — a very light, flexible, organic-inorganic hybrid material — stalled further development toward its commercialized use. When exposed to air, perovskite cells broke down and disintegrated within a few hours to few days. The cells deteriorated even faster when also exposed to moisture, mainly due to the hydroscopic nature of the perovskite.

Now Yang’s team has conquered the primary difficulty of perovskite by protecting it between two layers of metal oxide. This is a significant advance toward stabilizing perovskite solar cells. Their new cell construction extends the cell’s effective life in air by more than 10 times, with only a marginal loss of efficiency converting sunlight to electricity.

The study was published online Oct. 12 in the journal Nature Nanotechnology. Postdoctoral scholar Jingbi You and graduate student Lei Meng from the Yang Lab were the lead authors on the paper.

“There has been much optimism about perovskite solar cell technology,” Meng said. In less than two years, the Yang team has advanced perovskite solar cell efficiency from less than 1 percent to close to 20 percent. “But its short lifespan was a limiting factor we have been trying to improve on since developing perovskite cells with high efficiency.”

Yang, who holds the Carol and Lawrence E. Tannas, Jr., Endowed Chair in Engineering at UCLA, said there are several factors that lead to quick deterioration in normally layered perovskite solar cells. The most significant, Yang said, was that the widely used top organic buffer layer has poor stability and can’t effectively protect the perovskite layer from moisture in the air, speeding cell degradation.  The buffer layers are important to cell construction because electricity generated by the cell is extracted through them.

Meng said that in this study the team replaced those organic layers with metal oxide layers that sandwich the perovskite layer, protecting it from moisture. The difference was dramatic. The metal oxide cells lasted 60 days in open-air storage at room temperature, retaining 90 percent of their original solar conversion efficiency. “With this technique perfected we have significantly enhanced the stability.”

The next step for the Yang team is to make the metal oxide layers more condensed for better efficiency and seal the solar cell for even longer life with no loss of efficiency. Yang expects that this process can be scaled up to large production now that the main perovskite problem has been solved.

This research is a joint project with National Cheng Kung University in Taiwan. This research was supported by the National Science Foundation, the U.S. Air Force Office of Scientific Research and the Ministry of Science and Technology in Taiwan.

New S$150 million joint investment is expected to create 60 jobs for highly skilled scientists, engineers and researchers.

SINGAPORE, October 19, 2015 – Applied Materials, Inc. today announced it plans to establish a new R&D laboratory in Singapore in collaboration with the Agency for Science, Technology and Research (A*STAR). The S$150 million joint investment will focus on developing advanced semiconductor technology to fabricate future generations of logic and memory chips.

The S$150 million joint lab will be housed within A*STAR’s new R&D cluster at Fusionopolis Two and will feature a 400 square meter Class 1 cleanroom with state-of-the-art semiconductor process equipment that has been custom designed and built by Applied Materials. The facility will be staffed by 60 highly skilled researchers and scientists, working together with extended research teams at A*STAR’s other research institutes.

The joint lab combines Applied Materials’ leading expertise in materials engineering with A*STAR’s multi-disciplinary R&D capabilities. A*STAR’s Institute of Microelectronics (IME), Institute of Materials Research and Engineering (IMRE), and Institute of High Performance Computing (IHPC) will contribute to research in low-defect processing, ultra-thin film materials, materials analysis and characterization, and modelling and simulation in many areas. The joint lab is also supported by The Singapore Economic Development Board, and is in line with its efforts to promote leading-edge R&D and advanced manufacturing activities. The intention is for products developed by the joint lab to be manufactured by Applied Materials in Singapore. In addition, Applied Materials plans to conduct experiments on the synchrotron at the Singapore Synchrotron Light Source (SSLS) and work with the National University of Singapore where a new beamline for semiconductor applications is to be developed. Funding for the construction of the new beamline is supported by the National Research Foundation.

Mr. Gary Dickerson, President and Chief Executive Officer of Applied Materials, Inc., said, “A*STAR and the government of Singapore have been great R&D partners for Applied Materials. We are excited to expand our collaboration to develop advanced semiconductor technology for extending Moore’s Law. Applied Materials’ leading expertise in materials engineering can help solve the challenges of producing future generations of logic and memory chips.”    

Mr. Lim Chuan Poh, Chairman, A*STAR, said, “This collaboration will catalyse the development of emerging technologies for the global electronics market and advance Singapore’s position as a key R&D hub for the industry. The joint lab reaffirms A*STAR’s multi-disciplinary R&D capabilities to drive innovation in the electronics sector, a key growth area for Singapore’s economy, and will generate further economic value through the creation of good jobs.”

“The joint lab will strengthen capabilities for Applied Materials in Singapore, as we expand from advanced manufacturing to early stage R&D and designing global products,” said Mr. Russell Tham, Corporate Vice President & Regional President South East Asia, Applied Materials, Inc. “Successful public-private partnerships, leveraging complementary strengths, help create new forms of value from Singapore and keep the local industry competitive.”

Prof. Raj Thampuran, Managing Director, A*STAR, said, “The new joint lab takes the longstanding collaboration between Applied Materials and A*STAR to the next level, and will marshal our combined strengths in research, development, innovation and industrial applications. This technology will pioneer new processes and techniques to advance the fabrication of semiconductor devices.”

The new joint lab marks Applied Materials’ second collaboration with A*STAR. In 2012, Applied and A*STAR’s IME formed a Center of Excellence in Advanced Packaging in Singapore to develop advanced 3D chip packaging technology.

Perovskite solar cells are the rising star in photovoltaics. They absorb light across almost all visible wavelengths, they have exceptional power conversion efficiencies exceeding 20% in the lab, and they are relatively easy to fabricate. So, why are perovskite solar cells yet to be found on the top of our roofs? One problem is their overall cost, and another is that cheaper perovskite solar cells have a short lifespan. A study published in Advanced Materials Interfaces  by the Energy Materials and Surface Sciences Unit at the Okinawa Institute of Science and Technology Graduate University (OIST), reveals a cause for the short lifetime of perovskite solar cells with silver electrodes.

Currently, the most common electrode material in perovskite solar cells is gold, which is extremely expensive. A low-cost alternative to gold is silver, around 65 times cheaper. To keep the cost even lower, the team wants to use solution-processed method to fabricate the layers of the solar cell, instead of expensive vacuum-based techniques. The problem of using silver electrodes and the solution-based method is that silver gets corroded within days of the solar cell fabrication. The corrosion makes the electrode turn yellow, and reduces the efficiency of the cell. The OIST team, headed by Prof. Yabing Qi, has demonstrated the cause of this degradation and proposed an explanation.

Flexible perovskite solar cell device before (top) and after (bottom) corrosion of the silver electrode (Energy Materials and Surface Sciences Unit, OIST). The device was prepared by Dr. Mikas Remeika.

Flexible perovskite solar cell device before (top) and after (bottom) corrosion of the silver electrode (Energy Materials and Surface Sciences Unit, OIST). The device was prepared by Dr. Mikas Remeika.

Perovskite solar cells are composed of a sandwich of layers that work together to transform light into electricity. Light is absorbed by the perovskite material and stimulates electron excitations, generating the so-called electron-hole pairs. In simple terms: when electrons are excited, they “jump and leave holes behind.” Excited electrons and holes are transported in opposite directions by the adjacent layers of the solar cells, comprising of an electron-transport titanium dioxide layer, a spiro-MeOTAD hole-transport layer (HTL), a glass layer coated with a transparent conductive material, and a silver top electrode. The whole mechanism generates current, but it needs the correct functioning of each layer of the solar cell in order to work efficiently. “If one layer fails, the whole solar cell will suffer,” explains Luis Ono, a staff scientist and group leader in Prof. Qi’s unit.

In this study, the team analyzed the composition of the corroded silver electrode and identified the formation of silver iodide as the reason for the electrode corrosion. The color change was due to the oxidation from silver to silver iodide. They also found that exposure to air accelerates the corrosion, when compared to dry nitrogen gas exposure.

The team proposed a mechanism for this damage: silver iodide forms because gas molecules from ambient air reach the perovskite material and degrade it forming iodine containing compounds. These iodine-containing compounds diffuse to the silver electrode and corrode it. The migration of both air molecules and iodine-containing compounds could happen through small pinholes present in the spiro-MeOTAD HTL layer (see animation). The pinholes present in the spiro-MeOTAD HTL layer produced with the solution-processed method were identified some months ago by Zafer Hawash, a PhD student in the same laboratory.

Replacing gold with silver and using the solution-processed method are key to bringing down the cost of the solar cells. The OIST team believes that understanding the corrosion mechanism is the first step in increasing the electrode lifetime. Since preventing the formation of pinholes in the spiro-MeOTAD HTL layer is essential for a longer cell lifetime, the team is also working on producing pinhole-free solar cells with the solution-process method, while the production of pinhole-free HTL with the vacuum-based method has already been published by the same group. “Perovskite-based solar cells show potential for commercial use as the next generation photovoltaic technology. Our goal is to design and fabricate large-area and low-cost photovoltaic modules with extended lifetime by employing appropriate HTLs and encapsulation materials,” explains Qi.