The mobile sector is driving production and market growth; however a new market driver, IoT is on the horizon and is expected to have a significant impact on the advanced packaging industry.
“IoT driven semiconductor industry consolidation, is reflecting into a highly dynamic advanced packaging landscape,” commented Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging & Semiconductor Manufacturing at Yole Développement.
And he added: “Numerous packaging options developed by the industry leaders, are being explored as new IoT applications arise.”
In parallel, Yole Développement’ analysts highlight the noteworthy demand for advanced packaging solutions and the increasing number of shipped wafers: focus is turning to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
Yole Développement (Yole), the “More than Moore” market research and strategy consulting reinforces its market positioning within the advanced packaging area with the release of its first report “Status of the Advanced Packaging Industry”. This first edition brings a thorough analysis including dynamics and disruptions of the market, market forecasts per packaging platform and device type from 2014 to 2020, market shares…This analysis also presents a detailed analysis of the advanced packaging supply chain, financial evolutions and mergers & acquisitions. Yole’s advanced packaging team proposes a packaging technology segmentation and highlights with this new analysis, the impact of Internet of Things and the adoption of 2.5D/3D, Fan-Out and Fan-In solutions.
“A transformation of the semiconductor industry is under way,” said Andrej Ivankovic, Yole. “Advanced packaging is part of the scaling and functionality roadmaps.”
The latest events in the technology market indicate that 2015 marks the beginning of an exciting new era for the IT and electronics industry. At semiconductor supply chain level, the industry entered a profound consolidation phase with high M&A activity reshaping the business landscape. FEOL device scaling and related cost reduction are deviating from the path they followed for the past few decades, with Moore’s law in its foundation. Advanced nodes do not bring the desired cost benefit anymore and R&D investments in new lithography solutions and devices below 10nm nodes are rising substantially.
As the smartphone market matures, new forces are appearing in the form of IoT. While the mobile sector continues to drive the market, the scent of IoT is already spreading in the consumer sector with products such as wearables and first smart home appliances. IoT market, application and technology segmentation has begun. Companies across the industry are restructuring, merging and acquiring in order to adjust their portfolio, enable a complete platform offer and establish leading positions on the market.
Yole’s advanced packaging analysts also identified other market dynamics. They announced:
• The foundry involvement is no longer a dent in advanced packaging production.
• Increased activity of Chinese capital on the market.
• And more
At the level of technology, as profitability of FEOL scaling options remains uncertain and IoT promises application diversification, the spotlight is now turning to advanced packages for cost reduction, performance boost and functional integration.
In order to answer market demands, the advanced packaging segment focuses on integration and WLP. Emerging packages such as Fan-Out WLP, 2.5D/3D IC and related System-in-Package solutions aim to bridge the gap and revive the cost/performance curve.
How will the advanced packaging industry evolve, which changes in the semiconductor supply chain are taking place and which packaging technologies will be most critical in the years to come? Yole proposes with this new technology and market analysis, a deep understanding of the advanced packaging technical and market challenges. Under this new report, the market research and strategy consulting company brings a thorough analysis of the advanced packaging industry and its future development covering platforms Fan-Out WLP, Fan-In WLP, Flip Chip and 2.5D / 3D.