STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, today announced that it has been honored with the “Supplier of the Year” award from Inphi Corporation, a provider of high-speed, mixed-signal semiconductor solutions for the communications, computing and data center markets.

“With the rapidly increasing volumes of data moving through cloud-based architectures, Inphi strives to provide our customers with reliable, high performance memory interconnect solutions that are cost competitive in the market,” Dr. Ron Torten, Senior Vice President of Operations and Information Technology, Inphi. “STATS ChipPAC delivered exceptional manufacturing performance, quality and responsiveness during this past year which was key to meeting our product and time-to-market goals. We appreciate their commitment to Inphi and commend them for a job well done.”

“Our close collaboration with STATS ChipPAC has ensured that Inphi was successful in delivering new DDR4 interconnect technology that achieves higher memory speeds and capacity, lower power consumption and greater signal integrity for next-generation data centers worldwide,” said Ramanan Thiagarajah, Vice President of Product and Test Engineering, Inphi. “STATS ChipPAC’s deep knowledge of advanced semiconductor packaging and test has been a competitive advantage to Inphi as we develop innovative solutions to meet our customers’ big data requirements.”

Inphi’s memory interconnect products satisfy the growing demand for higher performance, higher bandwidth and improved data transmission in enterprise/cloud computing applications. Inphi utilizes STATS ChipPAC’s fcCuBE technology to achieve the high performance, high processing speeds and increased reliability in semiconductor solutions for next-generation cloud computing networks.

“It is an honor to be named Inphi’s Supplier of the Year. We are excited to be working with Inphi on their memory interconnect products for the rapidly growing and evolving cloud computing market,” said Hal Lasky, Executive Vice President and Chief Sales Officer, STATS ChipPAC. “We are pleased that our fcCuBE technology has proven once again to be a scalable technology that cost effectively addresses the increasing performance, bandwidth and speed requirements in the industry.”