Date: May 10, 2016 at 1 PM ET
Free to attend
Length: Approximately one hour
In order to adapt to new applications and cut down cost, the semiconductor industry seeks further performance and functionality boosts through package level system integration. While transistor scaling options remain uncertain in the shorter term and continue to be investigated, the spotlight is turned to advanced packages. Emerging packages such as fan-out wafer level packages, 2.5D/3D IC solutions and related SiPs together with upgraded flip chip CSP/BGAs aim to bridge the gap and revive the cost/performance curve while at the same time adding more functionality.
This webcast will focus on the status of the advanced packaging industry, the challenges and opportunities that lie ahead. A high level overview will be given on current and future global markets, with a particular reflection on the evolution of the market in China. Furthermore, 3D integration packaging technology developments will be summarized, with focus on the 2.5D/3D, FO WLP and advanced FC substrate platforms.
Andrej Ivankovic is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement. He holds a master’s degree in Electrical Engineering, with specialization in Industrial Electronics from the University of Zagreb, Croatia and a PhD in Mechanical Engineering from KU Leuven, Belgium. He started as an intern at ON Semiconductor performing reliability tests, failure analysis and characterization of power electronics and packages. The following 4 years he worked as a R&D engineer at IMEC Belgium on the development of 3D IC technology, focusing on electrical and thermo-mechanical issues of 3D stacking and packaging. Part of this time he also worked at GLOBALFOUNDRIES as an external researcher. He has regularly presented at international conferences authoring and co-authoring 18 papers and 1 patent.
Mr. Kelly joined Amkor in 2005 and has led package developments for EMC shielding, low cost thermal enhancements for PBGAs, image sensors and most recently 2.5D and SLIM package development. He previously worked for HP and Avago. Mike has worked in electronics interconnect for 24 years, including circuit board assembly, IC package mechanical and thermal design and projects ranging from polyester flexible circuits to eutectic flip chip, and management of IC IP block design and acquisition and electrical signal integrity teams. Mike holds master’s degrees in Mechanical and Chemical Engineering.
Sponsored by Brewer Science
Brewer Science is a global technology leader in developing and manufacturing innovative materials, processes, and equipment for the fabrication of semiconductors and microelectronic devices. In 1981, Brewer Science revolutionized lithography processes with its invention of Brewer Science® ARC® anti-reflective coatings. Today, Brewer Science continues to expand its technology portfolio to include products that enable advanced lithography, 3-D integration, chemical and mechanical device protection, nanotechnology, and thin wafer handling.
Brewer Science was one of the first companies to recognize the potential of temporary wafer bonding for ultrathin wafer handling. Temporary bonding is key as the semiconductor industry pushes for smaller devices, faster processing, and lower costs. The industry is moving toward thinner and larger-area substrates that can handle higher stress levels and more extreme temperature conditions, such as higher-temperature processing and lower-temperature bonding and debonding. Brewer Science offers advanced material and equipment sets for low-volume R&D environments and works with leading equipment vendors to provide fully automated solutions for higher-volume needs. By listening to customer needs and following industry advancements, Brewer Science has created the highest-quality temporary bonding products possible.
ARC is a registered trademark of Brewer Science, Inc.