Metrology Challenges and Opportunities

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Date: Thursday, April 14, 2016 at 1:00 p.m. ET

Free to attend

Length: Approximately one hour

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Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and characterization.  As the industry continues to explore new patterning methods, new phenomena further challenge metrology and characterization including pitch walking, stress relaxation in multilayer fins, and new device designs.   New materials continue to be explored for transistor and interconnect applications.  Here, the challenges facing materials characterization highlight the issues that will face in-line metrology when these materials transition to manufacturing.


Alain Diebold 2015Alain Diebold, Interim Dean, College of Nanoscale Sciences

Alain Diebold is Interim Dean at the College of Nanoscale Sciences.  He is also the Director of the SRC NRI INDEX Center.  He is a fellow of the American Vacuum Society and SPIE as well as a senior member of the IEEE. He is an associate editor for IEEE’s Transactions on Semiconductor Manufacturing. Before moving to Albany, Alain was a Senior Fellow at SEMATECH.  Prior to moving to Austin, He was a senior chemist at Allied Signal in Morristown, NJ. Alain received his PhD from Purdue University in 1979.

Sponsored by Park Systems

Park Systems provides the best quality AFM equipment for manufacturing and research in Semiconductor microscopy for failure analysis and defect review. Park Systems has introduced the revolutionary Park 3DM Series, the completely automated AFM system designed for overhang profiles, high-resolution sidewall imaging, and critical angle measurements. With the patented decoupled XY and Z scanning system with tilted Z-scanner, it overcomes the challenges of the normal and flare tip methods in accurate sidewall analysis.   Park NX-Hivac allows failure analysis engineers to improve the sensitivity of their measurements through high vacuum Scanning Spreading Resistance Microscopy (SSRM).  Park Smart ADR is the most advanced defect review solution available, featuring automatic target positioning without the need for labor intensive reference marks that often damage the sample. The Smart ADR process improves productivity by up to 1,000% compared to traditional defect review methods and offers up to 20x longer tip life thanks to Park’s groundbreaking True Non-Contact™ Mode AFM technology.

Park NX-Wafer makes accurate, repeatable, and reproducible sub-Angstrom roughness measurements for the flattest substrates and wafers with minimized tip-to-tip variation.  Park NX-Wafer delivers the industry’s lowest noise floor of less than 0.5 throughout the wafer area, combined with True Non-Contact Mode™ to achieve reliable measurements even for the long-range waviness measurement of scan sizes up to 100m x 100m.

Park Systems, is a world-leading manufacturer of atomic force microscopy (AFM) systems offering a complete range of products for researchers and industry engineers in chemistry, materials, physics, life sciences, semiconductor and data storage industries, used by over a thousand leading institutions and corporations worldwide. Park products are sold and supported worldwide with regional headquarters in the US, Korea, Japan, and Singapore, and distribution partners throughout Europe, Asia, and America. For more information call 408-986-1110 or email  [email protected] or visit the website at


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