Monthly Archives: April 2016

Researchers at the Energy Department’s National Renewable Energy Laboratory (NREL) have uncovered a way to overcome a principal obstacle in using two-dimensional (2D) semiconductors in electronic and optoelectronic devices.

2D semiconductors such as molybdenum disulfide are only a few layers thick and are considered promising candidates for next-generation devices. Scientists first must overcome limitations imposed by a large and tunable Schottky barrier between the semiconductor and a metal contact. The barrier, at the metal/semiconductor junction, creates an obstacle for the flow of electrons or holes through the semiconductor.

The NREL team discovered that the height of the Schottky barrier can be adjusted-or even made to vanish-by using certain 2D metals as electrodes. Such adjustments are not possible with conventional three-dimensional metals because of a strong Fermi level pinning (FLP) effect occurring at the junction of metal and semiconductor, due to electronic states in the semiconductor band gap that are induced by the metal. Increasing the flow of electrons or holes through a semiconductor reduces power losses and improves the device performance.

The NREL theorists considered a family of 2D metals that could bind with the 2D semiconductors through van der Waals interaction. Because this interaction is relatively weak, the metal-induced gap states are suppressed and the FLP effect is negligible. This means that the Schottky barrier becomes highly tunable. By selecting an appropriate 2D metal/2D semiconductor pair, one can reduce the barrier to almost zero (such as H-NbS2/WSe2 for hole conduction).

They noted that using a 2D metal as an electrode would also prove useful for integrating into transparent and flexible electronics because the 2D metal is also transparent and flexible. They also noted that the junction of 2D metal and 2D semiconductor is atomically flat and can have fewer defects, which would reduce carrier scattering and recombination.

The work by Yuanyue Liu, Paul Stradins, and Su-Huai Wei, “Van der Waals metal-semiconductor junction: weak Fermi level pinning enables effective tuning of Schottky barrier,” appears in the new issue of Science Advances.

The trio of researchers predicts that hexagonal phase of niobium disulfide (NbS2) is the most promising for hole injection into a 2D semiconductor, and heavily nitrogen-doped graphene can enable efficient electron injection.

IC Insights’ April Update to the 2016 McClean Report, to be released later this week, includes IC Insights’ final 2015 top 50 company rankings for total semiconductor and IC sales as well as rankings of the leading suppliers of DRAM, flash memory, MPUs, IC foundry services, etc.

Figure 1 ranks the top 13 IC foundries (pure-play and IDM) by foundry sales in 2015.

Apple TSMC sales

TSMC, by far, was the leader with $26.4 billion in sales last year.  In fact, TSMC’s 2015 sales were over 5x that of second-ranked GlobalFoundries (even with the addition of IBM’s chip business in the second half of 2015) and almost 12x the sales of the fifth-ranked China-based foundry SMIC.  As shown, there are only two IDM foundries in the ranking—Samsung and Fujitsu—after IBM and Magnachip fell from the list in 2015.  Despite losing a significant amount of Apple’s business, Samsung easily remained the largest IDM foundry last year, with more than 3x the sales of Fujitsu, the second-largest IDM foundry.

Illustrating the dramatic effect of exchange rate fluctuations on the IC sales numbers, TSMC’s 2015 growth rate was about half (6%) of what it was in its local currency (11%).  Thus, while the company met its stated goal of 10% or better growth in 2015 in NT dollars (840.5 billion), its growth rate in U.S. dollars was only 6%.

Driving home just how important Apple’s foundry business is, TSMC’s foundry sales increased by $1,464 million last year while its sales to Apple jumped by $1,990 million, representing more than 100% of TSMC’s total foundry sales increase in 2015.  As a result, without Apple, TSMC’s foundry sales would have declined by 2% last year, eight points less than the 6% increase it logged when including Apple.

Second ranked GlobalFoundries took over IBM’s IC business in early July of 2015.  It should be noted that besides $515 million in IDM foundry sales IBM made in 2014, the company also had about $1.0 billion of internal transfer IC revenue that year.  As a result, GlobalFoundries’ quarterly sales in 4Q15 were about $1.4 billion, an annual run-rate of $5.6 billion, about 12% greater than the company’s 2015 sales of $5.0 billion. However, without the addition of IBM’s sales in the second half of last year, GlobalFoundries’ sales would have declined by 2% in 2015.

Sales from the top 13 foundries’ shown in Figure 1 were $46.7 billion and represented 93% of the $50.3 billion in total foundry sales in 2015.  This share was two points higher than the 91% share the top 13 represented two years earlier in 2013.  With the barriers to entry (e.g., fab costs, access to leading edge technology, etc.) into the foundry business being so high and rising, IC Insights expects this “top 13” marketshare figure to continue to slowly rise in the future.

Spintronic majority gates could revolutionize circuit design. They will completely change the paradigm – both at device and circuit level – in how to approach scaling.

BY IULIANA RADU and AARON THEAN, imec, Leuven, Belgium

Spin logic devices are an emerging beyond-CMOS technology that may push beyond Moore’s law, enabling functional scaling beyond the 5nm technology node. These exotic devices lend themselves to majority logic operation, which differs in many ways from the classical NAND-based operation. Imec looks into spin torque majority gates and spin wave majority gates, two concepts that completely change the way we think of computing and scaling. As shown at the 2015 IEDM conference, circuit simulations with these majority gates outperform equivalent CMOS circuits in terms of area and power consumption. Meanwhile, experimental work has been started to learn about the materials, about the devices behavior and about the technology challenges that lie ahead.

Spintronic majority gates, an efficient way to build circuits

As we approach 5nm logic technology in 2020, CMOS device density scaling faces serious challenges due to escalating process costs and parasitics. This inevitably leads to questions of sustainability of traditional Moore’s law where cost and data processing supposedly scale favorably with increasing device density. This begs the question: are there specialized devices and computational paradigms out there that break away from these fundamental trappings of CMOS scaling? The search is on and novel beyond-CMOS devices are being intensively studied.

This varied class of devices may enhance and complement the functionality of CMOS circuits. Among the promising concepts are spintronic devices (FIGURE 1), which exploit the electron’s spin, a quantum attribute that relates to magnetism, rather than its charge to perform logic operations. Spin logic devices promise to be non-volatile and lend themselves to ultralow-energy operation. But one of their biggest trumps is the ability to build majority gates, ‘democratic’ devices that return true if more than 50% of their inputs are true. For example, if two inputs are in a true state and a third one is in a false state, the expected state at the output is true. With these majority gates, logic AND and OR operations can be emulated. Also, this concept of majority logic operation differs in many ways from the classical NAND-based logic, where an output is false only if all its inputs are true. It presents a concept shift that completely changes the way we synthesize circuits. But the advantages are huge: majority gates enable arithmetic circuits that are much more compact and energy-efficient than conventional NAND or XOR gate-based circuits. For example, while a one-bit adder in CMOS technology requires about 25 transistors, the equivalent wave computing circuit only requires 5 transducers and 4 waveguides to perform the same operation.

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Two ways of encoding information

Spintronic majority gates can come in several flavors, differing in the way the information is encoded and processed in the device, and in the way transduction from the charge domain to the spin (magnetism) domain is executed. At imec, two concepts are studied extensively: the spin torque majority gate (STMG) and the spin wave majority gate (SWMG).

In a STMG, the information is encoded in magnetic domain walls. Domain walls are interfaces that separate regions with different magnetization direction. The majority gate itself consists of a cross-shaped free layer that is common to 4 magnetic tunnel junctions (3 inputs, 1 output). The magnetization direction of the 3 ‘input’ free layers is switched using spin transfer torque, provided by a current through each of the magnetic tunnel junctions. Based on quantum interactions between electrons known as exchange, the domain walls propagate and interact, and the majority magnetization direction wins. The output state is measured via tunneling magnetoresistance.

In a SWMG, the computation principle is based on the interference of spin waves. The information can be encoded either in the amplitude or in the phase of the waves. Spin waves are low-energy collective excita- tions in magnetic materials. They can be generated by a so-called magneto-electric cell, which converts voltage into a spin wave. Key elements of this cell are a piezoelectric layer (that converts voltage into strain) and a magnetostrictive layer (in which the strain produces a change in magnetization or magne- tization anisotropy). In its turn, the change in magne- tization can generate a spin wave in a magnetic spin wave bus. The same cell is used to read the output state of the majority gate (FIGURE 2).

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Both concepts have been studied intensively, and approaches of how to handle the computation have been proposed. An experimental demonstration is however still missing. At imec, we have enlarged our basic understanding of both STMG and SWMG and used simulations to validate device functioning. We have compared the two types of majority gates against equivalent circuits in 10nm FinFET CMOS technology. And we present our first experimental results, and highlight the main challenges for both concepts.

Spin torque majority gate – compact and technology friendly

We used micromagnetic simulations to validate the functioning of the STMG and identify its operating conditions. For this majority gate, the switching of the magnetization state is current controlled. If the applied current or the pulse length are not enough, the output fails to switch. Even if the applied current pulses provide enough energy to switch, other failure modes can appear. For example, the domain walls that are being formed can become ‘stuck’ at the crossing of the device. This happens when the width of the cross exceeds a certain value, typically in the 15-20nm range. This makes these devices difficult to demonstrate experimentally as it requires patterning and etching to small size and tight pitch between the magnetic tunnel junctions. However, this initial impediment holds great promise for further device scaling. A major advantage of this majority gate is the use of technology friendly materials, compa- rable to the materials used in magnetic memories.

We have benchmarked the device against equivalent 10nm CMOS circuits by comparing key metrics of area, power and delay. On average, the STMG circuits have about 10x smaller area, and provide a means for further scaling. However, being current controlled, the STMG circuits have a longer delay, making them less efficient than equivalent CMOS circuits. Further advances in materials stacks are needed to improve their performance, comparable to those needed in general for magnetic memory.

At imec, we are currently building the first STMG devices on 300mm wafers. Particular attention is paid to the magnetic tunnel junction pillar etch development (FIGURE 3).

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Spin wave majority gate – compact, ultralow-power but challenging materials

We used micromagnetic simulations to model the spin wave propagation in SWMGs and to simulate the magnetic behavior of the magneto-electric cell that converts the applied voltage into a spin wave. This cell is a critical component for the device functionality. We mapped out the parameter space where the magneto-electric cell is expected to work optimally and used these parameter ranges as input for circuit synthesis. Building magneto- electric cells experimentally is very challenging as the materials to be used are not typically used in standard fabs and cleanrooms. For this reason, and to help choose the right materials, we have performed circuit synthesis and benchmarked them against CMOS. Based on materials parameters extracted from these simulations we have chosen a starting set of materials for our experiments.

One of the questions to be answered is how piezoelectrics behave at very high frequencies (gigahertz range) as needed for logic devices. Piezoelectric materials are being used in many applications, where they typically operate at low frequencies (up to hundreds of kHz). At imec, we started first experiments to grow piezoelectric materials in a thin film and to learn how these materials behave in the high frequency domain. And although more experiments are needed to improve the performance and map out the reliability behavior, our preliminary results are very encouraging. An important drawback of the spin wave technology is that the required materials (both the magnetostrictive and the piezoelectric materials) are very different from standard CMOS materials (FIGURE 4).

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The spin wave technology was also benchmarked against CMOS circuits. The spin wave circuits take on average 3.5 times less area and about 400 times lower power than their CMOS counterparts. However, the spin wave circuits are on average 12 times slower, mainly because of the large switching delay of the magneto-electric cell. SWMGs may therefore be used for ultralow-power applications, where latency is a secondary consideration (FIGURE 5).

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Building arithmetic circuits on top of CMOS

Spintronic majority gates could revolutionize circuit design. They will completely change the paradigm – both at device and circuit level – in how to approach scaling. In the future, more experimental work is planned to learn about the new materials required, to validate circuit assessment, and to finally demonstrate functional devices.

Once these technologies have become more mature, we can start thinking of multi-device architectures that combine CMOS-based and spin logic devices. An interesting approach is to stack, on top of CMOS technology, arithmetic circuits made of spintronic majority gates. The high-performance functions could be executed by the CMOS-based devices and the ultralow-power functions by the spin logic arithmetic circuits. So, rather than replacing Si CMOS based transistors in the future, this beyond-CMOS technology is intended to enhance and complement the functionality of CMOS-based devices.

Spintronics belongs to the beyond-CMOS segment, where we look into new materials and device architectures, and even into new computing paradigms and circuits. Beyond-CMOS research is part of imec’s multiple roadmap scenario that is built around 3 pillars: Si extension, beyond Si and beyond CMOS. Each of these segments has its own mission and approach to enabling scaling. And each of the new technologies will bring in enabling modules and devices that will serve the application diversity in the new era of electronics: the internet of things. And the results will support the quest of the semiconductor industry to find solutions that enable continual functional scaling of cost and energy per bit by departing from the familiar CMOS scaling.

Suggested additional reading

1. Spintronic majority gates, I. P. Radu et al., IEDM 2015 (https://www.researchgate.net/publication/286882975_ Spintronic_Majority_Gates)

2. Design and benchmarking of hybrid CMOS-spin wave device circuits compared to 10nm CMOS, O. Zografos et al., Proceedings of the 15th International IEEE Conference on Nanotechnology (NANO), 2015(http://infoscience.epfl.ch/ record/211004)

3. “With our multiple roadmap scenario, we anticipate the appli- cation diversity in the new Era of Electronics”, imec annual overview 2015, vision by Aaron Thean (click on the name of Aaron at http://magazine.imec.be/data/80/reader/reader. html?t=1452505511353#!preferred/1/package/80/pub/86/ page/8)

IULIANA RADU is a program manager and AARON THEAN is the Vice President of Process Technologies and the Director of the Logic Devices Research at imec, Leuven, Belgium.

ams AG (SIX: AMS), a provider of high performance sensors and analog ICs, announces that U.S. District Judge Richard A. Schell has entered an order on April 26, 2016, awarding one of its wholly-owned subsidiaries, ams-TAOS USA Inc. f/k/a Texas Advanced Optoelectronic Solutions, Inc., US $77,021,593 in damages from United States-based Intersil Corporation, including US $10,000,000 in exemplary damages.

The decision comes after a 2015 four-week trial in which jurors in the federal Eastern District of Texas found in favor of ams-TAOS on all claims against Intersil: misappropriation of ams-TAOS’ trade secrets, breach of a non-disclosure agreement between the parties, tortious interference with ams-TAOS’ prospective business relations, and willful infringement of U.S. Patent No. 6,596,981.

The final judgement which will be entered on a later date can, however, be appealed. ams AG is therefore not able to estimate a time frame for conclusion of the case or recovery of damages awarded.

ams AG’ General Counsel Jann H. Siefken stated,  “We are pleased with the court’s decision to enforce our company’s intellectual property rights against a competitor who would seek to misappropriate them for an unfair competitive advantage.”

SEMI today announced the second annual edition of the SEMI European MEMS Summit, dedicated to MEMS and sensors, to be held on September 15-16. After a successful inaugural event in Milan that attracted 265 attendees, this year’s SEMI European MEMS Summit will convene in Stuttgart, one of the world’s major MEMS and Sensor hubs.

MEMS volumes are expected to nearly double, compared to today’s levels, and reach 30 billion units by 2020, based on a Yole Developpement forecast.  While the growth is impressive, challenges exist, and through the SEMI European MEMS Summit’s unique combination of plenary executive talks, exhibition and networking opportunities, major issues will be addressed for discussion and collaboration:

  • Making sensors smaller, smarter, and cheaper
  • Emerging technologies and readiness, maturity
  • Price and margin pressures and business models
  • Markets dynamics and new opportunities

In addition, leading companies will share key messages on their product and business strategic development.  Sessions will focus on automotive, consumer electronics and wearables, Internet of Things (IoT), and more.

“Stuttgart is the ideal location for the 2016 SEMI European MEMS Summit, and we look forward to exchanging views on the latest advances in the MEMS industry,” said Klaus Meder, president of Automotive Electronics at Robert Bosch GmbH.

The conference program is developed by a steering committee composed of industry and thought leaders including ASE, Bosch, Bosch Sensortec, CEA-Leti, EV Group, Fraunhofer ENAS, Fraunhofer IZM, IHS, NXP, Okmetic, Sencio, SPTS, STMicroelectronics, SUSS MicroTec, X-Fab, and Yole Developpement.  The program will feature executive speakers from organizations shaping the industry and will be announced in late spring.

Registration for the conference, exhibition and sponsorship packages are open for bookings with ‘early bird’ prices valid until May 31.  Visit www.semi.org/europeanMEMSSummit for details and more information.

Cadence Design Systems, Inc. (NASDAQ:  CDNS) today announced that, Geoff Ribar, senior vice president and chief financial officer, who joined the company in 2010, has decided to retire from Cadence effective March 31, 2017.

Cadence has initiated a comprehensive search to identify the company’s next chief financial officer.  Mr. Ribar is working with Cadence president and chief executive officer Lip-Bu Tan in the search process. Once the new chief financial officer is appointed, Mr. Ribar will work collaboratively on the transfer of responsibilities and remain actively involved with Cadence through his retirement date.  After retiring next year, Mr. Ribar looks forward to remaining active in the technology and semiconductor industries through board memberships and other professional activities.

Lip-Bu Tan, president and CEO, said, “Geoff has been a tremendous partner to me and the company over the past five and a half years.  As an integral member of the leadership team, he has driven us forward and made long-lasting contributions to the company.  During Geoff’s tenure, we have consistently met or exceeded our financial objectives, improved both our operating margin and cash flow, strengthened the balance sheet, and optimized our return of capital.  Geoff has done an outstanding job of executing on the strategy and management philosophy that the Board and I have put in place, and has built a strong finance team.  Geoff’s departure is bittersweet for all of us, and I congratulate him on a successful career as a CFO and wish him well in the next chapter of his professional life.”

“It has been an honor to serve as CFO of Cadence and I’m extremely grateful for the support of my colleagues and the talented extended team,” said Mr. Ribar. “I also want to thank Lip-Bu for his leadership and trust. I am fully committed to ensuring a smooth transition and maintaining our excellent momentum throughout this transition process.”

MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it is now shipping its e-Compass sensor (MXG2320) in China to a major smartphone manufacturer that is targeting mobile markets in China and India.

MagnaChip’s MXG2320 e-Compass product is a Hall effect magnetic direction sensor. The MXG2320 supports high resolution (0.6uT/bit) at low voltage (1.8V/3.3V) and is well-suited for mobile applications because of its small die size (1.2mmX1.2mm). The e-Compass design win in China is recognition of MagnaChip’s mixed-signal design and manufacturing expertise and reflects the potential for future design-win opportunities for its entire line of sensor products.

In addition to the MXG2320, MagnaChip is in the final development stages of a buffer-embedded, e-Compass sensor with the smallest footprint (1.2mmX0.8mm) currently available in the market. This product is now undergoing beta testing and is being evaluated for use by a major smartphone manufacturer.

The e-Compass has become an essential part of mobile device applications and has now found its way into new applications such as virtual reality, indoor navigation and drone control.  An e-Compass sensor interprets compass direction through the detection of the earth’s magnetic polar fields.

“MagnaChip has been developing e-Compass and other sensor products for mobile applications as part of its strategy to target emerging growth markets,” said YJ Kim, CEO of MagnaChip Semiconductor. “I am very pleased to say that this e-Compass design win is very significant because it marks the beginning of our expansion into the China mobile market with our line of sensor products.”

Headquartered in South Korea, MagnaChip is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer applications.

Tiny units of matter and chemistry that they are, atoms constitute the entire universe. Some rare atoms can store quantum information, an important phenomenon for scientists in their ongoing quest for a quantum Internet.

New research from UC Santa Barbara scientists and their Dutch colleagues exploits a system that has the potential to transfer optical quantum information to a locally stored solid-state quantum format, a requirement of quantum communication. The team’s findings appear in the journal Nature Photonics.

“Our research aims at creating a quantum analog of current fiber optic technology in which light is used to transfer classical information — bits with values zero or one — between computers,” said author Dirk Bouwmeester, a professor in UCSB’s Department of Physics. “The rare earth atoms we’re studying can store the superpositions of zero and one used in quantum computation. In addition, the light by which we communicate with these atoms can also store quantum information.”

Atoms are each composed of a nucleus typically surrounded by inner shells full of electrons and often have a partially filled outer electron shell. The optical and chemical properties of the atoms are mainly determined by the electrons in the outer shell.

Rare earth atoms such as erbium and ytterbium have the opposite composition: a partially filled inner shell surrounded by filled outer shells. This special configuration is what enables these atoms to store quantum information.

However, the unique composition of rare earth atoms leads to electronic transitions so well shielded from the surrounding atoms that optical interactions are extremely weak. Even when implanted in a host material, these atoms maintain those shielded transitions, which in principle can be addressed optically in order to store and retrieve quantum information.

Bouwmeester collaborated with John Bowers, a professor in UCSB’s Department of Electrical and Computer Engineering, and investigators at Leiden University in the Netherlands to strengthen these weak interactions by implanting ytterbium into ultra-high-quality optical storage rings on a silicon chip.

“The presence of the high-quality optical ring resonator — even if no light is injected — changes the fundamental optical properties of the embedded atoms, which leads to an order of magnitude increase in optical interaction strength with the ytterbium,” Bouwmeester said. “This increase, known as the Purcell effect, has an intricate dependence on the geometry of the optical light confinement.”

The team’s findings indicate that new samples currently under development at UCSB can enable optical communication to a single ytterbium atom inside optical circuits on a silicon chip, a phenomenon of significant interest for quantum information storage. The experiments also explore the way in which the Purcell effect enhances optical interaction with an ensemble of a few hundred rare earth atoms. The grouping itself has interesting collective properties that can also be explored for the storage of quantum information.

Key is an effect called a photon echo, the result of two distinct light pulses, the first of which causes atoms in ytterbium to become partially excited.

“The first light pulse creates a set of atoms we ‘talk’ to in a specific state and we call that state ‘in phase’ because all the atoms are created at the same time by this optical pulse,” Bouwmeester explained. “However, the individual atoms have slightly different frequencies because of residual coupling to neighboring atoms, which affects their time evolution and causes decoherence in the system.” Decoherence is the inability to keep track of how the system evolves in all its details.

“The trick is that the second light pulse changes the state of the system so that it evolves backwards, causing the atoms to return to the initial phase,” he continued. “This makes everything coherent and causes the atoms to collectively emit the light they absorbed from the first pulse.”

The strength of the photon echo contains important information about the fundamental properties of the ytterbium in the host material. “By analyzing the strength of these photon echoes, we are learning about the fundamental interactions of ytterbium with its surroundings,” Bouwmeester said. “Now we’re working on strengthening the Purcell effect by making the storage rings we use smaller and smaller.”

According to Bouwmeester, quantum computation needs to be compatible with optical communication for information to be shared and transmitted. “Our ultimate goal is to be able to communicate to a single ytterbium atom; then we can start transferring the quantum state of a single photon to a single ytterbium atom,” he added. “Coupling the quantum state of a photon to a quantum solid state is essential for the existence of a quantum Internet.”

With consumers becoming increasingly comfortable using smartphones and tablet PCs, touch screens are now increasingly making their way into their vehicles, too. In fact, the automotive touch panel market is expected to expand from 28 million units shipped in 2013 to 86 million in 2021, according to IHS Inc. (NYSE: IHS), a global source of critical information and insight.

“Projected capacitive touch technology is commonly found in consumer smartphones and tablets, which consumers have grown very comfortable using,” said Shoko Oi, senior display analyst at IHS Technology. “Although there are concerns about how direct touch operations could affect safety while driving, automotive touch panels are becoming a standard feature in new vehicles coming to market.”

The content shown on automotive displays now comes from a variety of sources, both inside and outside the car. Many of these applications require touch panels, which shift the role of the display from simply revealing information visually to becoming an actual human-machine interface. This shift, along with the increased volume and importance of displayed data, is leading to a growing need for easy-to-see designs that incorporate larger sizes, irregular or curved shapes and higher resolutions.

Technological evolution hits automakers

Automotive touch panels are shifting from resistive-touch to capacitive-touch technology, and capacitive touch screens are forecast to exceed resistive touch-screens in vehicles in 2017, according to the IHS Automotive Touch Panel Market Report. As vehicle models are updated, the resistive touch screens that formerly dominated the automotive industry are quickly being replaced by capacitive touch screens.

“In spite of higher module costs, projected capacitive technology is replacing resistive technology as the mainstream touch solution for automotive monitors,” Oi said. “The latest trends in connected cars and telematics encourage car makers to adopt projected capacitive touch screens, because they provide a similar user experience to smartphone and tablet-PC touch displays.”

The IHS Automotive Touch Panel Market Report analyzes all aspects of current touch technologies, plus those being considered for future automotive applications. It includes market historical and forecast analyses by technology, sensor type, size, maker, and price.

Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland.

Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, including solder paste, solder preforms, fluxes, and thermal management materials.

Karch has more than 20 years of automotive industry experience, including the advanced development of customized electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt. He was recently the recipient of the top 10 innovative patents for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.