Fan-Out Wafer Level Packaging


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Date: May 26, 2016 at 1 PM ET

Free to attend

Length: Approximately one hour

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Wafer level packaging (WLP) using fan-out technology is a disruptive technology for achieving low-cost, low-profile package solutions for a wide range of applications, including mobile, MEMs, tablets, and automotive. Fan out technology provides cost-effective, high-density interconnects in a small form-factor packaging. Assembled directly on a silicon wafer, the approach is unconstrained by die size, providing the design flexibility to accommodate an unlimited number of interconnects between the package and the application board for maximum connection density, finer line/spacing, improved electrical and thermal performance and small package dimensions to meet the relentless form factor requirements and performance demands of the mobile market. In this webcast, industry experts will explain the FOWLP process, discuss recent advances and forecast future trends.


Bernie Adams_P2[1]Bernard Adams, Deputy Director, Product Technology Marketing, STATS ChipPAC

Bernard Adams is Deputy Director, Product Technology Marketing at STATS ChipPAC where he is responsible for marketing and business development of the Company’s wafer level packaging technology.  He has been with STATS ChipPAC since 2013 and has a diverse background in sales, strategic marketing, finance and product development experience in flip chip technology, backend packaging and front end semiconductor expertise. Prior to joining STATS ChipPAC, Bernard was with Cleanpart US LLC where he was the Micron-Intel Global Account Manager and the Western Regional Manager, responsible for supporting the top 35 integrated Device Manufacturers with semiconductor engineering and tools services. He has also held sales leadership positions at Quantumclean, Leica Microsystems, Electroglas and Flip Chip Technologies. Bernard has a Bachelor of Science in Electrical Engineering from Purdue University and a Masters of Business Administration in International Finance from the University of Pittsburgh.

Sponsored by Zeta Instruments

Zeta Instruments designs and manufactures Multi-Mode non-contact optical profilers and defect inspection systems for multiple high-technology industries, including: advanced semiconductor packaging, high-brightness LEDs, advanced glass manufacturing, solar, microfluidics and data storage.

Zeta’s growth has been driven by rapid technology progress combined with strong focus on customer requirements.  As a result, Zeta has installed production and R&D related equipment in 23 different countries. The rapid adoption of Zeta’s products is a testament to the company’s differentiated technology and a turn-key solution based approach towards designing the tools.  The advanced Zeta-580 Optical Profiler has been adopted by the leading OSATs for WLCSP and FOWLP related metrology and inspection.

Our locations include our headquarters in San Jose, CA, a regional office in Shanghai, China, and sales and service representatives worldwide.



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