Today during the NXP FTF China Tech Forum keynote, NXP Semiconductors (NASDAQ:NXPI) kicked off its 10th year anniversary celebration since its founding as a standalone semiconductor company, with NXP Chief Executive Officer, Rick Clemmer, highlighting the key trends that are driving the company’s growth – ADAS, Internet of Things (IoT), security, automotive and payments.

“As NXP celebrates a decade, we’re reminded of how important innovations in security and connectivity, key partnerships and ecosystem convergence has been in both the evolution of a smarter world and our company growth,” said Clemmer. “We are celebrating today with customers, employees and partners, but more importantly we are looking towards the future – a future of more secure connections for a smarter world. Here at NXP FTF China, we are demonstrating our vitality notably in automotive, IoT, payment and transit technologies.”

NXP FTF China is taking place at the Shenzhen Intercontinental Hotel, September 28-29. At the event, the company announced key collaborations and unveiled new solutions for IoT, automotive and smart kitchens. Announcements include:

• Establishing Security Standards for Smart Cars in China with Cross-sector Collaborations

  NXP announced it is collaborating with Changan Automobile and Neusoft to establish the China Auto Security Common Interests Group (CIG). The group brings together a hardware-based industry cooperative organization for automotive security with local automotive and software partners in the global market. CIG will adopt “NXP 4 plus 1 security framework” – the highest level of car information security today. The CIG will work together to develop comprehensive industrial solutions and will collaborate to establish industry standards to contribute to the innovation of China’s automotive industry.

• Driving Mobile Transit and Contactless Payment in China
  
  NXP and Xiaomi Inc. today announced they are successfully deploying best-in-class technologies to implement secure, convenient mobile transit experiences countrywide across China’s popular metro stations and public bus lines. Since initial launch of the mobile transit services in June, activation rates grew more than 15 percent in Shanghai and more than 20 percent in Shenzhen among commuters. And with Xiaomi’s recent launch of Mi Pay, featuring NXP’s embedded secure element (eSE) technology, consumers will benefit from the highest level of security for transactions from both bank and transportation accounts.

• NXP and Midea Demonstrate New Smart Kitchen Appliances
  
  NXP is collaborating with Midea to achieve breakthrough R&D innovations in smart kitchen appliances. NXP has brought revolutionary changes to Midea products through technological innovations: the semiconductor-heating cube demonstrated at the Tech Forum is the first result of this cooperation. With a sleek appearance, it features the MHT1004N solution based on NXP’s RF technology and is small in volume, lightweight and easy to carry, offering users with a more convenient cooking experience. As a major milestone in NXP’s cooperation in R&D of smart kitchen solutions in China, the launch of the semiconductor-heating cube heralds broader cooperation between the two parties in the field of smart home appliances.

• Integrated Innovation to Push New Solutions for Secure Connected cars

  NXP announced its expansion of the industry leading MagniV microcontrollers product line and introduced a broad portfolio of hardware, software and integrated motor control solutions designed to dramatically speed time to market.  The new integrated solution would radically simplify system development and shorten design cycles.

  In addition, NXP also extended its leadership in secure car access technology to car-side systems with the introduction of the NJJ29C0 Low Frequency transceiver. As a leader in advanced key fob designs, NXP now enables full system solutions that combine longer-range performance and enhanced convenience for end-users, together with reduced costs, faster time-to market and greater design freedom for OEMs and their tier one suppliers.

• New Innovative Technologies Designed in China, Built in China, For China

  At NXP FTF China, NXP officially unveiled the i.MX 6ULL – the lowest power ARM® Cortex-A7-based applications processor in the market.  The i.MX6 ULL processor, designed for the growing IoT consumer and industrial, mass markets, delivers up to 30 percent more power efficiency than its nearest competitors and is available at breakthrough prices.

  NXP also announced it is expanding the Kinetis E Series with KE1xZ and KE1xF ARM® Cortex® -M based MCU families to bring higher performance with greater memory densities and robust IP integration to the series making them ideal for high-end home appliances, motor control and smart lighting applications.

  NXP today introduced the industry’s first automotive 15W wireless charging solution, qualified to meet stringent automotive and industrial grade requirements. Compatible with WPC Qi and PMA charging standards, this complete solution allows automakers to easily transition from 5W to 15W capabilities, giving drivers a faster in-vehicle charging experience for mobile phones, tablets and wearables.

  In addition, the company announced that Cannice Technology, an original design manufacturer based in China, has unveiled a production-ready true wireless earbuds design.