Yearly Archives: 2016

This year again, both market segments, high end and low end, are the main targets of the TSV technologies providers. In its latest advanced packaging technology and market analysis entitled 3DIC and 2.5D TSV Interconnect for Advanced Packaging: 2016 Business Update reportYole Développement (Yole) announces, high volume production started: 3D TSV is a reality, especially in the memory industry. Amongst a dynamic advanced packaging market showing an overall advanced packaging revenue CAGR estimated at 8%, rising to US$ 30 billion in 2020, the development of TSV platforms is still pushed by the need to the increase of performance, functionalities and integration; in addition, form factor and cost reduction are also part of the playground.

The More than Moore market research and strategy consulting company proposes today an overview of the 3D/2.5D IC packaging technologies per application. In addition to wafer forecast for 2015-2021 for different TSV applications, Yole’s analysts review the status of the current and future 3D IC products. They also describe and analyze the dedicated technology roadmap per device and highlight the organization of this market including supply chain activities, list of key players and OSAT and foundry strategies.

3D TSV technology is becoming a key solution platform for heterogeneous interconnection, high end memory and performance applications.

The higher end market segment is led by 3D stacked memories, 2.5D integration and emerging application such as photonics. From its side, the low end application includes CIS , MEMS devices and other sensors and new applications such as LEDs.

TSVs have now become the preferred interconnect choice for high-end memory. They are also an enabling technology for heterogeneous integration of logic circuits with CIS, MEMS , sensors, and RF filters. In the near future they will also enable photonics and LED function integration.

“The market for 3D TSV and 2.5D interconnect is expected to reach around 2.1 million wafers in 2021, expanding at an 18% CAGR,” said Santosh Kumar, Senior Technology& Market Analyst at Yole. The growth is driven by increased adoption of 3D memory devices in high-end graphics, high-performance computing, networking and data centers, and penetration into new areas, including fingerprint and ambient light sensors, RF filters and LEDs.

CIS still commanded more than 80% share of TSV market wafer volume in 2015, although this will decrease to around 56% by 2021. This is primarily due to the growth of the other TSV applications, led by 3D memories, RF filters and fingerprint sensors. However, hybrid stacked technology, which uses direct copper-copper bonding, not TSVs, will penetrate around 38% of CIS production by 2021. The TSV markets for RF filters and fingerprint sensors are expected to reach around US$2.6 billion and US$0.7 billion by 2021 respectively.

Under this new report, Yole’s analysts also highlight the diversity of business models within the 3D & 2.5D TSV supply chain. They identify:
•  IDMs with Samsung, Micron, Freescale, Sony, Toshiba, STMicroelectronics…
•  OSATs including SPIL, Amkor Technology, ASE, Powertech…
•  CMOS foundries with TSMC, SMIC and more.
Si interposers suppliers, 3D packaging foundries and R&D services are also part of the business models identified by Yole’s analysts.
So will 3D TSV open the doors for new strategies? Indeed each player has its own approach:
•  Both OSATs, Amkor Technology and SPIL are strongly involved in the memory and the MEMS & Sensor market.
•  In parallel Samsung, an IDM, is well positioned in the CIS, Si interposer and LED market segments only.
•  In addition no foundries for memory products have been identified by Yole’s advanced packaging team.
Amongst the numerous 3D & 2.5D TSV players, Micron, SKHynix, Samsung, AMS and Avago Technologies are investing in capex…
A detailed analysis per player is available in Yole’s report, especially the OSATs and foundries strategies, that are willing to increase their market shares for TSV applications.

According to Yole’s analysts, 3DIC & 2.5D TSV continue its attractive growth. Under a dynamic ecosystem, a lot of valuable companies are involved in this field and propose innovative solutions. Because of the increasing consumer market, as well as the need for higher performance products such as 4K gaming, networking, 2.5D/3D TSV packaging platform becomes a key solution platform.

During the Electronics Packaging Technology Conference (EPTC) taking place from November 30 to December 3 in Singapore, Yole’s expert, Santosh Kumar will present his vision of the 3DIC & 2.5D TSV industry. His presentation is entitled: “What’s happening in TSV based 3D/2.5D IC packaging: Latest market & technology trends”. Discover the program and register on EPTC 2016.

In the quest for faster and more powerful computers and consumer electronics, big advances come in small packages.

The high-performance, silicon-based transistors that control today’s electronic devices have been getting smaller and smaller, allowing those devices to perform faster while consuming less power.

But even silicon has its limits, so researchers at The University of Texas at Dallas and elsewhere are looking for better-performing alternatives.

In a new study published Oct. 7 in the journal Science, UT Dallas engineers and their colleagues describe a novel transistor made with a new combination of materials that is even smaller than the smallest possible silicon-based transistor.

“Silicon transistors are approaching their size limit,” said Dr. Moon Kim, professor of materials science and engineering at UT Dallas and an author of the study. “Our research provides new insight into the feasibility to go beyond the ultimate scaling limit of silicon-based transistor technology.”

The study authors also included Kim’s graduate student Qingxiao Wang, and collaborators at the University of California, Berkeley, Stanford University and the Lawrence Berkeley National Laboratory, which led the project. Researchers in California fabricated the transistor and performed theoretical simulations, while the UT Dallas team physically characterized the device using an atomic resolution electron microscope on campus.

As current flows through a transistor, the stream of electrons travels through a channel, like tap water flowing through a faucet out into a sink. A “gate” in the transistor controls the flow of electrons, shutting the flow off and on in a fraction of second.

“As of today, the best/smallest silicon transistor devices commercially available have a gate length larger than 10 nanometers,” said Kim, the Louis Beecherl Jr. Distinguished Professor in the Erik Jonsson School of Engineering and Computer Science. “The theoretical lower limit for silicon transistors is about 5 nanometers. The device we demonstrate in this article has a gate size of 1 nanometer, about one order of magnitude smaller. It should be possible to reduce the size of a computer chip significantly utilizing this configuration.”

One of the challenges in designing such small transistors is that electrons can randomly tunnel through a gate when the current is supposed to be shut off. Reducing this current leakage is a priority.

“The device we demonstrated shows more than two orders of magnitude reduction in leakage current compared to its silicon counterpart, which results in reduced power consumption,” Kim said. “What this means, for example, is that a cellphone with this technology built in would not have to be recharged as often.”

Instead of using silicon, the researchers built their prototype device with a class of semiconductor materials called transition metal dichalcogenides, or TMDs. Specifically, their experimental device structure used molybdenum disulfide for the channel material and a single-walled carbon nanotube for the gate.

Kim said there are many technical challenges before large-scale manufacturing of the new transistor is practical or even possible.

“Large-scale processing and manufacturing of TMD devices down to such small gate lengths will require future innovations,” he said.

Researchers at North Carolina State University have created a high voltage and high frequency silicon carbide (SiC) power switch that could cost much less than similarly rated SiC power switches. The findings could lead to early applications in the power industry, especially in power converters like medium voltage drives, solid state transformers and high voltage transmissions and circuit breakers.

A new NC State high-power switch has the potential to work more efficiently and cost less than conventional solutions. Credit: Xiaoqing Song, NC State University

A new NC State high-power switch has the potential to work more efficiently and cost less than conventional solutions. Credit: Xiaoqing Song, NC State University

Wide bandgap semiconductors, such as SiC, show tremendous potential for use in medium- and high-voltage power devices because of their capability to work more efficiently at higher voltages. Currently though, their high cost impedes their widespread adoption over the prevailing workhorse and industry standard – insulated-gate bipolar transistors (IGBT) made from silicon – which generally work well but incur large energy losses when they are turned on and off.

The new SiC power switch, however, could cost approximately one-half the estimated cost of conventional high voltage SiC solutions, say Alex Huang and Xiaoqing Song, researchers at NC State’s FREEDM Systems Center, a National Science Foundation-funded engineering research center. Besides the lower cost, the high-power switch maintains the SiC device’s high efficiency and high switching speed characteristics. In other words, it doesn’t lose as much energy when it is turned on or off.

The power switch, called the FREEDM Super-Cascode, combines 12 smaller SiC power devices in series to reach a power rating of 15 kilovolts (kV) and 40 amps (A). It requires only one gate signal to turn it on and off, making it simple to implement and less complicated than IGBT series connection-based solutions. The power switch is also able to operate over a wide range of temperatures and frequencies due to its proficiency in heat dissipation, a critical factor in power devices.

“Today, there is no high voltage SiC device commercially available at voltage higher than 1.7 kV,” said Huang, Progress Energy Distinguished Professor and the founding director of the FREEDM Systems Center. “The FREEDM Super-Cascode solution paves the way for power switches to be developed in large quantities with breakdown voltages from 2.4 kV to 15 kV.”

The FREEDM Super-Cascode switch was presented by Xiaoqing Song, a Ph.D. candidate at the FREEDM Systems Center under Huang’s supervision, at the IEEE Energy Conversion Congress & Exposition (ECCE 2016) held in Milwaukee from Sept. 18-22, 2016.

KLA-Tencor Corporation (NASDAQ:  KLAC) and Lam Research Corp. (NASDAQ:  LRCX) today announced that they have agreed to terminate their proposed merger agreement. The parties decided to it was not in the best interests of their respective stakeholders to continue pursuing the merger after the U.S. Department of Justice advised KLA-Tencor and Lam Research that it would not continue with a consent decree that the parties had been negotiating. No termination fees will be payable by either the Company or Lam Research in connection with the termination of the Merger Agreement.

“Although we are disappointed with this outcome, KLA-Tencor’s performance over the past several quarters demonstrates the Company is executing our strategies at a high level and creating compelling value for the industry and for our stockholders,” commented Rick Wallace, President and Chief Executive Officer of KLA-Tencor.

“Today our customer engagement and market leadership is strong and KLA-Tencor is delivering superior financial results. Growth and earnings momentum is expected to continue as we go forward, fueled by new products in the marketplace today, and with many more products in the pipeline,” continued Mr. Wallace. “Additionally, our collaboration over the past year with Lam Research and with our customers has affirmed the value of closer cooperation between process and process control for new, enabling solutions. For that reason, we plan to explore collaboration opportunities with Lam Research around programs identified as beneficial to our customers.”

After the initial announcement of the proposed merger, which was expected to close mid-year 2016, analysts voiced concern over whether the deal would be approved. Robert Maire of Semiconductor Advisors wrote: “We think this is going to be the obvious biggest issue after the failed AMAT & TEL merger.  We think there will likely be opposition in the semi industry but probably less so than we heard the screaming related to AMAT/TEL.”

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $28.0 billion for the month of August 2016, an increase of 3.5 percent compared to the previous month’s total of $27.1 billion and an uptick of 0.5 percent over the August 2015 total of $27.9 billion. August marked the market’s largest month-to-month growth since May 2013 and its first year-to-year growth since June 2015. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“Following months of sluggish global semiconductor sales, the global market recently has shown signs of a rebound, punctuated by solid growth in August,” said John Neuffer, president and CEO, Semiconductor Industry Association. “The Americas market was particularly encouraging, topping 6 percent month-to-month growth for the first time in nearly three years to lead all regional markets. China also stood out, posting by far the strongest year-to-year growth of all regions in August. All told, global sales are still behind last year’s pace, but appear to be on the right track as 2017 draws closer.”

Month-to-month sales increased across all regions: the Americas (6.3 percent), Japan (4.8 percent), China (3.1 percent), Asia Pacific/All Other (2.7 percent), and Europe (0.7 percent). Year-to-year sales increased in China (7.1 percent) and Japan (2.2 percent), but fell in Asia Pacific/All Other (-2.7 percent), the Americas (-3.1 percent), and Europe (-3.3 percent).

 

August 2016

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

5.10

5.43

6.3%

Europe

2.70

2.71

0.7%

Japan

2.60

2.73

4.8%

China

8.56

8.82

3.1%

Asia Pacific/All Other

8.12

8.34

2.7%

Total

27.08

28.03

3.5%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.60

5.43

-3.1%

Europe

2.81

2.71

-3.3%

Japan

2.67

2.73

2.2%

China

8.23

8.82

7.1%

Asia Pacific/All Other

8.57

8.34

-2.7%

Total

27.88

28.03

0.5%

Three-Month-Moving Average Sales

Market

Mar/Apr/May

Jun/Jul/Aug

% Change

Americas

4.79

5.43

13.2%

Europe

2.63

2.71

3.3%

Japan

2.55

2.73

6.9%

China

8.09

8.82

9.0%

Asia Pacific/All Other

8.00

8.34

4.2%

Total

26.07

28.03

7.5%

A team led by Cory Dean, assistant professor of physics at Columbia University, Avik Ghosh, professor of electrical and computer engineering at the University of Virginia, and James Hone, Wang Fong-Jen Professor of Mechanical Engineering at Columbia Engineering, has directly observed–for the first time–negative refraction for electrons passing across a boundary between two regions in a conducting material. First predicted in 2007, this effect has been difficult to confirm experimentally. The researchers were able to observe the effect in graphene, demonstrating that electrons in the atomically thin material behave like light rays, which can be manipulated by such optical devices as lenses and prisms. The findings, which are published in the September 30 edition of Science, could lead to the development of new types of electron switches, based on the principles of optics rather than electronics.

Illustration of refraction through a normal optical medium versus what it would look like for a medium capable of negative refraction. Credit: Cory Dean, Columbia University

Illustration of refraction through a normal optical medium versus what it would look like for a medium capable of negative refraction. Credit: Cory Dean, Columbia University

“The ability to manipulate electrons in a conducting material like light rays opens up entirely new ways of thinking about electronics,” says Dean. “For example, the switches that make up computer chips operate by turning the entire device on or off, and this consumes significant power. Using lensing to steer an electron ‘beam’ between electrodes could be dramatically more efficient, solving one of the critical bottlenecks to achieving faster and more energy efficient electronics.”

Dean adds, “These findings could also enable new experimental probes. For example, electron lensing could enable on-chip versions of an electron microscope, with the ability to perform atomic scale imageing and diagnostics. Other components inspired by optics, such as beam splitters and interferometers, could additionally enable new studies of the quantum nature of electrons in the solid state.”

While graphene has been widely explored for supporting high electron speed, it is notoriously hard to turn off the electrons without hurting their mobility. Ghosh says, “The natural follow-up is to see if we can achieve a strong current turn-off in graphene with multiple angled junctions. If that works to our satisfaction, we’ll have on our hands a low-power, ultra-high-speed switching device for both analog (RF) and digital (CMOS) electronics, potentially mitigating many of the challenges we face with the high energy cost and thermal budget of present day electronics.”

Light changes direction – or refracts – when passing from one material to another, a process that allows us to use lenses and prisms to focus and steer light. A quantity known as the index of refraction determines the degree of bending at the boundary, and is positive for conventional materials such as glass. However, through clever engineering, it is also possible to create optical “metamaterials” with a negative index, in which the angle of refraction is also negative. “This can have unusual and dramatic consequences,” Hone notes. “Optical metamaterials are enabling exotic and important new technologies such as super lenses, which can focus beyond the diffraction limit, and optical cloaks, which make objects invisible by bending light around them.”

Electrons travelling through very pure conductors can travel in straight lines like light rays, enabling optics-like phenomena to emerge. In materials, the electron density plays a similar role to the index of refraction, and electrons refract when they pass from a region of one density to another. Moreover, current carriers in materials can either behave like they are negatively charged (electrons) or positively charged (holes), depending on whether they inhabit the conduction or the valence band. In fact, boundaries between hole-type and electron-type conductors, known as p-n junctions (“p” positive, “n” negative), form the building blocks of electrical devices such as diodes and transistors.

“Unlike in optical materials”, says Hone, “where creating a negative index metamaterial is a significant engineering challenge, negative electron refraction occurs naturally in solid state materials at any p-n junction.”

The development of two-dimensional conducting layers in high-purity semiconductors such as GaAs (Gallium arsenide) in the 1980s and 1990s allowed researchers to first demonstrate electron optics including the effects of both refraction and lensing. However, in these materials, electrons travel without scattering only at very low temperatures, limiting technological applications. Furthermore, the presence of an energy gap between the conduction and valence band scatters electrons at interfaces and prevents observation of negative refraction in semiconductor p-n junctions. In this study, the researchers’ use of graphene, a 2D material with unsurpassed performance at room temperature and no energy gap, overcame both of these limitations.

The possibility of negative refraction at graphene p-n junctions was first proposed in 2007 by theorists working at both the University of Lancaster and Columbia University. However, observation of this effect requires extremely clean devices, such that the electrons can travel ballistically, without scattering, over long distances. Over the past decade, a multidisciplinary team at Columbia – including Hone and Dean, along with Kenneth Shepard, Lau Family Professor of Electrical Engineering and professor of biomedical engineering, Abhay Pasupathy, associate professor of physics, and Philip Kim, professor of physic at the time (now at Harvard) – has worked to develop new techniques to construct extremely clean graphene devices. This effort culminated in the 2013 demonstration of ballistic transport over a length scale in excess of 20 microns. Since then, they have been attempting to develop a Veselago lens, which focuses electrons to a single point using negative refraction. But they were unable to observe such an effect and found their results puzzling.

In 2015, a group at Pohang University of Science and Technology in South Korea reported the first evidence focusing in a Veselago-type device. However, the response was weak, appearing in the signal derivative. The Columbia team decided that to fully understand why the effect was so elusive, they needed to isolate and map the flow of electrons across the junction. They utilized a well-developed technique called “magnetic focusing” to inject electrons onto the p-n junction. By measuring transmission between electrodes on opposite sides of the junction as a function of carrier density they could map the trajectory of electrons on both sides of the p-n junction as the incident angle was changed by tuning the magnetic field.

Crucial to the Columbia effort was the theoretical support provided by Ghosh’s group at the University of Virginia, who developed detailed simulation techniques to model the Columbia team’s measured response. This involved calculating the flow of electrons in graphene under the various electric and magnetic fields, accounting for multiple bounces at edges, and quantum mechanical tunneling at the junction. The theoretical analysis also shed light on why it has been so difficult to measure the predicted Veselago lensing in a robust way, and the group is developing new multi-junction device architectures based on this study. Together the experimental data and theoretical simulation gave the researchers a visual map of the refraction, and enabled them to be the first to quantitatively confirm the relationship between the incident and refracted angles (known as Snell’s Law in optics), as well as confirmation of the magnitude of the transmitted intensity as a function of angle (known as the Fresnel coefficients in optics).

“In many ways, this intensity of transmission is a more crucial parameter,” says Ghosh, “since it determines the probability that electrons actually make it past the barrier, rather than just their refracted angles. The transmission ultimately determines many of the performance metrics for devices based on these effects, such as the on-off ratio in a switch, for example.”

Due to increasing capacity from China, South Korean LCD panel makers are quickly realizing that LCD displays profitability may eventually erode, due to growing capacity and price competition from China, so they are betting their future on organic light-emitting diode (OLED) displays. Because of lower profit margins and slowing market growth, the IT display category has become the first product line that LCD display manufacturers are quitting, according to IHS Markit (Nasdaq: INFO), a world leader in critical information, analytics and solutions.

Samsung Display was the first company to do so, selling a fifth generation (Gen 5) fabrication plant (fab) to a Chinese touch and module maker last year. In the future, more fab restructuring is expected, especially the facilities dedicated to making IT panels. 

“Brands like HP and Lenovo expected notebook panels to be in a surplus situation, and they were therefore keeping their panel inventories at very low levels,” said Jason Hsu, senior principal analyst, IHS Markit. “This shift from Samsung Display could cause some brands to experience panel shortages in the third quarter of 2016.”

BOE to possibly double its panel shipments this year

Samsung Display delivered 30 million notebook panels in 2015, according to the latest information from the IHS Markit Tablet and Notebook Display Market Tracker. With the company’s latest fab reorganization plan, notebook PC LCD panel shipments could fall to 12 million units in 2016 and to 4 million in 2017. There will be an 18 million-unit gap this year, which means brands might not be able to find other sources to keep up with production needs.

When reviewing the supply chain mix in the first quarter of 2016, it is clear that HP has been affected by these changes more than other companies, with shipments from Samsung Display down from 1.1 million units in first quarter to 350,000 units in the second quarter. However, HP has shifted its orders to other panel makers to secure enough panels for its production needs, for example, Innolux.

BOE is another panel maker benefitting from the exit of Samsung Display from this market. Panel shipments from BOE increased from 4.9 million units in the first quarter to 7.2 million in the second quarter. BOE is expected to grow its notebook business to more than 36 million units in 2017. BOE first began to supply panels for notebooks in 2009, and it has now become one of the largest IT panel suppliers. Furthermore, BOE has a Gen8 fab in Chongqing, China — near the world’s largest notebook production base. In fact, notebook panel shipments from the Chongqing fab are expected to grow quickly next year, thanks to the more efficient logistics.

Chinese and Taiwanese makers to increase unit shipments of premium panels 

LG Display and Samsung Display used to supply Apple with notebook panels; however, the fab re-organization — especially the reallocation of oxide capacity — has increased Apple’s concerns about a potential panel shortage and possible low yields. For this reason, Apple is expected to add another panel supplier for its new MacBook Pro, to diversify the risk from Samsung Display business changes. For its legacy MacBook Air line of notebook PCs, Apple is considering diversifying its supply chain to Chinese makers, which is the first time Apple will use LCD panels from China.

Samsung Display’s exit from the LCD display business has also affected the supply of wide-view-angle in-plane switching (IPS) and plane-to-line switching (PLS) displays. Samsung Display has been one of the major suppliers to offer wide-view-angle panels, and its shipment volume is second only to LG Display.

In order to source IPS and PLS panels, brands must find other sources to replace Samsung Display, after the company begins to reduce production. AUO is one of the qualified candidates, and apparently it is receiving more orders from notebook PC brands. AUO, Innolux and other Taiwanese manufacturers and BOE and other Chinese suppliers are all expanding IPS panels to respond to increasing panel requirements.

Today, SEMI announced an exceptional lineup of keynotes at SEMICON Japan’s “SuperTHEATER” focusing on innovation and insights into the future of the electronics supply chain. SEMICON Japan 2016, the largest exhibition in Japan for electronics manufacturing, will take place at Tokyo Big Sight in Tokyo on December 14-16. Registration for the exhibition and programs is now open.

Japan’s semiconductor fab equipment capital expenditure (front-end facilities, both new and used including discretes and LED) is forecast to increase 12 percent (to US$5.0 billion) in 2017, according to the August SEMI World Fab Forecast report.

On December 14, keynotes will focus on the future:

  • Semiconductor Executive Forum – “The Creation of New Business Opportunities” keynotes:
    • Toshiba: Yasuo Naruke, corporate senior executive VP, on “Toshiba Storage Business Strategy; Utilizing Big Data to Win Productivity”
    • TSMC: Jack Sun, VP of R&D and CTO, on “New Frontiers of Semiconductor Innovation”
    • Murata Manufacturing: Hiroshi Iwatsubo, executive VP, on “Business Strategy and Technology Trends”
  • Opening Keynotes – “Into the Future” keynotes:
    • IBM Research:  Dario Gil, VP, Science and Solutions, on “The Cognitive Era and the New Frontiers of Information Technology”
    • University of Tsukuba: Yoichi Ochiai, media artist and assistant professor, Digital Nature Group, on “The Age of Enchantment”

The SEMI Market Forum, also on December 14, with the theme “Outlook and Growth Opportunities in the Electronics Manufacturing Supply Chain” will offer presentations from IHS Markit, VLSI Research Inc., and SEMI.

Highlights on December 15 include Industrial IoT Forum, Autonomous & Connected Car Forum, and U.S. Commercial Service IT Forum. The Technology Trend Forum on December 16 focuses on “The Tokyo 2020 Olympics: Innovation for All.” In addition, SEMICON Japan features forums on Manufacturing Innovation and IoT Innovation.

Attendees at SEMICON Japan will explore the key technologies and business models necessary to grow in the coming years. The SuperTHEATER offers nine keynote forums, all with simultaneous English-Japanese translation, with global top executives.

Platinum sponsors of SEMICON Japan include Disco Corporation, Screen Semiconductor Solutions Co., Ltd. and Tokyo Electron Limited. Gold sponsors include: Advantest Corporation, Applied Materials, Inc., ASE Group, Daihen Corporation, Ebara Corporation, Fasford Technology Co., Ltd., Hitachi High-Technologies Corporation, JSR Corporation, Lam Research Corporation, Nikon Corporation, Tokyo Seimitsu Co., Ltd. and VAT Ltd.

For more information and to register for SEMICON Japan, visit www.semiconjapan.org/en/

Silvaco, Inc., a provider of electronic design automation software and semiconductor IP, today announced that Dr. Jin Jang of Kyung Hee University in Seoul, Korea, has joined the Technical Advisory Board (TAB). Formed in early 2016, the TAB is chartered with providing guidance to Silvaco management and engineering teams on the direction of the company’s technology roadmap, and additional early insight into future technology challenges and breakthroughs. Dr. Jang, an accomplished researcher in information display development, will help the company expand its technology leadership in advanced TFT and OLED displays.

Dr. Jang serves as the Director of the Advanced Display Research Center at Kyung Hee University in Dongjak-gu, Seoul, Korea. He actively pursues display research, publishing 20 to 30 SCI-level papers each year and conducting joint research projects with researchers in the US and UK as well as sharing his research findings via international conferences and special lectures. He is credited with establishing the world’s first Department of Information Display at a major university, and is the recipient of numerous academic and industry awards including the Academic Award from the Korean Vacuum Society, the IEEE George E. Smith award, and the Sottow Owaki Prize from the Society for Information Display (SID) for outstanding contributions to the education and training of students and professionals in the field of information display. Dr. Jang was named an SID Fellow in 2006. Dr. Jang received a BS in Physics at Seoul National University and his PhD in Physics from the Korea Advanced Institute of Science and Technology (KAIST).

“I’m pleased to join Silvaco’s technical advisory board at an exciting time of growth and technical development for the company,” said Dr Jang.  “Creating solutions to the important growing challenges in advanced display development requires close collaboration between industry and academic researchers, and I believe working with Silvaco and the advisory board will accelerate this cooperation.”

“We are honored to welcome Dr. Jang to our technology advisory board,” said David L. Dutton, CEO of Silvaco.  “He is a well-known and highly regarded leader in the information display industry. We appreciate him joining our team and look forward to working closely with him to help us continue our technical leadership in the display segment. His immense knowledge will guide us to align our technology direction to meet the future requirements in TFT and OLED display development.”

STMicroelectronics (NYSE: STM) and WiTricity, an industry pioneer in wireless power transfer over distance, today announced their design collaboration to develop semiconductor solutions for magnetic-resonance-based wireless power transfer. The goal is to “cut the last cord,” bringing convenience to the powering and charging of consumer electronics, Internet of Things (IoT) devices, as well as medical, industrial, and automotive applications.

WiTricity and ST are developing semiconductor solutions that combine WiTricity’s foundational intellectual property and wireless power-transfer mixed-signal IC-design expertise, with ST’s leadership in power-semiconductor design, fabrication, and packaging capabilities and resources. For the consumer electronics and IoT markets, power transmit and receive systems built with these new semiconductors aim to deliver spatial freedom, as well as wireless fast charging of one or more devices at the same time. Dubbed “Wireless Charging 2.0,” the semiconductor solutions built with the magnetic resonance technology will also have unique advantages over current technology, including being able to efficiently charge metal-body smartphones, tablets, and smartwatches.

The contemplated semiconductor offerings include designs that comply with the AirFuel magnetic resonance specification as well as multi-mode solutions that incorporate both resonant and inductive charging. The AirFuel Alliance, a global organization dedicated to delivering the best wireless-charging experience for consumer electronics, is driving an interoperable ecosystem of wireless-charging Power Transfer Transmit Units (PTUs) and Power Receive Units (PRUs) that enable users to charge their devices everywhere; in their homes and offices to public spaces and even in their vehicles.

Beyond the consumer market, WiTricity is the global technology leader in wireless power for automotive, industrial and medical applications. ST and WiTricity demonstrated high-power wireless-transfer technology for electric vehicle charging at APEC 2016 in Long Beach California. For the automotive industry, WiTricity recently announced wireless “park-and-charge” development kits using their industry-leading 11kW solution for electric- and hybrid-vehicle charging. The solution has successfully been tested by the Society of Automotive Engineers (SAE) for inclusion in a new global standard.

“Combining the expertise of WiTricity, the innovator in wireless power-transfer and magnetic resonance technology with ST’s resources and key IP, including Smart Power technologies and RF Bluetooth low energy, allows us to deliver complete, efficient wireless-charging solutions that increase convenience and ease of use while delighting consumers and exceeding their expectations,” said Matteo Lo Presti, Vice President and General Manager, Analog, in the Analog and MEMS Group, STMicroelectronics. “Game-changing technology from this ST and WiTricity collaboration will enable product designers across the globe to rid the world of cumbersome wires and charging cables and allow us to promote a broader set of our own semiconductor offerings into these emerging markets.”

“STMicroelectronics is a global leader in semiconductor solutions for power electronics and a compelling choice to rapidly commercialize fast and efficient wireless-charging chipsets based on WiTricity’s silicon designs and magnetic-resonance technology,” said Alex Gruzen, CEO of WiTricity. “With ST’s vast experience in semiconductor design and fabrication, as well as its access to leaders in the consumer electronics, automotive, and industrial markets, this collaboration puts us in a strong position to accelerate the adoption of resonance-enabled wireless charging.