Yearly Archives: 2017

Researchers from North Carolina State University have found that the transfer of triplet excitons from nanomaterials to molecules also creates a feedback mechanism that returns some energy to the nanocrystal, causing it to photoluminesce on long time scales. The mechanism can be adjusted to control the amount of energy transfer, which could be useful in optoelectronic applications.

Pyrenecarboxylic acid-functionalized CdSe quantum dots undergo thermally activated delayed photoluminescence. Credit: Cedric Mongin

Pyrenecarboxylic acid-functionalized CdSe quantum dots undergo thermally activated delayed photoluminescence. Credit: Cedric Mongin

Felix N. Castellano, Goodnight Innovation Distinguished Chair of Chemistry at NC State, had previously shown that semiconductor nanocrystals could transfer energy to molecules, thereby extending their excited state lifetimes long enough for them to be useful in photochemical reactions.

In a new contribution, Castellano and Cédric Mongin, a former postdoctoral researcher currently an assistant professor at École normale supérieure Paris-Saclay in France, have shown that not only does the transfer of triplet excitons extend excited state lifetimes, but also that some of the energy gets returned to the original nanomaterial in the process.

“When we looked at triplet exciton transfers from nanomaterials to molecules, we noticed that after the initial transfer the nanomaterial would still luminesce in a delayed fashion, which was unexpected,” says Castellano. “So we decided to find out what exactly was happening at the molecular level.”

Castellano and Mongin utilized cadmium selenide (CdSe) quantum dots as the nanomaterial and pyrenecarboxylic acid (PCA) as the acceptor molecule. At room temperature, they found that the close proximity of the relevant energy levels created a feedback mechanism that thermally repopulated the CdSe excited state, causing it to photoluminesce.

Taking the experiment one step further, the researchers then systematically varied the CdSe-PCA energy gap by changing the size of the nanocrystals. This resulted in predictable changes to the resultant excited state lifetimes. They also examined this process at different temperatures, yielding results consistent with a thermally activated energy transfer mechanism.

“Depending on relative energy separation, the system can be tuned to behave more like PCA or more like the CdSe nanoparticle,” says Castellano. “It’s a control dial for the system. We can make materials with unique photoluminescent properties simply by controlling the size of the nanoparticle and the temperature of the system.”

The global wafer mounter equipment market is expected to grow at a CAGR of more than 4% from 2017-2021, according to a new market research report by Technavio.

Global wafer mounter equipment market segmentation by application and product type

Technavio’s report on the global wafer mounter equipment market analyses the business dimensions and presents a comprehensive breakdown in terms of market segmentation by application, including 300 mm (12 inches), 200 mm (8 inches), and 150 mm (6 inches). In 2016, the global wafer mounter equipment market by application was dominated by the 300mm segment, which accounted for a revenue share of close to 64%.

Based on product type, the global wafer mounter equipment market has been segmented into manual wafer mounters, automatic wafer mounters, and semi-automatic wafer mounters. The manual wafer mounters segment dominated the market, accounting for a revenue share of more than 41% in 2016.

“Manual wafer mounters are the most preferred wafer mounters by semiconductor device manufacturers. Leading vendors such as Taiwan Semiconductor Manufacturing Company, GLOBALFOUNDRIES, United Microelectronics, and SMIC are undertaking capital investments to meet the rising requirements for chips as new applications such as the IoT, factory automation, and automobile automation are emerging. The market will slowly transition from manual wafer mounters to automatic wafer mounters as manufacturers look to automate various processes,” says Chetan Mohan, a lead analyst at Technavio for semiconductor equipment research.

 

Global wafer mounter equipment market: competitive vendor landscape

The semiconductor industry is witnessing significant technology transitions in the manufacturing process such as the shift to smaller nodes, the multi-patterning technology, and the growth of MEMS and NEMS devices. To address these requirements of the customers, some of the equipment manufacturers are expected to develop new fabrication equipment that is in line with these technological advances. The semiconductor market is predicted to be driven by the growth of the IoT market, which will increase the demand for sensors, controllers, and embedded non-volatile memory.

Invensas, a wholly owned subsidiary of Xperi Corporation (“Xperi”) (NASDAQ:XPER), today announced the successful technology transfer of its Direct Bond Interconnect to Teledyne DALSA, a Teledyne Technologies company. This capability enables Teledyne DALSA to deliver next-generation MEMS and image sensor solutions that are more compact and higher performance to customers in the automotive, IoT and consumer electronics markets. Teledyne DALSA is a developer of high performance digital imaging and semiconductors and one of the world’s foremost pure-play MEMS foundries. Invensas and Teledyne DALSA announced the signing of a development license in February 2017.

“In partnership with Invensas, we have successfully completed the transfer of its revolutionary DBI technology to our manufacturing facilities in Bromont,” said Edwin Roks, president of Teledyne DALSA. “We are now ready to offer this enabling platform as part of our foundry services to customers, including our own business lines, seeking smaller, higher performance and more reliable MEMS and imaging solutions.”

“The manufacturing team at Teledyne DALSA has done a fantastic job bringing up our DBI process and is well-positioned to enable a new generation of high performance MEMS and image sensor solutions,” said Craig Mitchell, president of Invensas. “We are excited about the prospects for DBI to be integrated into a wide range of Teledyne DALSA’s branded products as well as those of their foundry customers.”

DBI technology is a low-temperature hybrid wafer bonding solution that allows wafers to be bonded with scalable fine pitch 3D electrical interconnect without requiring bond pressure. The technology is applicable to a wide range of semiconductor devices including MEMS, image sensors, RF front ends and stacked memory. DBI 3D interconnect can eliminate the need for through-silicon vias (TSVs) and reduce die size and cost while enabling pixel level interconnect for future generations of image sensors.

More materials for electronic applications could be identified, thanks to the discovery of a new metal-organic framework (MOF) that displays electrical semiconduction with a record high photoresponsivity, by a global research collaboration involving the University of Warwick.

Research published today in Nature Communications shows how high photoconductivity and semiconductor behaviour can be added to MOFs – which already have a huge international focus for their applications in gas storage, sensing and catalysis.

The new work, conducted by Universities in Brazil, the United Kingdom and France – including researchers at Warwick’s Department of Chemistry – found that the new MOF has a photoresponsivity of 2.5 × 105 A.W-1- the highest ever observed.

The MOF has been prepared using cobalt (II) ions and naphthalene diimides and acid as ligands. The structure shows anisotropic redox conduction, according to the directions of the crystal lattice. The conduction mechanism is sensitive to light, and may be modified or modulated according to the incident wavelength.

Photoactive and semiconducting MOFs are rare but desirable for electrical and photoelectrical devices.

These results are the first of this kind concerning MOFs and are the starting point for the possibility of discovery of even more functional materials, displaying properties suitable for practical applications.

The potential for use in electronic components and photoconversion devices, such as solar cells and photocatalysts provides a very exciting future for such materials.

Professor Richard Walton, from Warwick’s Department of Chemistry, commented:

“The material we have discovered paves the way for new applications of a topical family of materials in many areas ranging from technology to energy conversion. We illustrate how MOFs that combine organic and inorganic components can produce unique functional materials from readily available chemicals.

“Our work was underpinned by Warwick’s strengthening collaborative links with Brazilian universities and our exceptional equipment for materials analysis “

North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

SEMI reports that the three-month average of worldwide billings of North American equipment manufacturers in November 2017 was $2.05 billion. The billings figure is 1.6 percent higher than the final October 2017 level of $2.02 billion, and is 27.2 percent higher than the November 2016 billings level of $1.61 billion.

“November billings for North American equipment manufacturers increased modestly for the first time in four months,” said Dan Tracy, Senior Director, Industry Research and Statistics, at SEMI. “Year-to-date equipment spending is well on track to set a historical high, and we expect that positive momentum to continue into next year as new fabs in China begin to equip.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)
Year-Over-Year
June 2017
$2,300.3
34.1%
July 2017
$2,269.7
32.9%
August 2017
$2,181.8
27.7%
September 2017
$2,054.8
37.6%
October 2017 (final)
$2,019.3
23.9%
November 2017 (prelim)
$2,052.2
27.2%

Source: SEMI (www.semi.org), December 2017

 

Toshiba Corporation (TOKYO: 6502), Toshiba Memory Corporation and Western Digital Corporation (NASDAQ: WDC) have entered into a global settlement agreement to resolve their ongoing disputes in litigation and arbitration, strengthen and extend their relationship, and enhance the mutual commitment to their ongoing flash memory collaboration.

As part of this agreement, TMC and Western Digital will participate jointly in future rounds of investment in Fab 6, the memory fabrication facility now under construction at Yokkaichi, including the upcoming investment round announced by Toshiba in October 2017. Fab 6 will be entirely devoted to the mass production of BiCS FLASH, the next-generation of 3D flash memory, starting next year. TMC and Western Digital similarly intend to enter into definitive agreements in due course under which Western Digital will participate in the new flash wafer fabrication facility which will be constructed in Iwate, Japan.

The parties will strengthen their flash memory collaboration by extending the terms of their joint ventures. Flash Alliance will be extended to December 31, 2029 and Flash Forward to December 31, 2027. Flash Partners was previously extended to December 31, 2029.

The parties’ agreement to resolve all outstanding disputes ensures that all parties are aligned on Toshiba’s sale of TMC to K.K. Pangea, a special purpose acquisition company formed and controlled by a consortium led by Bain Capital Private Equity, LP (“Bain Capital”). The parties have agreed on mutual protections for their assets and confidential information in connection with the sale of TMC, and on collaborating to ensure the future success of TMC as a public company following an eventual IPO.

Commenting on the agreement reached today, Dr. Yasuo Naruke, Senior Executive Vice President of Toshiba Corporation and President and CEO of TMC said: “We are very pleased to have reached this outcome, which clearly benefits all involved. With the concerns about litigation and arbitration removed, we look forward to renewing our collaboration with Western Digital, and accelerating TMC’s growth to meet growing global demand for flash memory. Toshiba also remains on track to complete our transaction with the consortium led by Bain Capital by the end of March 2018. This will ensure that TMC has the resources it needs to continue to innovate and deliver for a fast-growing flash memory market, particularly in areas driven forward by advances in AI and IoT.”

Western Digital Chief Executive Officer Steve Milligan stated: “Western Digital’s core priorities have always been to protect the JVs and ensure their success and longevity, guarantee long-term access to NAND supply, protect our interests in the JVs, and create long-term value for our stakeholders. We are very pleased that these agreements accomplish these critical goals, allow Toshiba to achieve its objectives, and also enable us to continue delivering on the power of our platform. I want to thank the hardworking teams at Western Digital and TMC for the dedication they have exhibited over the past several months, operating the JVs without interruption, and we look forward to building upon the success of our 17 year partnership.”

Yuji Sugimoto, Managing Director, Head of Japan for Bain Capital said: “Bain Capital is pleased that Toshiba and Western Digital have resolved all outstanding legal disputes. The settlement represents the best possible outcome for all parties, clearing the way for the Bain Capital-led consortium to complete its acquisition of TMC as planned. We look forward to supporting TMC to achieve its strategic objectives while enhancing these important JVs with Western Digital.”

As part of the global settlement agreement, Toshiba, TMC and Western Digital have agreed to withdraw all pending litigation and arbitration actions.

IXYS Corporation (NASDAQ:IXYS), a global manufacturer of power semiconductors and integrated circuits (ICs) for energy efficiency, power management, transportation, medical, and motor control applications, today announced a new power semiconductor product line: 200V Ultra-Junction X3-Class HiPerFET Power MOSFETs. The current ratings range from 36A to 300A; a broad selection of devices are available in a number of international standard packages.

Fabricated using a charge compensation principle and IXYS’ own process technology, these new MOSFETs exhibit the lowest on-state resistances in the industry (3.5 milliohms in the SOT-227 package and 4 milliohms in the TO-264, for example). Along with gate charges as low as 21 nanocoulombs, these devices enable highest power densities and energy efficiencies in a wide variety of high-speed power conversion applications.

The fast body diodes of the devices are optimized and have low reverse recovery charge and time, thereby suppressing transients and enabling low-noise, high-efficiency power switching. Their low reverse recovery charge and time also boost efficiencies. In addition, these new MOSFETs are avalanche capable and exhibit a superior dv/dt performance (up to 20V/ns).

Targeted applications include synchronous rectification, battery chargers for light electric vehicles (LEVs), motor control (48V-110V systems), DC-DC converters, uninterruptible power supplies, electric forklifts, inverters, power solid state relays, and Class-D audio amplifiers.

The new 200V X3-Class Power MOSFETs with HiPerFET body diodes are available in the following international standard size packages: TO-3P, TO-220 (overmolded or standard), TO-247, PLUS247, TO-252, TO-263, TO-264, TO-268HV, SOT-227. Some example part numbers include IXFP36N20X3, IXFA72N20X3, IXFH90N20X3 and IXFN300N20X3, with current ratings of 36A, 72A, 90A and 300A, respectively.

Additional product information can be obtained by visiting the IXYS website at http://www.ixys.com or by contacting the company directly.

Leti, a research institute of CEA Tech, will demonstrate at CES 2018 its new wristband that measures physical indicators of a range of conditions, including sleep apnea, dehydration and dialysis-treatment response. 

APNEAband provides accurate, real-time detection of sleep-apnea events caused by pauses in breathing or shallow breaths during sleep. The wristband measures heart rate, variation in the time interval between heartbeats, oxygen saturation levels in the blood and stress level. The combination of these four indicators helps physicians make a complete and reliable medical diagnosis of sleep apnea.

“This small wristband eliminates the need to spend the night in a medical lab hooked up to sensors and equipment that measure these key indicators,” said Alexandre Thermet, Leti healthcare industrial partnership manager in the U.S. “APNEAband brings a safe, easy-to-use, affordable and non-invasive solution to detect sleep apnea at home.”

Working with Prof. Jean-Louis Pepin and his team at Grenoble Alpes University and INSERM from the Physiology Laboratory in Grenoble CHU’s hospital, Leti designed, developed and validated an advanced software technology that efficiently extracts and screens health parameters relevant to sleep apnea.  Pr. Pepin, a principal clinical-trial investigator at Grenoble CHU Hospital, and its team provided medical guidelines to support this sleep-apnea project.

APNEAband’s embedded technology can be applied to detect and track various other health conditions, such as acute mountain sickness, dehydration, dialysis treatment response, chronic pain, epileptic seizures, phobia and panic disorder. The wristband’s cardiac-coherence biofeedback also helps people who want to achieve total relaxation with simple breathing exercises. Possible applications also include detecting work-related stress or hot flashes and stress, while playing video games.

A new technique developed by researchers at Technische Universität München, Forschungszentrum Jülich, and RWTH Aachen University, published in Elsevier’s Materials Today, provides a unique insight into how the charging rate of lithium ion batteries can be a factor limiting their lifetime and safety.

State-of-the-art lithium ion batteries are powering a revolution in clean transport and high-end consumer electronics, but there is still plenty of scope for improving charging time. Currently, reducing charging time by increasing the charging current compromises battery lifetime and safety.

“The rate at which lithium ions can be reversibly intercalated into the graphite anode, just before lithium plating sets in, limits the charging current,” explains Johannes Wandt, PhD, of Technische Universität München (TUM).

Lithium ion batteries consist of a positively charged transition metal oxide cathode and a negatively charged graphite anode in a liquid electrolyte. During charging, lithium ions move from the cathode (deintercalate) to the anode (intercalate). However if the charging rate is too high, lithium ions deposit as a metallic layer on the surface of the anode rather than inserting themselves into the graphite. “This undesired lithium plating side reaction causes rapid cell degradation and poses a safety hazard,” Dr. Wandt added.

Dr. Wandt and Dr. Hubert A. Gasteiger, Chair of Technical Electrochemistry at TUM, along with colleagues from Forschungzentrum Jülich and RWTH Aachen University, set out to develop a new tool to detect the actual amount of lithium plating on a graphite anode in real-time. The result is a technique the researchers call operando electron paramagnetic resonance (EPR).

“The easiest way to observe lithium metal plating is by opening a cell at the end of its lifetime and checking visually by eye or microscope,” said Dr. Wandt. “There are also nondestructive electrochemical techniques that give information on whether lithium plating has occurred during battery charging.”

Neither approach, however, provides much if any information about the onset of lithium metal plating or the amount of lithium metal present during charging. EPR, by contrast, detects the magnetic moment associated with unpaired conduction electrons in metallic lithium with very high sensitivity and time resolution on the order of a few minutes or even seconds.

“In its present form, this technique is mainly limited to laboratory-scale cells, but there are a number of possible applications,” explains Dr. Josef Granwehr of Forschungzentrum Jülich and RWTH Aachen University. “So far, the development of advanced fast charging procedures has been based mainly on simulations but an analytical technique to experimentally validate these results has been missing. The technique will also be very interesting for testing battery materials and their influence on lithium metal plating. In particular, electrolyte additives that could suppress or reduce lithium metal plating.”

Dr. Wandt highlights that fast charging for electric vehicles could be a key application to benefit from further analysis of the work.

Until now, there has been no analytical technique available that can directly determine the maximum charging rate, which is a function of the state of charge, temperature, electrode geometry, and other factors, before lithium metal plating starts. The new technique could provide a much-needed experimental validation of frequently used computational models, as well as a means of investigating the effect of new battery materials and additives on lithium metal plating.

The researchers are now working with other collaborators to benchmark their experimental results against numerical simulations of the plating process in simple model systems.

“Our goal is to develop a toolset that facilitates a practical understanding of lithium metal plating for different battery designs and cycling protocols,” explains Dr. Rüdiger-A. Eichel of Forschungzentrum Jülich and RWTH Aachen University.

QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, announced that it has collaborated with Mentor, a Siemens business, to provide a seamless design and development environment for its embedded FPGA (eFPGA) technology. Specifically, Mentor’s Precision Synthesis software has been optimized to support the QuickLogic ArcticProTM architecture used in the company’s eFPGA IP.

QuickLogic will distribute this new version of Precision Synthesis as part of its Aurora development tool suite to provide high performance synthesis technology to eFPGA designers in their next SoC with embedded FPGA IP. The combination of the two tool sets will deliver a seamless development environment supporting a complete design flow, from RTL to programming bitstream, for the embedded FPGA portion of the design.

The tools from both companies have been tuned for implementation efficiency and design performance to enable the effective targeting of designs to the eFPGA IP. By embedding eFPGA technology, SoC developers gain post-manufacturing design flexibility to support design fixes, upgrades, market variants, and rapidly evolving standards or market requirements.

“We are pleased to collaborate with Mentor to give our customers complete design flow support for our eFPGA technology,” said Mao Wang, director of product marketing at QuickLogic Corporation. “Mentor has done an excellent job in enabling their Precision Synthesis software to generate an optimized synthesis netlist for the QuickLogic ArcticPro-based eFPGA architecture.”

“QuickLogic’s eFPGA IP has the potential to be a transformative technology for our SoC customers, and we are looking forward to delivering an outstanding synthesis solution for their Aurora development tools and a continued growth in our partnership,” said Ellie Burns, director of marketing, Calypto Systems Division at Mentor.

Mentor’s Precision Synthesis and QuickLogic Aurora development tools supporting QuickLogic’s eFPGA technology are both available now from QuickLogic Corporation.