Alpha and Omega Semiconductor announces new TO-leadless packaging technology for high current 400A applications

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today introduced the TO-Leadless (TOLL) package in combination with 40V Shield-Gate Technology (SGT) to provide the highest current capability in its voltage class. The TOLL package has the highest current capacity because of AOS’ innovative technology which utilizes a clip to achieve the 400A DC at 25°C capability. The TOLL packaging technology offers very low package resistance and inductance due to the clip technology in comparison to other TO-Leadless packages using standard wire-bonding technology which enables improved EMI performance.

The AOTL66401 (40V) has a 30% smaller footprint compared to a TO-263 (D2PAK) package, including having higher current carry capability that enables the designer to reduce the number of devices in parallel. This new device offers a higher power density in comparison to existing solutions, and is ideally suited for industrial BLDC motor applications and battery management to reduce the number of MOSFETs. The AOTL66401 has a 0.7mOhm max rating at 10Vgs with a maximum drain current of 400A at 25°C and 350A at 100°C case temperature. The pulsed current is rated at 1600A, which is limited by the maximum junction temperature of 175°C.

“With the significant performance improvement, the TOLL with clip technology is a robust package which enables low package parasitics reducing EMI. The AOTL66401 simplifies new designs with the higher current density to enable savings in overall system cost due to a reduced number of devices in parallel. AOS’ TOLL package is best suited for high power applications,” said Peter H. Wilson.


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