12/18/2018  Researchers at the University of Florida, the U.S. Naval Research Laboratory and Korea University provide a detailed perspective on the properties, capabilities, current limitations and future developments for one of the most promising UWB compounds, gallium oxide.

12/11/2018  Lattice Semiconductor Corporation announced the appointment of Glenn O’Rourke as the Company’s Corporate Vice President, Global Operations, effective immediately.

12/10/2018  Synopsys, Inc. announced today another milestone in its longstanding partnership with imec.

12/04/2018  Leti, a research institute at CEA Tech, has reported breakthroughs in six 3D-sequential-integration process steps that previously were considered showstoppers in terms of manufacturability, reliability, performance or cost.

12/03/2018  Mutliferroics are promising candidates for new type of memory and logic circuits.

11/26/2018  MagnaChip Semiconductor announced that volume production has commenced for an IGBT product for power module targeted to high-voltage industrial applications.

11/19/2018  The secret ingredient for the next generation of more powerful electronics could be air, according to new research.

11/14/2018  MIRPHAB, a European Commission project to create a pilot line to fabricate mid-infrared (MIR) sensors by 2020, is accepting proposals from companies that want to develop and prototype new MIR devices that operate in gas-and-liquid media.

11/14/2018  Micron Technology, Inc., (Nasdaq: MU) today announced at Electronica 2018 that it will collaborate with the BMW Group to further advance the development of automotive memory solutions used in vehicles.

11/12/2018  GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF's 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash) technology.

11/08/2018  SRC research focused on next-generation semiconductor technology continues to attract the world's leading semiconductor design and manufacturing companies.

10/31/2018  Renesas Electronics Corporation today announced that it has resolved at the Meeting of Board of Directors held on October 31, 2018 to consolidate its wholly-owned subsidiary Renesas Semiconductor Package & Test Solutions Co, Ltd.

10/31/2018  Innodisk is launching its industrial-grade 3D NAND SSD series, making the newest NAND flash technology available for the challenging requirements of embedded and industrial applications.

10/30/2018  This mmWave product is the world's first single-chip silicon-on-insulator (SOI) DSA to support the entire 9 kHz to 55 GHz frequency range.

10/29/2018  Q3 sales are highest on record, 4.1 percent more than previous quarter, 13.8 percent higher than Q3 of last year.

10/24/2018  Cadence Design Systems, Inc. today announced that its custom and analog/mixed-signal (AMS) IC design tools have achieved certification for Samsung Foundry’s 7nm Low Power Plus (7LPP) process technology.

10/24/2018  In the era of a slowing Moore's Law, advanced packaging has emerged as the savior of future semiconductor development.

10/22/2018  Dr. Taheri will be taking Silvaco’s advanced positions in FinFET and beyond nodes, novel materials, emerging memory and advanced display technologies, to the next level.

10/19/2018  Technologies introduced at the event include 7nm LPP EUV, SmartSSD and 256GB 3DS RDIMM.

10/15/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced the introduction of a new High-Voltage Super Junction MOSFET with a 900V breakdown voltage and low total gate charge.