06/05/2017  All-carbon, spintronic proposal could lead to smaller, better performing structures in electronics.

06/05/2017  Flagship researchers integrate graphene and quantum dots with CMOS technology to create an array of photodetectors, producing a high resolution image sensor.

06/01/2017  Top spenders expected to represent 83% of total semiconductor industry spending this year.

06/01/2017  SEMI’s year-to-date worldwide semiconductor equipment billings year-to-date through March show a 59.6 percent gain to the same period last year.

05/31/2017  Imec and Cascade announced the successful development of a fully-automatic system for pre-bond testing of advanced 3D chips.

05/31/2017  22% forecast increase driven by system growth, rising ASPs for memory and logic devices.

05/11/2017  Synopsys, Inc. today announced that its IC Validator was successfully deployed on some of the industry's largest and most advanced designs to accelerate design rule checking (DRC) closure.

04/24/2017  Researchers at Tokyo institute of Technology presented a design guide for reducing 30% of thermal resistance for 3-dimensional (3D) stacked devices compared with the conventional ICs using solder bump joint structure.

04/19/2017  Samsung expands 10nm capacity, to be ready for production by the fourth quarter of this year.

04/17/2017  According to the latest market study released by Technavio, the electrostatic discharge (ESD) packaging market is projected to grow to USD 5.42 billion by 2021, at a CAGR of more than 8% over the forecast period.

04/14/2017  DDR4 and DDR3 forecast to represent 97% of sizzling 2017 DRAM market.

04/13/2017  In 2016, the MOSFET market recovered, after a minor downturn in 2015.

04/05/2017  Cadence Design Systems, Inc. today announced the release of the new Virtuoso Advanced-Node Platform supporting advanced 7nm designs.

04/05/2017  A recent study, affiliated with UNIST has created a three-dimensional, tactile sensor that could detect wide pressure ranges from human body weight to a finger touch. This new sensor with transparent features is capable of generating an electrical signal based on the sensed touch actions, also, consumes far less electricity than conventional pressure sensors.

04/04/2017  2016 was the year of strong consolidations in the semiconductor industry. Yole Developpement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.

03/31/2017  Series of nine white papers mark milestone effort for strategic initiative that identifies challenges and solutions to help guide future roadmaps.

03/30/2017  New SIA-SRC report calls for robust research investments throughout the semiconductor industry and value chain.

03/30/2017  Huge spike in DRAM and NAND flash ASPs prompts market forecast revision to 11% increase.

03/29/2017  Synopsys, Inc. today announced that its IC Validator physical verification product has been successfully used for signoff on more than 100 tapeouts at advanced FinFET nodes.

03/27/2017  ATTOPSEMI Technology, Ltd. today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program, to provide a scalable, non-volatile one-time programmable (OTP) memory IP to be compatible with GF's 22FDX technology.