02/17/2017  Wafer bonding and 3D interconnect technology to enable delivery of next-generation MEMS and image sensor solutions.

02/17/2017  With this partnership, SEMCO will license GE microelectronics packaging patent portfolio, covering the fabrication of substrates embedded with electronic circuits.

02/17/2017  The explosive growth in demand for internet bandwidth and cloud computing capacity brings a new set of technology challenges and opportunities for the semiconductor supply chain.

02/14/2017  The market is expected to be worth USD 170.46 billion in 2022, at a CAGR of 38.30% between 2016 and 2022.

02/10/2017  The company is investing in its existing leading-edge fabs in the United States and Germany, expanding its footprint in China with a fab in Chengdu, and adding capacity for mainstream technologies in Singapore.

02/09/2017  Grant A. Pierce, chief executive officer (CEO) of Sonics, Inc. was elected by the Board of Directors of the Electronic System Design Alliance (ESD Alliance) to serve as its chairman.

02/09/2017  The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

02/09/2017  Significant and noticeable IC market growth closely tied to significant worldwide GDP growth.

02/07/2017  Former Standard Products Division of NXP combines experience, product and operational excellence with customer focus and ambition.

02/06/2017  Toshiba America Electronic Components, Inc. (TAEC) has added a new photorelay to its extensive lineup of photocouplers.

02/01/2017  Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2016, representing 18.2 percent of the total worldwide market, according to Gartner, Inc.

01/30/2017  Axcelis Technologies, Inc. announced today that it has received orders for the Purion H high current implanter from two leading manufacturers of memory devices in the Asia Pacific region.

01/27/2017  Technavio’s latest market research report on the global field-programmable gate array (FPGA) market provides an analysis of the most important trends expected to impact the market outlook from 2017-2021.

01/26/2017  The global semiconductor chip packaging market is expected to grow at a CAGR of more than 31% during the forecast period.

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.

01/23/2017  STATS ChipPAC Pte. Ltd. announced today that it has been ranked among the world's top 10 semiconductor equipment manufacturing companies in the 2016 Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers.

01/20/2017  Breakthrough results pave the way to multi-layer 3D ICs with high density interconnects realized by automated wafer-to-wafer bonding technology.

01/19/2017  Richard Beyer and John Hodgson will retire from the Company's Board of Directors, effective as of the Company's 2017 Annual Meeting of Shareholders.

01/19/2017  TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan- out WLP (FO-WLP).

01/19/2017  The expert panel, "The Future of M&A in the Semiconductor Industry," was a hot topic at SEMI's Industry Strategy Symposium (ISS) conference on January 11.