01/13/2017  This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market.

01/12/2017  X-Fab, SMIC, and TowerJazz each grew by ?30% last year.

01/09/2017  Solid upside potential for DRAM, flash memory markets in 2017 and much of forecast period.

01/09/2017  ON Semiconductor announced a collaboration with Hexius Semiconductor to qualify several of their analog intellectual property (IP) blocks in its popular ONC18 0.18 µm CMOS process.

01/05/2017  Imagine a dim light which is insufficiently bright enough to illuminate a room. An amplifier for such a light would increase the brightness by increasing the number of photons emitted. Photonics researchers have created such a high gain optical amplifier that is compact enough to be placed on a chip. The developed amplifier would help to efficiently increase the power of the transmitted light before it is completely depleted through optical losses.

01/05/2017  Online paper submissions are now open for the 2017 Symposia on VLSI Technology and Circuits, to be held at the Rihga Royal Hotel in Kyoto, Japan from June 5 - 8, 2017.

12/21/2016  Analysts see another chance for Silicon-on-Insulator technology, as proponents claim technical and cost advantages for fully-depleted SOI.

12/21/2016  Researchers from IBM and GlobalFoundries will report on the first use of "air-gaps" as part of the dielectric insulation around active gates of "10nm-node" finFETs at the upcoming International Electron Devices Meeting (IEDM) of the IEEE.

12/16/2016  GLOBALFOUNDRIES today announced the addition of eight new partners to its growing FDXcelerator Program, including Advanced Semiconductor Engineering, Inc. (ASE Group), Amkor Technology, Infosys, Mentor Graphics, Rambus, Sasken, Sonics, and QuickLogic.

12/16/2016  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

12/15/2016  Embedded die in substrate platform has its own history and adoption scheme compared to other advanced packaging platforms.

12/14/2016  Amkor Technology, Inc. today announced completion of product qualification for its innovative new Silicon Wafer Integrated Fan-Out Technology (SWIFT).

12/09/2016  The Global Semiconductor Alliance (GSA) is proud to announce the award recipients honored at the 2016 GSA Awards Dinner Celebration that took place in Santa Clara, California.

12/07/2016  “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.

12/07/2016  Two years of busy M&A activity boost marketshare among top suppliers.

12/02/2016  Tessera Holding Corporation today announced it has completed the acquisition of DTS, Inc.

12/01/2016  QuickLogic Corporation, a developer of ultra-low power programmable sensor processing, display bridge and programmable logic solutions, today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program.

11/30/2016  ChipMOS TECHNOLOGIES INC. and Tsinghua Unigroup Ltd. today announced an agreement to form a joint-venture and to mutually terminate Tsinghua Unigroup's earlier private placement plan.

11/17/2016  Qualcomm Incorporated today announced that its subsidiary, Qualcomm Technologies, Inc., and Samsung Electronics Co., Ltd., have extended their decade-long strategic foundry collaboration to manufacture Qualcomm Technologies' latest Snapdragon premium processor, Qualcomm Snapdragon 835, with Samsung's 10nm FinFET process technology.

11/15/2016  Synopsys, Inc. today announced it expanded its test and yield analysis solution targeting FinFET-specific defects to enable higher quality testing, repair, diagnostics and yield analysis of advanced 7nm SoCs.