11/08/2016  Silicon photonic technologies have reached the tipping point that precedes massive growth.

11/03/2016  Lattice Semiconductor Corporation and Canyon Bridge Capital Partners, Inc. today announced that Lattice and Canyon Bridge Acquisition Company, Inc., an affiliate of Canyon Bridge, have signed a definitive agreement under which Canyon Bridge will acquire all outstanding shares of Lattice for approximately $1.3 billion.

11/03/2016  Leti, an institute of CEA Tech, and PYXALIS, a French SME specializing in high-performance image sensors, today announced a new technology that lowers readout noise for image sensors down to 0.5 electron noise and dramatically improves low-light image sensing capabilities.

11/02/2016  In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole in its report Status and Prospects for the Advanced Packaging Industry.

10/30/2016  The 62nd annual IEDM will be held in San Francisco December 3 - 7, 2016.

10/30/2016  Lam talks about process control and default roadmaps.

10/30/2016  Toshiba was the first to commercially implement CMOS image sensors with backside TSV last technologies in 2007. Many of us stated in 2007 that further advances could be obtained by removing the CMOS circuitry to a separate layer and forming a true 3D chip stack, but the technology imple- mentation had to wait while the industry first converted to back side imaging technology.

10/25/2016  Synopsys, Inc. today announced that its Custom Compiler tool has been certified by Samsung Electronics Co., Ltd. to support their 10-nanometer (nm) LPP (Low Power Plus) process.

10/24/2016  180nm CMOS and HV-CMOS MPW runs are now manufactured in ams' 200mm fabrication facility in Austria.

10/21/2016  A new design for transistors which operate on 'scavenged' energy from their environment could form the basis for devices which function for months or years without a battery, and could be used for wearable or implantable electronics.

10/19/2016  Rebound in DRAM market helps raise outlook for total IC market.

10/17/2016  Samsung Electronics Co., Ltd. today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry.

10/12/2016  Murata Manufacturing Co., Ltd. and IPDiA S.A. today announced that Murata Electronics Europe B.V., a wholly-owned subsidiary of Murata is about to acquire IPDiA, a 3D silicon capacitor technology developer headquartered in France, and IPDiA will become a subsidiary of Murata.

10/06/2016  This year again, both market segments, high end and low end, are the main targets of the TSV technologies providers.

10/06/2016  In the quest for faster and more powerful computers and consumer electronics, big advances come in small packages.

10/05/2016  Today, SEMI announced an exceptional lineup of keynotes at SEMICON Japan's "SuperTHEATER" focusing on innovation and insights into the future of the electronics supply chain.

10/03/2016  Mentor Graphics Corporation today announced that it has joined the Wide Band Gap integration (WBGi) power electronics consortium to participate in thermal management and power cycling initiatives.

09/28/2016  Synopsys, Inc. today announced that TSMC is recognizing Synopsys with three "2016 Partner of the Year" awards for Interface IP and joint development of 7-nanometer (nm) mobile and HPC design platforms.

09/26/2016  The advanced semiconductor summit will take place on 23-25 January, 2017 at Minatec in Grenoble, France, with the theme "European 3D Summit 2017 – Creating High Density Systems."

09/21/2016  Key features of the cell structure, design and integration of the Micron 3D 32L FG-NAND device are discussed, and compared with Samsung’s 32L and 48L V-NAND device.