09/21/2016  At the 2016 ECTC Conference, TSMC discussed their UFI (UBM-Free Integration) Fan-In WLCSP technology which they claim enables large die fine pitch packages.

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

09/20/2016  Toshiba America Electronic Components, Inc. has expanded its family of 24nm single-level cell (SLC) NAND flash memory solutions.

09/20/2016  Ted Shafer of ASML reports on the highlights from the ?200mm manufacturing session during SEMICON West, organized by the SEMI Secondary Equipment and Applications Special Interest Group.

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

09/16/2016  Nordson Corporation today announced it plans to combine its existing screw and barrel operations in Youngstown, Ohio; New Castle, Pennsylvania; and Pulaski, Virginia into a single expanded manufacturing center of excellence in Austintown, Ohio.

09/15/2016  This technology provides more processing power for data centers, networking, premium mobile processors, and deep learning applications.

09/08/2016  GLOBALFOUNDRIES today unveiled a new 12nm FD-SOI semiconductor technology, extending its leadership position by offering the industry's first multi-node FD-SOI roadmap.

09/08/2016  GLOBALFOUNDRIES today announced a new partner program, called FDXcelerator, an ecosystem designed to facilitate 22FDX system-on-chip (SoC) design and reduce time-to-market for its customers.

09/02/2016  Stretchable, flexible, reliable memory device inspired by the brain.

09/01/2016  SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.

08/31/2016  A novel 'plastic crystal' developed by Hokkaido University researchers has switching properties suitable for memory-related applications.

08/26/2016  Littelfuse, Inc. today announced it has entered into definitive agreements to acquire the product portfolio of transient voltage suppression diodes, switching thyristors and insulated gate bipolar transistors for automotive ignition applications from ON Semiconductor Corporation for a combined purchase price of $104 million.

08/23/2016  2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC, changed the game and may create a trend of acceptance of Fan-Out packages

08/23/2016  Total pure-play foundry market expected to jump 9% this year, up from 6% growth in 2015.

08/22/2016  Researchers at Queen's University Belfast and ETH Zurich, Switzerland, have created a new theoretical framework which could help physicists and device engineers design better optoelectronics.

08/17/2016  SEMI announced today that over 43,000 visitors are expected to attend SEMICON Taiwan September 7-9 at the TWTC Nangang Exhibition Hall in Taipei.

08/16/2016  Reno Sub-Systems today announced that it has secured its first platform design win for its Electronically Variable Capacitor (EVC) matching network.

08/16/2016  New wafer processing technologies overcome FOWLP’s technical hurdles, paving the way for a new generation of ultra compact, high I/O electronic devices.

08/15/2016  Semiconductor processes have long been a mystery for many circuit designers. They didn’t need to worry about how chips were fabricated most of the time, thanks to the many EDA innovations that make their jobs easier and complex designs possible.