06/28/2016  Ultratech's AP300 lithography systems will be used for next-generation, high-volume, fan-out wafer-level packaging applications.

06/22/2016  Greater demand for energy efficiency in systems, cars, portable electronics, and new connections to the Internet of Things will steadily drive power transistor sales to new record-high levels in the next three years.

06/22/2016  Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.

06/21/2016  Papers that address the theme "Inflections for a Smart Society" are highlighted.

06/21/2016  Collaborating to build out design to fabrication ecosystem.

06/21/2016  Earlier this year, a Taipei Times headline read “New packaging may spur TSMC growth” adding that despite its weak revenue growth guidance for this quarter, TSMC, might see stronger growth from next quarter thanks to its InFO (integrated fan out) packaging technology.

06/16/2016  Driven by a strong semiconductor market outlook and aggressive investment in advanced packaging capability fueled by strong government support, advanced packaging revenue in China is expected to reach US$ 4.6 billion in 2020, against US$ 2.2 billion in 2015.

06/16/2016  Today, at the 2016 Symposia on VLSI Technology & Circuits, nano-electronics research center imec presented gate-all-around (GAA) n- and p-MOSFET devices made of vertically stacked horizontal silicon (Si) nanowires (NWs) with a diameter of only 8nm.

06/16/2016  The new GAA-NWFET is a promising candidate for advanced logic & analog/RF applications, and scaled SRAM cells.

06/14/2016  Today, SEMI announced that the latest packaging solutions will be the topic of an in-depth session at the SEMICON West 2016 Advanced Packaging Forum - and on display on the exhibition floor.

06/10/2016  The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $25.8 billion for the month of April 2016.

06/10/2016  While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

06/08/2016  Dr. Dongkai Shangguan is currently the Chief Marketing Officer of STATS ChipPAC. Previously, Dongkai served as the founding CEO of the National Center for Advanced Packaging Co., Ltd. (“NCAP China”), worked for 10 years at Ford Motor Company in various technical and management functions, and for 11 years at Flextronics as Corporate Vice President of Global Advanced Technology.

05/25/2016  Automotive systems forecast to remain a major application in Europe and Japan.

05/24/2016  Tessera Technologies, Inc. announced today that it and certain of its subsidiaries filed legal proceedings for patent infringement in both domestic and international jurisdictions against Broadcom.

05/23/2016  GLOBALFOUNDRIES today announced a next-generation radio-frequency (RF) silicon solution for its Silicon Germanium (SiGe) high-performance technology portfolio.

05/20/2016  Synopsys, Inc. today announced that the company's Custom Compiler tool has been enabled by Samsung for 14 nanometer (nm) LPP and LPC FinFET production.

05/12/2016  Qualcomm, Micron, and SK Hynix registered ?25% drops, with total top-20 sales off by 6%.

05/11/2016  EV Group (EVG) announced that it has received multiple orders for its GEMINI FB XT automated fusion wafer bonders from multiple leading device manufacturers.

05/11/2016  Reflects strong demand for eWLB in mobile market with accelerating adoption in Internet of Things, wearables, MEMS and automotive applications.