10/11/2018  GLOBALFOUNDRIES today announced the addition of nine new partners to its growing RFwave Partner Program.

10/10/2018  GOWIN Semiconductor today announced that its GW1NS product family was named a 2018 Arm TechCon Innovation Award finalist for design innovation of the year.

10/05/2018  Synopsys, Inc. today announced the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS) advanced packaging technologies.

10/05/2018  To scale down a transistor below a 5nm node is one of the vital concerns for VLSI industry as there are various challenges due to the shrinking of components. Several researches are going on worldwide to overcome the challenges of future technology nodes. Among them, this article reviews the potential transistor structures and materials like Carbon Nano-tube FET, Gate-All-Around FET, and Compound Semiconductors as solutions to overcome the problems of scaling the existing silicon FinFET transistor below 5nm node.

10/04/2018  2017 saw aggregated CIS industry revenue of US$13.9 billion. And 5 years later, the consulting company Yole announces more than US$ 23 billion.

10/01/2018  Synopsys, Inc. today announced delivery of automotive-grade DesignWare Controller and PHY IP for TSMC's 7-nanometer (nm) FinFET process.

09/28/2018  Dr. Lee brings to JCET a wealth of expertise and veteran leadership with 20 years of extensive semiconductor packaging and test experience.

09/26/2018  Driven by cryptocurrency device demand, TSMC's China sales are expected to surge by 79% this year.

09/26/2018  RF SOI technology builds on manufacturing legacy that reaches new milestone with more than 40 billion chips shipped.

09/25/2018  Feature-rich semiconductor platform delivers competitive performance and scalability for next-generation compute applications.

09/18/2018  Keysight Technologies, Inc. (NYSE: KEYS), a technology company that helps enterprises, service providers, and governments accelerate innovation to connect and secure the world, today announced that the company's 3D planar electromagnetic (EM) simulator, Momentum, has been certified for GLOBALFOUNDRIES (GF) 22FDX, 22nm Fully-Depleted Silicon-On-Insulator (FD-SOI) technology.

09/17/2018  The 2 new embedded FPGA devices were designed with low power, small package size, and low cost in mind. 

09/11/2018  Japan is at the heart of the semiconductor industry as the era of artificial intelligence (AI) dawns. SEMICON Japan 2018 will highlight AI and SMART technologies in Japan's industry-leading event.

09/11/2018  This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.

09/07/2018  Educate the industry about the latest in advanced processes and materials.

08/29/2018  Flash memory is forecast to represent the largest share of capital spending while DRAM capex grows at the highest rate this year.

08/29/2018  Election reflects growing influence of vertical integration in IC design.

08/28/2018  GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients in high-growth markets.

08/23/2018  Lacey succeeds Carl Schlachte, the company’s prior Interim CEO, who is resigning as a director of Immersion.

08/22/2018  Samsung Electronics, Intel and SK Hynix continued to lead the semiconductor market in Q2 2018.