10/05/2015  The path to alternative scaling is now open.

09/30/2015  Novati Technologies Inc. announced the availability of an advanced Integrated Sensor Platform, placing a wide variety of sensors onto multi-layer stacks of wafers in order to consume less power and perform significantly faster while reducing overall footprint.

09/30/2015  At the 61st annual IEEE International Electron Devices Meeting (IEDM) subjects under discussion will encompass a range of topics critical to the continuing progress of the industry.

09/28/2015  The official Call for Papers has been issued for the 2016 Symposia on VLSI Technology and Circuits, to be held at the Hilton Hawaiian Village June 13-16, 2016 (Technology) and June 15-17, 2016 (Circuits).

09/18/2015  The upcoming IEEE S3S Conference 2015 in Sonoma, CA, on October 5-8, will focus on key technologies for the IoT era.

09/03/2015  In 2014, the automotive sector significantly outperformed the overall market average for semiconductors.

09/02/2015  SEMICON Taiwan 2015 opened today starting a three-day event drawing over 43,000 attendees from electronics manufacturing.

09/01/2015  At the 65th IEEE ECTC, several companies presented advances in thermos-compression bonding.

08/31/2015  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company is experiencing strong demand for its automated 300mm polymer adhesive wafer bonding systems.

08/28/2015  The acquisition expands on Tessera’s existing advanced packaging capabilities by adding a low-temperature wafer bonding technology platform that will accelerate delivery of 2.5D and 3D-IC solutions to semiconductor industry customers.

08/21/2015  Startups and small electronics companies spent $78.3 billion on semiconductors in 2014, representing 23 percent of the total market, compelling semiconductor companies to revisit their sales strategy to focus on the large number of smaller organizations than relying on big deals from large customers, research firm Gartner said.

08/20/2015  A book-to-bill of 1.02 means that $102 worth of orders were received for every $100 of product billed for the month.

08/18/2015  With trade policy dominating headlines in recent weeks, all eyes were on Maui in the waning days of August as trade ministers from twelve nations convened for perhaps the final time to finalize the Trans-Pacific Partnership (TPP).

08/18/2015  The Semiconductor Industry Association (SIA) announced former Defense Secretary Leon Panetta will deliver the keynote address at the upcoming SIA Award Dinner, taking place on Thursday, Dec. 3 in San Jose, Calif.

08/17/2015  Do we still think the 2D NAND Flash technologies have hit the scaling wall?

08/11/2015  Scientists at Rice University have created a solid-state memory technology that allows for high-density storage with a minimum incidence of computer errors.

08/10/2015  Designed for use in smartphones and tablets, the backside-illuminated (BSI) chips are among the world's smallest class of CMOS image sensors, and achieve both high-performance image capture and low power consumption.

08/06/2015  Toshiba Corporation today announced the development of the world’s first 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology.

08/05/2015  STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today the promotion and appointment of Dr. Han Byung Joon as Co-President and Chief Executive Officer for the Company, together with Mr. Tan Lay Koon.

07/31/2015  According to Yole, 3D TSV technology is expected to reach $4.8B billion in revenues by 2019.