07/31/2015  SEMICON West 2015 had a strong and rich undercurrent – the roadmap forward is most certainly 3DIC.

07/27/2015  Within the photolithography equipment market reaching $150M in 2014, advanced packaging applications experienced the strongest growth.

07/22/2015  SEMI today announced the fourth annual European 3D Summit. Entitled ?European 3D Summit 2016: Above and Beyond TSV,? the advanced semiconductor Summit will take place on January 18-20, 2016 in Minatec in Grenoble, France.

07/14/2015  At this year’s Design Automation Conference (DAC) in San Francisco, Brian Otis, a Director at Google, talked about how hundreds of millions of people are at risk of diabetes – and how a smart contact lens that continuously monitors blood glucose levels and transmits the data to a smartphone might just be the ideal solution.

07/13/2015  Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing.

07/13/2015  GLOBALFOUNDRIES today launched a new semiconductor technology developed specifically to meet the ultra-low-power requirements of the next generation of connected devices.

07/13/2015  Applied Materials, Inc. today unveiled the Applied Olympia ALD system, featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.

07/10/2015  Engineered SOI substrates are now a mainstream option for the semiconductor industry.

07/09/2015  IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using micro- and nanoelectronics, and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realized an innovative 3D chip called “3DNoC” to demonstrate the use of 3D stacking technology in scalable, complex digital systems-on-chip (SoCs).

06/29/2015  As these early days of the Internet of Things show the network’s promise and reveal technological challenges that could threaten its ability to meet user expectations in the years ahead, technology providers will be charged with supplying the solutions that will meet those challenges.

06/16/2015  CEA-Leti will host a workshop on major trends in Fully Depleted Silicon-on-Insulator process and design technologies in connection with the 17th annual LetiDays Grenoble, June 24-25.

06/16/2015  SK Hynix Inc. announced today that it is shipping mass production volumes of 1st generation High Bandwidth Memory (HBM1) based on SK hynix’s advanced 20nm-class DRAM process technology.

06/11/2015  As if scaling to 7nm geometries and going vertical with FinFETs, TSVs and other emerging technologies wasn’t challenge enough, the emerging market for connected smart devices will bring more changes to the semiconductor sector. And then there’s 3D printing looming in the wings.

06/11/2015  Europe’s leading nanoelectronics institutes, Tyndall National Institute in Ireland, CEA-Leti in France and imec in Belgium, have entered a €4.7 million collaborative open-access project called ASCENT (Access to European Nanoelectronics Network).

06/10/2015  Integrated Silicon Solution, Inc. today announced that it has finalized a definitive agreement to be acquired by Cypress Semiconductor Corporation for $20.25 per share in cash.

06/08/2015  Taiwan Semiconductor Manufacturing wants you to know that they’re ready, willing, and able to help you design chips with 10-nanometer features.

06/08/2015  CEA-Leti announced today during the Design Automation Conference that seven partners have joined its new FD-SOI IC development program, Silicon Impulse.

06/05/2015  Imec researchers have developed a novel technique – termed conductive atomic force microscopy tomography (or scalpel C-AFM) – that enables a three-dimensional characterization of emerging logic and memory devices.

06/02/2015  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced it has reached a critical milestone in providing a design infrastructure for its 14-nanometer (nm) FinFET process technology.

05/29/2015  SEMI this week announced the SEMICON West 2015 test and packaging program agendas.