03/18/2015  The recent acquisition of Freescale Semiconductor by NXP Semiconductors would catapult the merged entity into the world’s eighth-largest chipmaker, positioning the newly minted giant for an even more formidable presence in key industrial sectors, according to IHS.

03/18/2015  Ziptronix Inc., a developer and provider of patented, low-temperature direct bonding technology for 3D integration, today announced a patent licensing agreement with Sony Corporation for application in advanced image sensors.

03/12/2015  XMC, a 300mm semiconductor manufacturing company, today announces it has shipped over 100 million Backside Illumination (BSI) CMOS Image Sensor (CIS) units.

03/12/2015  IC Insights’ March Update to the 2015 McClean Report (being released later this month) refreshes the forecasts for 33 major IC product categories through 2019.

03/05/2015  IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a platform for multi-project-wafer, post-process 3D integration (3D-MPW).

03/03/2015  Embedded die in substrate: what are the next steps for the growth?

03/03/2015  Chipmaker NXP Semiconductors NV announced Sunday night that it has agreed to buy Freescale Semiconductor Ltd for $11.8 billion and merge business operations.

02/26/2015  This week, at the 2015 International Solid State Circuits Conference (ISSCC), imec, in collaboration with Tyndall National Institute, the University of Leuven (KULeuven) and the Ghent University, demonstrated a 4x20Gb/s wavelength division multiplexing (WDM) hybrid CMOS silicon photonics transceive

02/23/2015  At the SPIE Advanced Lithography conference in San Jose, Calif., Applied Materials, Inc., today announced the industry's first in-line 3D CD SEM metrology tool for solving the challenges of measuring the high aspect ratio and complex features of 3D NAND and FinFET devices.

02/20/2015  3DICs are assumed to suffer from stronger thermal issues when compared to equivalent implementations in traditional single-die integration technologies.

02/19/2015  Micron Technology, Inc. today announced that Robert Peglar has been named as vice president of Advanced Storage Solutions.

02/17/2015  Samsung Electronics Co., Ltd. announced that it has begun mass production of industry’s first mobile application processor using the advanced 14-nanometer (nm) FinFET process technology.

02/11/2015  Amkor Technology, Inc. today announced that Susan Y. Kim has been appointed as a new member of the Company’s Board of Directors.

02/09/2015  Mentor Graphics Corporation today announced the embedded systems industry's broadest portfolio for industrial automation.

02/09/2015  Spansion Inc. and XMC, China's fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology.

02/03/2015  Driven by mobile and automotive applications, the CIS industry is expected to grow at a CAGR of 10.6 percent from 2014 – 2020.

01/20/2015  Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

01/15/2015  Amkor Technology, Inc. today announced the settlement of its outstanding litigation and arbitration proceedings with Tessera, Inc.

01/15/2015  UC Berkeley Extension announces three online integrated circuit (IC) semiconductor technology programs to meet the training needs of the surging worldwide semiconductor industry; the industry is predicted to reach $345 billion in sales this year.

01/15/2015  Orbotech Ltd. today announced that SPTS Technologies is collaborating with Fraunhofer IZM, an international institute specializing in applied and industrial contract research, on next generation wafer level packaging of microelectronic devices.