3D Integration

3D INTEGRATION ARTICLES



A new dimension for integrated circuits: 3D nanomagnetic logic

09/30/2014  Electrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits.

Tessera Technologies names Craig Mitchell as CTO and president of Invensas

09/29/2014  Tessera Technologies, Inc. today announced it has named Craig Mitchell as chief technology officer for Tessera and president of Invensas Corporation, effective immediately.

TSMC delivers first fully functional 16 finFET networking processor

09/29/2014  TSMC today announced that its has successfully produced the foundry segment's first fully functional ARM-based networking processor with FinFET technology, through its collaboration with HiSilicon Technologies Co, Ltd.

Rudolph introduces new acoustic metrology and defect inspection technology

09/18/2014  Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

Global shutter image sensors

09/09/2014  Different GS pixel architectures and technologies are presented and performances compared.

Contour Semiconductor awarded three new U.S. patents

09/04/2014  Contour Semiconductor, Inc., a developer of non-volatile memory technologies, today announced it has been awarded three new patents to back its Diode Transistor Memory (DTM) technology, the world's lowest production-cost, non-volatile memory technology.

SEMICON Taiwan 2014 opens today with spotlight on 3D-IC, sustainable manufacturing, and MEMS

09/03/2014  Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend firm nearly $24 billion in the next two years on equipment and materials, powering excitement for SEMICON Taiwan 2014, which opened today in Taipei.

Intel releases new packaging, test technologies for 14nm foundries

08/27/2014  Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.

New ClassOne electroplater a "sellout" at SEMICON West

08/25/2014  When ClassOne Technology introduced its new Solstice electroplating systems at SEMICON West last month they didn’t expect to actually sell their first production unit off the show floor, but that’s what happened.

MEMSIC introduces the world's first monolithic and wafer level packaged 3D-axis accelerometer

08/15/2014  MEMSIC, Inc., a MEMS sensing solution provider, announced today the availability of its MXC400xXC, the world's first monolithic 3D accelerometer, and also the first 3D accelerometer to utilize WLP technology.

Si2 announces new director of 3DIC programs

08/14/2014  The Silicon Integration Initiative (Si2), a global semiconductor standards consortium, announced today that Herb Reiter is joining the team of professionals in the role of Director, 3D IC Programs.

Materials matter — Enabling the future of IC fabrication and packaging

07/31/2014  The SEMI Strategic Materials Conference, held September 30–October 1 in Santa Clara, Calif., will examine the drivers for new materials and how they impact material suppliers and the value chain they serve.

Fusion bonding for next-generation 3D-ICs

07/24/2014  Recent developments in wafer bonding technology have demonstrated the ability to achieve improved bond alignment accuracy.

A*STAR and industry partners form S$200M semiconductor R&D joint labs

07/24/2014  Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isn’t slowing down. But its steady acceleration isn’t happening spontaneously, and Tuesday’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.

The Connected Experience: A Manufacturer’s Dream?

07/09/2014  Imagine being able to not only track and address equipment degradation in real time, but also analyze patterns in your factories’ equipment and address potential issues before they even present a problem. It may sound too good to be true, but Microsoft’s Sanjay Ravi explained in Wednesday morning’s keynote that this innovation is becoming available now to manufacturers.

Trends in Next-Generation MEMS Discussed in TechXPOT Forum

07/09/2014  The microelectromechanical system (MEMS) device market is forecast to increase at a compound annual growth rate of 13 percent over the next five years, reaching $24 billion in 2019, according to Jean-Christophe Eloy, president and CEO of Yole Développement.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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