11/21/2013  Foundry 2.0 partnership with Open-Silicon and Amkor Technology yields successful 2.5D test vehicle project.

11/20/2013  SUSS MicroTec has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

11/05/2013  Clearly Moore's law is about cost, and Gordon Moore’s observation was that the optimum number of components (nowadays - transistors) to achieve minimum cost will double every year.

10/30/2013  At the recent ECTC conference, various presentations addressed silicon interposers for 2.5D (Shinko), CoWoS reliability (TSMC) and microbumping (imec).

10/30/2013  3D atomic force microscopes can measure critical dimensions, line edge roughness and sidewall roughness in a way that is highly accurate, non-destructive and cost-effective.

10/23/2013  While the number of materials used in semiconductor logic will increase approximately 50 percent in the transition from 32nm to 22nm production, the materials revolution in memory will be even more pronounced, challenging developers, manufacturers, equipment, and materials suppliers, according to experts speaking at the SEMI Strategic Materials Conference 2013, held in Santa Clara on October 16-17.

10/23/2013  CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

10/21/2013  In the 1960s, James Early of Bell Labs proposed three-dimensional structures as a natural evolution for integrated circuits. Since then many attempts have been made to develop such a technology.

10/16/2013  Nanoelectronics research center imec and Excico have successfully demonstrated the application of laser thermal anneal (LTA) to boost the current in vertical polysilicon channel devices for 3D memory.

10/15/2013  Small form factor, high speed and performance, and high bandwidth capability with low battery consumption are desired traits for many packaging solutions for integrated circuits (ICs).

10/15/2013  At IEDM, IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.

10/14/2013  Recent blogs address semiconductors in healthcare (blood cell sorters), FinFETs and logic roadmaps, 450mm progress, panel level embedded tech, materials innovation, options to reduce mask write time, SOI and EUV.

10/09/2013  For the first time, researchers have mapped this EUV emission and developed a theoretical model that explains how the emission depends on the three-dimensional shape of the plasma.

10/04/2013  Researchers from Taiwan’s National Nano Device Laboratories avoided the use of TSVs by fabricating a monolithic sub-50nm 3D using a novel CMP technique.

10/02/2013  Ultra low power (ULP) RF specialist Nordic Semiconductor ASA today announces the release of the world's first multi-protocol SoC solution offering concurrent ANT+ and Bluetooth low energy wireless communication natively in a single chip.

09/26/2013  GE Healthcare Finland Oy, in partnership with GE Idea Works, announced today that it has completed the acquisition of Imbera Electronics Oy.

09/25/2013  Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about upcoming events related to 3D ICs.

09/25/2013  Micron Technology, Inc. announced today that it is shipping 2GB Hybrid Memory Cube (HMC) engineering samples.

09/24/2013  Next-generation integrated devices for matching, filtering and protection help shrink circuit size and boost end-product performance.

09/18/2013  A wide array of package level integration technologies now available to chip and system designers are reviewed.