09/18/2013  The HMC provides a breakthrough solution that delivers unmatched performance with the utmost reliability.

09/18/2013  At The ConFab conference in Las Vegas in June, Mike Ma, VP of Corporate R&D at Siliconware (SPIL), announced a new business model for interposer based SiP’s, namely the “turnkey OSAT model.” In his presentation “The expanding Role of OSATS in the Era of System Integration,” Ma looked at the obstacles to 2.5/3D implementation and came up with the conclusion that cost is still a significant deterrent to all segments.

09/05/2013  The history of semiconductors has been a history of collaboration. Today, a similar industry-wide collaborative approach to 3D stacked ICs is needed to reach widespread 3D-IC adoption and continue the amazing progress our industry has historically achieved.

09/05/2013  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, will honor professors from Stanford University and University of Texas at Austin with awards for chip-related research and education at SRC’s annual TECHCON conference Sept. 9-10.

09/04/2013  EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via semiconductor packaging applications.

09/03/2013  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp platform for room-temperature wafer bonding and debonding processes.

08/30/2013  Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about recent predictions regarding the demise of continued scaling.

08/28/2013 

Entegris, Inc. and imec announced they are collaborating to advance the development and broaden the adoption of 3D integrated circuits.

08/14/2013 

Samsung today introduced the first solid state drive (SSD) based on its recently released 3D V-NAND technology. Samsung announced its new SSD, designed for use in enterprise servers and data centers, during a keynote at the Flash Memory Summit 2013.

08/06/2013 

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about Samsung's recent announcement on 3D vertical NAND.

08/06/2013 

New technology represents a breakthrough in overcoming NAND scaling limit and ushers in a new 3D memory era.

08/01/2013 

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about the appearance of 3D integration on several roadmaps.

08/01/2013 

Cascade Microtech, Inc. and imec today announced breakthroughs in probing stacked integrated circuits (3D-SICs), fueling an important growth engine for the semiconductor market.

07/31/2013 

Israel Beinglass, CTO of MonolithIC 3D Inc., blogs about roadmap misses and the relationship between two seemingly unrelated technologies. 

07/28/2013  Bit-growth slows while specialized stacking accelerates innovation in future memory solutions for communications, energy, and health-care.

07/24/2013 

Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its industry-leading NSX 320 Automated Macro Defect Inspection System.

07/18/2013 

A variety of techniques and materials have been developed to successfully achieve bonding/debonding for 3D integration, but Tony Flaim, chief technology officer of Brewer Science (Rolla, MO) says they are still too complicated.

07/17/2013 

Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.

07/10/2013 

Leaders of research consortia from around the world sat down to share updates and insights with SEMICON West attendees on Wednesday morning.

07/09/2013 

Dow Corning announced Monday that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics.