09/20/2012 

At this year’s IEDM, a team led by Korea’s Gwangju Institute of Science and Technology will detail a high-speed pattern-recognition system comprising CMOS “neurons” and an array of resistive-RAM (RRAM)-based “synapses,” which demonstrated STDP, a brain-like function.

09/20/2012 

At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.

09/19/2012 

SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.

09/17/2012 

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.

09/14/2012 

Singapore’s A*STAR’s Institute of Microelectronics (IME), and Hitachi Chemical Co., will be collaborating on a joint research program to develop high performance material technologies for thin wafer processing for 3D IC packaging.

09/13/2012 

The National Institute of Standards and Technology (NIST) says it's combined scanning techniques and statistical data to both more precisely and less expensively measure features on a chip -- and two big chip firms are already on board.

09/12/2012 

Samsung Electronics Co., Ltd., held a groundbreaking ceremony for a major new memory fabrication line in Xi'an, China. Once completed, the new facility will make use of advanced 10-19nm technology to produce NAND flash memory chips, according to the company.

09/10/2012 

EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).

09/10/2012 

09/04/2012 

Singapore's Institute of Microelectronics (IME) and MOSIS have signed a memorandum of understanding (MOU) to offer a multiple-project wafer service targeting silicon integrated photonics.

08/29/2012 

STATS ChipPAC says it has expanded its through-silicon via (TSV) capabilities with a 300mm mid-end manufacturing operation targeting mid-end-of-line semiconductor manufacturing, including microbump technology down to 40?m, temporary bond/de-bonding, backside via reveal, isolation, and metallization.

08/28/2012 

Brian Cronquist, MonolithIC 3D Inc.'s VP of Technology and IP reports on recent progress on low temperature (less than 400°C) bonding and cleaving processes.

08/23/2012 

Rambus Inc. (NASDAQ:RMBS), a technology licensing company, will undergo a restructuring and related cost saving measures to cut its expenses by$30-35 million annually.

08/22/2012 

ASMC 2013, the leading international technical conference for exploring solutions to improve collective microelectronics manufacturing expertise, has issued a call for papers.

08/21/2012 

Tessera received an initial payment of approximately $20 million from semiconductor packaging company Amkor, related to the interim award issued by the International Court of Arbitration of the International Chamber of Commerce (ICC).

08/15/2012 

The Hybrid Memory Cube Consortium released the initial draft of the Hybrid Memory Cube (HMC) interface specification, with the final version planned for end of 2012.

08/10/2012 

Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.

08/10/2012 

In this SEMI News and Views blog, Karen Savala covers EUV lithography, 450mm wafers, and 3D IC developments, based on her recent presentation at SEMICON West, “Supply Chain Readiness in an Era of Accelerated Change.”

08/09/2012 

Heavy monsoons moving through the Philippines are causing floods in and around Manila, the capital. The Philippines is a small but growing area for microelectronics manufacturing and packaging facilities.

08/02/2012 

The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.