06/01/2012 

A main focus of this year’s Electronic Components and Technology Conference (ECTC), held this week in San Diego, is 3D integration and through silicon vias (TSVs).

05/31/2012 

Xilinx Inc. (NASDAQ:XLNX) began shipping a 3D heterogeneous all-programmable FPGA, the Virtex-7 H580T FPGA, using its stacked silicon interconnect (SSI) technology to reach up to 16 28Gbps and 72 13.1Gbps transceiver bandwidth.

05/30/2012 

Ziptronix Inc. is helping a 3D memory device maker replace standard die stacking with its DBI wafer-stacking technology, which has been proven in image sensor packaging.

05/29/2012 

Increased demand for product functionality is driving up IC packaging revenue faster -- a 9.8% compound annual growth rate (CAGR) -- than IC unit growth -- 7.3% CAGR 2010-2016, says New Venture Research (NVR).

05/24/2012 

The 10^th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”

05/22/2012 

Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packaging alternative to wide-I/O TSV packaging.

05/19/2012 

Amkor Technology Inc. (NASDAQ:AMKR) plans to build a state-of-the-art factory and global research and development center in the Incheon Free Economic Zone, which is located in the greater metropolitan area of Seoul, Korea.

05/15/2012 

TSMC

05/03/2012 

Solid State Technology is proud to announce that David McCann will speak at The ConFab 2012. David, the Senior Director for Packaging R&D at GLOBALFOUNDRIES in Malta, New York, will speak on the evolution toward silicon-based interconnect and packaging, which is having profound impact on how we think about technology development and the supply chain.

04/26/2012 

After pioneering low-cost wafer- and panel-based glass and silicon interposers in Phase 1 of its SiGI consortium, Georgia Tech Packaging Research Center is beginning Phase 2 in June.

04/26/2012 

At its Fab 8, GLOBALFOUNDRIES is installing a special set of production tools to create TSV in 20nm wafers. 3D die stacking of leading-edge chips will enable mobile and consumer electronics.

04/26/2012 

SEMATECH experts reported on innovative processes for advanced CMOS logic and memory device technologies and 3D TSV manufacturing at the International VLSI Technology, System and Applications Symposium (VLSI-TSA).

04/23/2012 

Semiconductor packaging service provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) appointed Pasquale Pistorio as a member of the Board of Directors, effective immediately.

04/18/2012 

The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.

04/12/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- ? dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

04/12/2012 

The ConFab 2012, an invitation-only global conference and business meeting on semiconductor manufacturing, June 3-6 in Las Vegas, selected speakers and sessions for 2012.

04/11/2012 

Georgia Tech's Packaging Research Center proposes a new consortium on 3D semiconductor packaging called 3D ThinPack for ultra-miniaturized 3D heterogeneous, RF, digital and power modules in partnership with global companies.

04/11/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the second day: OLED TFT displays, single transistor DRAMs, silicon photonic wires, CNTs, 3D optical interconnects, graphene for RF and sensing, transparent ZnO, epidermal electronic systems, stretchable electronics, ultra-low-k dielectrics, patterning of electroceramics, PRAM (an alternative to NRAM), and inkjet printing of superconducting films.

04/10/2012 

CEA-Leti and passive component maker IPDiA developed an atomic layer deposition (ALD) process to apply medium-k dielectric layers on a metal-insulator-metal capacitor architecture, enabling 3D capacitors.

04/10/2012 

Endicott Interconnect Technologies has appointed David W. Van Rossum to the position of Chief Financial Officer, effective immediately.