07/11/2018  Overspending by the major NAND suppliers expected to further cool NAND flash prices this year.

07/11/2018  As the commercial IC fabrication industry continues to shrink field-effect transistor (FET) sizes, 2D planar structures evolved into 3D fins which are now evolving into 3D stacks of 2D nano-sheets.

07/10/2018  To keep up with Moore's Law, the semiconductor industry continues to push the envelope in developing new device architectures containing novel materials.

07/10/2018  Increasingly complicated 3D structures such finFETs and 3D NAND require very high aspect ratio etches. This, in turn, calls for higher gas flow rates to improve selectivity and profile control. Higher gas flow rates also mean higher etch rates, which help throughput, and  higher rates of removal for etch byproducts.

07/09/2018  Optimized stepping, based on parallel analysis of die placement errors and prediction of overlay errors, can increase lithography throughput by more than an order of magnitude and deliver commensurate reductions in cost of ownership. The productivity benefits of optimized stepping are demonstrated using a test reticle with known die placement errors.

07/09/2018  Market shares of semiconductor equipment manufacturers shifted significantly in Q1 2018 as Applied Materials, the top supplier dropped, according to the report “Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts,” recently published by The Information Network.

07/09/2018  Today at its Imec Technology Forum USA in San Francisco, imec, the research and innovation hub in nano-electronics and digital technology, announced that it has demonstrated ultra-low power, high-bandwidth optical transceivers through hybrid integration of Silicon Photonics and FinFET CMOS technologies.

07/05/2018  Ideal for industrial applications that demand high-accuracy sensing, including sonar and optical sensors.

06/26/2018  TowerJazz, the global specialty foundry, today announced details on its 13th annual Technical Global Symposium (TGS) being held in China, Japan, and the United States.

06/22/2018  The global organic CMOS image sensor market is expected to value at $696.0 million in 2020, and is projected to reach $1,750.0 million by 2025, registering a CAGR of 20.9% from 2021 to 2025.

06/21/2018  The semiconductor industry posted record results in 2017, with revenue exceeding US$400 billion.

06/20/2018  At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology, will present a process flow for a complementary FET (CFET) device for nodes beyond N3.

06/19/2018  At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology presented considerable progress in enabling germanium nanowire pFET devices as a practical solution to extend scaling beyond the 5nm node.

06/15/2018  Marshall (Mac) Blythe has joined Micross in the role of General Manager of Component Modification Services (CMS) located in Hatfield, PA.

06/14/2018  pSemi Corporation (formerly known as Peregrine Semiconductor), a Murata company focused on semiconductor integration, announces the availability of the PE29101 gallium nitride (GaN) field-effect transistor (FET) driver for solid-state light detection and ranging (LiDAR) systems.

06/08/2018  Winbond’s new high-performance Serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s.

06/05/2018  New RF power transistors simplify design and manufacturing.

06/05/2018  IEEE, the world's largest technical professional organization dedicated to advancing technology for humanity, and the IEEE Electronics Packaging Society (EPS) today announced Dr. William Chen as the recipient of the 2018 IEEE Electronics Packaging Award.

06/01/2018  Synopsys, Inc. today announced that it has collaborated with Toshiba Memory Corporation to accelerate the verification of Toshiba Memory Corporation's BiCS FLASH vertically stacked three-dimensional (3D) flash memory.

05/31/2018  New President & CEO Jean-Marc Chery to lead newly formed Executive Committee.