3D Integration

3D INTEGRATION ARTICLES



Arbe Robotics selects GlobalFoundries for its high-res imaging radar

04/26/2018  Arbe Robotics' proprietary chipset leverages GF's 22FDX technology to deliver industry's first real-time 4D imaging radar for level 4 and 5 autonomous driving.

Orbotech's SPTS Technologies honored with Queen's Award for Enterprise in Innovation 2018

04/24/2018  The award recognizes SPTS's development of novel physical vapor deposition (PVD) process solutions for Fan-Out Wafer Level Packaging (FOWLP) of semiconductor devices.

Semiconductor assembly and packaging services: Rising number of fabs is driving the market

04/23/2018  Technavio market research analysts forecast the global semiconductor assembly and packaging services market to grow at a CAGR of close to 5% during the period 2018-2022, according to their latest report.

Nexperia secures $800M financing to fund future growth plans

04/19/2018  Discrete semiconductor company’s refinancing supported by major global banks.

SEMI and TechSearch International report global semiconductor packaging materials market reaches $16.7B

04/18/2018  SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017.

Toshiba releases automotive 40V N-channel power MOSFETs in new package

04/11/2018  Reduced on-resistance from use of a small low-resistance package.

6 key takeaways from ISS Europe 2018

04/11/2018  With its leading research and development hubs, materials and equipment companies and chipmakers, the EU is in a strategic position in the global electronics value chain to support the growth of emerging applications such as autonomous driving, internet of things, artificial intelligence and deep learning.

ON Semiconductor introduces digital image sensor with low light sensitivity and signal-noise ratio

04/10/2018  ON Semiconductor introduced the industry’s first 1/1.7-inch 2.1 megapixel CMOS image sensor featuring ON Semiconductor’s newly developed 4.2?m Back Side Illuminated (BSI) pixels.

China now world's largest consumer of semiconductor packaging equipment and materials

04/02/2018  Fueled by heavy government investment, IC packaging and testing in China generated $29 billion in revenue in 2017, making China the world's largest consumer of packaging equipment and materials.

Optoelectronics, sensors/actuators, and discretes hit record-high sales

03/29/2018  Total revenues in the three O-S-D market segments climbed 11% in 2017 -- the strongest growth rate since 2010 -- and continue to be driven by high demand for sensors, actuators, CMOS imaging devices, light sensors, laser transmitters, and power discretes.

New insights from failures

03/26/2018  To be able to guarantee the reliability of transistors, we have been conducting research for some years now at imec to see what happens when transistors operate properly and when they fail.

U.S. companies maintain largest share of fabless company IC sales

03/23/2018  China-based companies show the largest fabless IC marketshare gain since 2010.

Synopsys acquires Silicon and Beyond Private Limited

03/22/2018  Synopsys, Inc. today announced it has acquired Silicon and Beyond Private Limited, a provider of high-speed SerDes technology used in data intensive applications such as machine learning, cloud computing, and networking.

"Technology, Circuits & Systems for Smart Living" theme for 2018 Symposia on VLSI Technology & Circuits

03/21/2018  Bringing together a technical program that encompasses 'big integration' of a number of critical industry trends -- machine learning, IoT, artificial intelligence, wearable/implantable biomedical applications, big data, and cloud computing -- the 2018 Symposia on VLSI Technology & Circuits will showcase a convergence of technologies needed for 'smart living.'

Automotive chip manufacturing in Japan drives innovation

03/21/2018  In Tokyo, Shanghai, Moscow, London, Paris or New York – wherever you are in the world –Japanese vehicles passing by on the roadways are a common sight.

U.S. trade tensions with China hit fever pitch

03/21/2018  Stiff tariffs and the dismantling of longstanding trade agreements – cornerstones of these new actions – will ripple through the semiconductor industry with particularly damaging effect.

SEMICON West 2018 to spotlight smart technologies, workforce development

03/20/2018  SEMICON West has opened registration for the July 10-12, 2018, exposition at the Moscone Center in San Francisco, California.

Everspin signs long-term patent license agreement with Alps Electric

03/19/2018  Under the agreement, Alps and Everspin will mutually grant licenses to magnetoresistive-based 3D sensor patent portfolios for magnetoresistive sensor products.

The ConFab 2018 announces conference agenda and speakers

03/16/2018  Browse this slideshow for a look at this year's speakers, keynotes, panel discussions, and special guests.

IC Insights raises 2018 IC market forecast from 8% to 15%

03/15/2018  Increased expectations for the DRAM and NAND flash markets spur upward revision.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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