03/09/2018  The Board has discontinued the role of Executive Chairman, which was established in 2014 as part of a leadership transition plan, based on its belief that an independent Chairman is now more appropriate for Qualcomm. The Board has named Jeffrey W. Henderson, an independent Qualcomm director since 2016, to serve as Non-Executive Chairman.

03/08/2018  Synopsys, Inc. today announced a collaboration with Samsung Foundry to develop DesignWare Foundation IP for Samsung's 8nm Low Power Plus (8LPP) FinFET process technology.

03/07/2018  Skyrocketing DRAM prices potentially open the door for startup Chinese competitors.

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

02/27/2018  Co-developed technology solution enables significant power and die size reductions for IoT and wearable products.

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

02/21/2018  Despite increasing costs of development, IC manufacturers are still making great strides.

02/21/2018  Nordson Corporation announces that the SEMI Foundation has appointed Joseph Stockunas, Corporate Vice President for Electronics Systems at Nordson Corporation and the immediate past chair of the SEMI North America Advisory Board, to the SEMI Foundation Board of Trustees in accordance with the association's by-laws.

02/16/2018  Since Apple unveiled iPhone X with face-recognition functionality in early November 2017, interest in 3D sensing technology has reached fever pitch and attracted huge investments across the related supply chains.

02/12/2018  MagnaChip Semiconductor Corporation announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory.

02/09/2018  Samsung Electronics Co., Ltd. today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.

02/05/2018  With its 72-Layer 512Gb (Gigabits) 3D NAND Flash chips, the company is paving the way for its full-fledged entrance to the high value-added eSSD market.

02/05/2018  Global industry posts highest-ever annual, quarterly, and monthly sales.

02/02/2018  Nordson MARCH, a Nordson company introduces the MesoSPHERE Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level – handling wafers up to 450mm and panels up to 480mm.

02/02/2018  Air Products today announced it has been awarded the industrial gases supply for Samsung Electronics' second semiconductor fab in Xi'an, Shaanxi Province, western China.

02/01/2018  Though accounting for less than half of total MPU sales, data-handling cellphones, tablets, and MPUs for embedded processing applications to keep MPU market active through 2022.

01/30/2018  Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today introduced AONE36132, a 25V N-Channel MOSFET in a dual DFN 3.3x3.3 package which is ideal for synchronous buck converters.

01/26/2018  Company's advanced 300mm RF SOI offering is ready for volume production.

01/25/2018  Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2017, representing 19.5 percent of the total worldwide market, according to Gartner, Inc.