11/07/2017  The RC delay issues started a few nodes ago, and the problems are becoming worse.

10/26/2017  An international team of researchers has created a proof of concept that uses the deep-depletion regime in bulk-boron-doped diamond MOSFETs to increase hole channel carrier mobility.

10/24/2017  The number of IC packages utilizing wafer-level packaging (WLP) will overtake flip chip shipments in 2018 and then continue growing at a compound annual growth rate of 15% (between 2014 and 2020) compared to just 5% for flip chip, according to the report recently published by The Information Network.

10/18/2017  The annual revenue from the global IC testing and packaging industry for 2017 is estimated to grow by 2.2% to reach US$51.73 billion, according to the latest research from TrendForce.

10/18/2017  Samsung Electronics Co., Ltd. announced today that 8-nanometer (nm) FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

10/17/2017  With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.

10/13/2017  Leti, a research institute of CEA Tech, will hold a workshop on Oct. 17 to present updates on their progress developing CoolCube high-density 3D sequential, monolithic-integration technology, and their supporting design-and-manufacturing ecosystems.

10/12/2017  Next week, as part of the IEEE S3S 2017 program, MonolithIC 3D Inc. will present a paper (18.3) titled “A 1,000x Improvement in Computer Systems by Bridging the Processor Memory Gap”.

10/12/2017  The new chip was fabricated by Intel and features a unique design to achieve improved yield and performance.

10/11/2017  Researchers image perfectly smooth side-surfaces of 3-D silicon crystals with a scanning tunneling microscope, paving the way for smaller and faster computing devices.

10/10/2017  The global CMOS image sensor market is expected to grow at a CAGR of more than 12% during the forecast period, according to Technavio’s latest market research.

10/04/2017  Worldwide sales up 24 percent year-to-year and 4 percent month-to-month; Americas market leads the way with growth of 39 percent year-to-year and 9 percent month-to month.

10/03/2017  Workshop will highlight rapid advancements in automotive electronics technologies and applications, and explore technical and business barriers and opportunities that are best addressed collectively across the supply chain.

10/03/2017  There has been a great deal of speculation around the composition of Intel’s Optane XPoint memory technology. TechInsights set about to find answers.

10/02/2017  The SEMI International Standards Committee, at their SEMICON West 2017 meeting, approved the transformation of the existing 3D Stacked IC Committee and Assembly & Packaging Committee into a single, unified 3D Packaging and Integration Committee.

09/29/2017  Jointly developed 14HP process is world’s only technology that leverages both FinFET and SOI.

09/27/2017  Inventory corrections, economic uncertainty, and price erosion derailed the power transistor market in the last five years, but the 2017 O-S-D Report sees steady modest growth ahead.

09/25/2017  Synopsys, Inc. today announced that the Synopsys Design Platform has been fully certified for use on Samsung Foundry's 28FDS (FD-SOI) process technology.

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.