02/26/2019  The Electronic System Design Alliance, a SEMI Strategic Association Partner, today opened nominations for member company executives to serve on the ESD Alliance Governing Council for the next two-year term.

02/25/2019  Cadence Design Systems, Inc. today announced that Toshiba Memory Corporation has successfully used the Cadence CMP Process Optimizer, a model calibration and prediction tool that accurately simulates multi-layer thickness and topography variability for the entire layer stack, to accelerate the delivery of its advanced 3D flash memory devices.

02/25/2019  Soitec, a designer and manufacturer of innovative semiconductor materials, today announced it is the first materials supplier to join the China Mobile 5G Innovation Center.

02/22/2019  GOWIN Semiconductor Corp. announces the release of GOWIN's new EDA tool, YunYuan 1.9.

02/21/2019  Synopsys, Inc. and GLOBALFOUNDRIES today announced a collaboration to develop a portfolio of automotive Grade 1 temperature DesignWare Foundation, Analog, and Interface IP for the GF 22-nm Fully-Depleted Silicon-On-Insulator process.

02/20/2019  'Physically unclonable function' is 10 times more reliable than previous methods.

02/20/2019  Researchers at CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.

02/19/2019  IP to accelerate energy-efficient SoC designs and push the boundaries of single-chip integration.

02/15/2019  eSilicon, a provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the achievement of multiple milestones related to the company's growth in the tier one FinFET ASIC market, serving high-bandwidth networking, high-performance computing, AI and 5G infrastructure.

02/15/2019  Cadence Design Systems, Inc. today announced that GLOBALFOUNDRIES (GF) has chosen Cadence as the primary EDA tool vendor for use in Avera Semi, a GF subsidiary, for advanced node chip design projects.

02/14/2019  The semiconductor industry showed impressive figures in 2017: +21.6% YoY growth to reach about US$ 412 billion.

02/13/2019  The RF GaN industry is showing an impressive growth with a 23% CAGR between 2017 and 2023, driven by telecom and defense applications. By the end of 2017, the total RF GaN market was close to US$380 million and 2023 should reach more than US$1.3 billion with an evolving industrial landscape.

02/01/2019  KLA Corporation today announced the appointment of Victor Peng to its board of directors.

02/01/2019  3D die-stacking technologies, manufacturing barriers, and growing complexities in end-use systems among the technical challenges that are expected to lift R&D growth rates through 2023.

01/30/2019  Inaugural summit offers latest insights in semiconductor manufacturing and applications.

01/30/2019  SEMI met with Martin Schrems, director of Strategy and Business Development at AT&S AG, to discuss Fan-Out technology trends ahead of SEMI 3D & Systems Summitin Dresden, Germany.

01/23/2019  ZEISS today unveiled a new suite of high-resolution 3D X-ray imaging solutions for failure analysis (FA) of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages.

01/17/2019  2018 semiconductor M&A valued at $23.2 billion, down from the record $107.3 billion in 2015.

01/17/2019  Rambus Inc. today announced it has acquired the assets of Diablo Technologies to broaden its portfolio in the hybrid DRAM and Flash memory markets.

01/14/2019  SEMI Taiwan Testing Committee founded to strengthen the last line of defense to ensure the reliability of advanced semiconductor applications.