3D Integration

3D INTEGRATION ARTICLES



Nominations open for ESD Alliance Governing Council

02/26/2019  The Electronic System Design Alliance, a SEMI Strategic Association Partner, today opened nominations for member company executives to serve on the ESD Alliance Governing Council for the next two-year term.

Cadence CMP Process Optimizer enables Toshiba Memory to accelerate delivery of advanced 3D Flash memory devices

02/25/2019  Cadence Design Systems, Inc. today announced that Toshiba Memory Corporation has successfully used the Cadence CMP Process Optimizer, a model calibration and prediction tool that accurately simulates multi-layer thickness and topography variability for the entire layer stack, to accelerate the delivery of its advanced 3D flash memory devices.

Soitec joins China Mobile 5G Innovation Center

02/25/2019  Soitec, a designer and manufacturer of innovative semiconductor materials, today announced it is the first materials supplier to join the China Mobile 5G Innovation Center.

GOWIN Semiconductor announces release of the new GOWIN EDA tools for improved performance on new FPGA product families

02/22/2019  GOWIN Semiconductor Corp. announces the release of GOWIN's new EDA tool, YunYuan 1.9.

Synopsys and GLOBALFOUNDRIES collaborate to develop industry's first automotive grade 1 IP for 22FDX process

02/21/2019  Synopsys, Inc. and GLOBALFOUNDRIES today announced a collaboration to develop a portfolio of automotive Grade 1 temperature DesignWare Foundation, Analog, and Interface IP for the GF 22-nm Fully-Depleted Silicon-On-Insulator process.

Rice U. researchers unveil Internet of Things security feature

02/20/2019  'Physically unclonable function' is 10 times more reliable than previous methods.

CEA-Leti and Stanford target edge-AI apps with breakthrough NVM memory cell

02/20/2019  Researchers at CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.

GlobalFoundries and Dolphin Integration to deliver differentiated FD-SOI adaptive body bias solutions

02/19/2019  IP to accelerate energy-efficient SoC designs and push the boundaries of single-chip integration.

eSilicon builds momentum as a strong tier one FinFET ASIC supplier

02/15/2019  eSilicon, a provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the achievement of multiple milestones related to the company's growth in the tier one FinFET ASIC market, serving high-bandwidth networking, high-performance computing, AI and 5G infrastructure.

Cadence selected as primary EDA tool vendor by GLOBALFOUNDRIES

02/15/2019  Cadence Design Systems, Inc. today announced that GLOBALFOUNDRIES (GF) has chosen Cadence as the primary EDA tool vendor for use in Avera Semi, a GF subsidiary, for advanced node chip design projects.

Advanced packaging: At the heart of innovation

02/14/2019  The semiconductor industry showed impressive figures in 2017: +21.6% YoY growth to reach about US$ 412 billion.

Who is leading the RF GaN IP landscape?

02/13/2019  The RF GaN industry is showing an impressive growth with a 23% CAGR between 2017 and 2023, driven by telecom and defense applications. By the end of 2017, the total RF GaN market was close to US$380 million and 2023 should reach more than US$1.3 billion with an evolving industrial landscape.

KLA-Tencor appoints Victor Peng to Board of Directors

02/01/2019  KLA Corporation today announced the appointment of Victor Peng to its board of directors.

Semiconductor R&D spending will step up after slowing

02/01/2019  3D die-stacking technologies, manufacturing barriers, and growing complexities in end-use systems among the technical challenges that are expected to lift R&D growth rates through 2023.

SEMI 3D & Systems Summit showcases heterogeneous 3D integration

01/30/2019  Inaugural summit offers latest insights in semiconductor manufacturing and applications.

Fan-out system-in-board technology: Enabling RF and processor module and system-level integration

01/30/2019  SEMI met with Martin Schrems, director of Strategy and Business Development at AT&S AG, to discuss Fan-Out technology trends ahead of SEMI 3D & Systems Summitin Dresden, Germany.

ZEISS launches new high-resolution 3D X-ray imaging solutions

01/23/2019  ZEISS today unveiled a new suite of high-resolution 3D X-ray imaging solutions for failure analysis (FA) of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages.

Value of semiconductor mergers and acquisitions falls considerably

01/17/2019  2018 semiconductor M&A valued at $23.2 billion, down from the record $107.3 billion in 2015.

Rambus acquires memory technology assets of Diablo Technologies

01/17/2019  Rambus Inc. today announced it has acquired the assets of Diablo Technologies to broaden its portfolio in the hybrid DRAM and Flash memory markets.

Advanced testing paradigm shifting in era of heterogeneous integration

01/14/2019  SEMI Taiwan Testing Committee founded to strengthen the last line of defense to ensure the reliability of advanced semiconductor applications.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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