12/05/2018 Leti, a research institute at CEA Tech, has proven that RRAM-based ternary-content addressable memory (TCAM) circuits, featuring the most compact structure developed to date, can meet the performance and reliability requirements of multicore neuromorphic processors.
12/04/2018 Leti, a research institute at CEA Tech, has reported breakthroughs in six 3D-sequential-integration process steps that previously were considered showstoppers in terms of manufacturability, reliability, performance or cost.
12/04/2018 A team of scientists from Arizona State University's School of Molecular Sciences and Germany have published in Science Advances online today an explanation of how a particular phase-change memory (PCM) material can work one thousand times faster than current flash computer memory, while being significantly more durable with respect to the number of daily read-writes.
12/04/2018 The U.S. plans to delay tariff increases on $200 billion worth of Chinese imports, China has vowed to increase U.S. market access, and both parties are planning talks over the course of 90 days to address current frictions.
12/03/2018 Leti and Silvaco Inc. today announced during the IEDM 2018 conference a project to create innovative and unified SPICE compact models for the design of advanced circuits using nanowire and nanosheet technologies.
12/03/2018 New BONDSCALE system provides a significant boost in wafer bond productivity; addresses logic transistor scaling and 3D integration challenges outlined in IRDS Roadmap.
12/03/2018 SEMI today reported that third quarter 2018 worldwide semiconductor manufacturing equipment billings dropped 5 percent from the previous quarter to US$15.8 billion but are 11 percent higher than the same quarter a year ago.
12/01/2018 Thursday, December 13, 2018 at 1 p.m. Eastern
As digital-centric scaling pursues solutions in 3D device architectures such as gate-all-around (GAA) transistors, most applications in new leading-edge growth markets such as Edge AI/ML, IoT, automotive and 5G mmWave demand post-bulk processing power and also next-generation analog and RF performance. This webinar is an overview of production-proven fully-depleted silicon-on-insulator (FD-SOI), the only post-bulk planar transistor technology. We will explain and demonstrate how FD-SOI delivers FinFET-like performance, excellent mismatch and noise characteristics and best-in-class Ft and Fmax required for energy-efficient mmWave applications.
11/30/2018 Qualcomm Incorporated today announced the launch of the Qualcomm Ventures AI Fund to invest up to an aggregate of $100 million in startups transforming artificial intelligence.
11/30/2018 Researchers at the National Institute of Standards and Technology (NIST) have developed a method for more quickly tracking microelectromechanical systems (MEMS) as they work and, just as importantly, as they stop working.
11/29/2018 Â Thermal Engineering Associates, Inc. (TEA) announces that its Thermal Test Chip (TTC) will soon be available in 8" (200mm) diameter wafers.
11/29/2018 Industry's most advanced high-speed SiGe technology now available on 300mm manufacturing line for terabit communications and automotive radar applications.
11/28/2018 STMicroelectronics (NYSE: STM) is making its STM32 microcontrollers (MCUs) even more attractive to developers of IoT products and other smart devices by providing free software for creating rich, smooth, and colorful graphical interfaces that deliver a great user experience.
