04/13/2017 The Department of Mechanical Engineering of The Hong Kong Polytechnic University (PolyU) has developed a novel technology of embedding highly conductive nanostructure into semiconductor nanofiber.
04/13/2017 A new method to improve semiconductor fiber optics may lead to a material structure that might one day revolutionize the global transmission of data, according to an interdisciplinary team of researchers.
04/12/2017 Despite the many advances in portable electronic devices, one thing remains constant: the need to plug them into a wall socket to recharge. Now researchers, reporting in the journal ACS Nano, have developed a light-weight, paper-based device inspired by the Chinese and Japanese arts of paper-cutting that can harvest and store energy from body movements.
04/12/2017 The factors that are driving the growth of this market include the growth in the consumer electronics market, low wafer and gate cost, low operating voltage, and miniaturization of semiconductor devices.
04/12/2017 On March 31, 2017, Seoul Semiconductor Co., Ltd (Seoul) filed a patent infringement lawsuit in Germany in the District Court of Düsseldorf against Mouser Electronics Inc. (Mouser), a global electronic components distributor, asserting infringement of an LED patent.
04/12/2017 Microprocessors based on atomically thin materials hold the promise of the evolution of traditional processors as well as new applications in the field of flexible electronics.
04/11/2017 Silicon Integration Initiative, Inc. (Si2), a integrated circuit research and development joint venture, has contributed new power modeling technology to the IEEE P2416 System Level Power Model Working Group.
Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.
04/10/2017 NXP Semiconductors N.V. today announced a new laterally diffused metal oxide semiconductor (LDMOS) technology for RF power transistors designed for operation up to 65 volts (V).
04/10/2017 MagnaChip Semiconductor Corporation announced today that it will host its Annual U.S. Foundry Technology Symposium at Hilton Santa Clara, California, on June 7th, 2017.
04/10/2017 A research collaboration in Germany develops a prototype for a spin-wave majority logic gate that uses wave interference for information processing.
04/10/2017 SEMI today announced that the worldwide semiconductor photomask market was $3.32 billion in 2016 and is forecasted to reach $3.57 billion in 2018.
04/10/2017 The research wing of the Defense Department, otherwise known as DARPA, put out a broad agency announcement in Sept 2016 for a program called “Common Heterogeneous Integration and IP Reuse Strategies with the same acronym, CHIPS [BAA-16-62] with an anticipated funding level of ~ $70MM.
04/07/2017 Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. today jointly announced the completion of the approximately $500 million acquisition of Analogix Semiconductor.
