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Apogee Technology unveils its first MEMS sensor

05/12/2005  Apogee Technology Inc., a provider of integrated circuits and an emerging MEMS sensor supplier, today announced the introduction of its Sensilica family of "all silicon" pressure sensors. In addition to its first Sensilica product being sampled to customers, Apogee plans to introduce six new Sensilica designs in 2005 for various pressure sensor applications.

PA DEP offers $3.5 million in grants for innovative water, wastewater technology projects

05/11/2005  HARRISBURG, Pa., May 10 /PRNewswire/ -- On behalf of Pennsylvania Governor Edward G. Rendell, Environmental Protection Secretary Kathleen A. McGinty announced the opening of a $3.5 million grant program through Growing Greener that will help communities, municipalities, municipal authorities and public school districts finance improvements to their existing sewage facilities and drinking water systems by using innovative or new water and wastewater technology.

Global BioSciences removes MTBE, and other major pollutants, from soil and groundwater

05/11/2005  NORWOOD, MA -- (MARKET WIRE) -- 05/11/2005 -- Global BioSciences Inc. ("GBI"), today announced rapid, cost-effective remediation of methyl tertiary butyl ether (MTBE) from soil and groundwater in multiple sites using its proprietary Butane Biostimulation Technologies (Butane Biosparging , Butane Bioventing, collectively "BBT").

Compact Model Council members elect HiSIM-RF surface potential SPICE Model for standardization

05/11/2005  SANTA CLARA, CA -- (MARKET WIRE) -- 05/10/2005 -- Silvaco, a leading vendor of commercial circuit simulation and EDA software, received the great news from the Compact Model Council (CMC) that the HiSIM-RF Surface Potential SPICE Model was elected by its members for standardization.

STATS ChipPAC Adds 300-mm Wafer Bumping to Portfolio

05/11/2005  (May 11, 2005) Singapore and Fremont, Calif. — In Q3 2005, STATS ChipPAC Ltd. will offer 300-mm electroplated wafer bumping services, completing the company's full turnkey service offering. The company has also expanded its solder-alloy options for its present flip chip portfolio, and enhanced its design, simulation, and characterization capabilities for high-end flip chip packages.

Q1 2005 Worldwide Semiconductor Figures Show Growth

05/11/2005  (May 11, 2005) San Jose, Calif. — Worldwide semiconductor manufacturing equipment billings reached US$9.35 billion in Q1 2005, 2.3% above the same quarter one year ago and 6.5% more than Q4 2004, according to SEMI. Monthly, this data is gathered in cooperation with the Semiconductor Equipment Association of Japan (SEAJ) from 150+ global equipment companies.

SEMI reports 1Q05 worldwide billings of $9.35B

05/11/2005  May 11, 2005 - SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$9.35 billion in the 1Q05. The figure is 2.3% above the same quarter a year ago and 6.5% more than the billings figure for the 4Q04.

Philips says it wants to sell substantial part of its TSMC shares

05/11/2005  May 11, 2005 - Dutch electronics giant Philips has announced it is considering the sale of a "substantial part" of up to 1.05 billion common shares in Taiwan Semiconductor Manufacturing Company (TSMC), a leading foundry for custom-made chips.

Cash flow strategy helps tide company over in lean times

05/11/2005  The business plan we created to start LioniX BV included a financial strategy that called for a set sum of funding. We based our plan on getting funding for one year to cover 50 percent of the salaries, the necessary investment for equipment as well as for taking care of cash flow. We estimated that our first revenues would appear after six to nine months, and break-even would be reached after one year.