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Semiconductor measurements come clean

04/01/2005  When measuring semiconductor features, recent industry developments illustrate that the linkage between metrology and contamination control is getting tighter as features shrink.

Mega merger creates new landscape for critical materials transport technology

04/01/2005  EAST HILLS, N.Y.-On the heels of a recent market study indicating that Asia is driving-and will continue to drive over the next several years-the cleanrooms hardware and garment market, filtration/purification developer Pall Corp. (www.pall.com) has opened a new manufacturing facility in Beijing, China, and has named Jon Weiner the first president of Pall Microelectronics Asia.

The ‘Other’ Tin Issue: Tin Pest

04/01/2005  Most IC packaging technologists are aware of this “other” issue, but this topic has never required serious consideration.

Automated contamination monitoring: Faster is better

04/01/2005  Contamination monitoring is the last element of the cleanroom's production process to become automated, but as manufacturers are pushed to the limits of their manual contamination-monitoring capabilities, demand for new technologies is growing.

Technical Feature I: Body-Box Test: Investigation of a test method

04/01/2005  It is indisputable that cleanroom garments are still one of the most important components of contamination control in the cleanroom.

The tools we use

04/01/2005  People concerned with contamination control certainly know a lot about such things as cleanrooms, barrier isolators, minienvironments, fume hoods and glove boxes.

Safe containment lab design follows clear protocols

04/01/2005  A BSL-3 lab and Animal BSL-3 lab can be simple or sophisticated, depending upon their purpose.

Your Market Analysis: China is changing the world's cleanroom industry

04/01/2005  The cleanroom industry has always been dynamic. The rate of change may now be accelerating thanks to activity in China.

The Latest in Packaging Research

04/01/2005  Every now and then, it’s especially good to step out of your normal activities and see what’s going on at other companies and universities.

Subcontractor Update: Up in 2004, Uncertainty into 2005

04/01/2005  The major assembly and test subcontractors ended 2004 with revenues up significantly over 2003, but with a slowing trend leading into 2005.

Extreme-Environment Electronics for the Future

04/01/2005  Electronics have dramatically changed the way we live, conduct business, communicate, and educate.

Through-wafer Via Etching

04/01/2005  The technical challenges and the manufacturing complexity confronting conventional methods of increasing IC device density in 2-D are increasing at a high rate.

What Is IC/Package Co-design?

04/01/2005  Enabling Global Optimization & Characterization of Design

Evolution of Organic Flip Chip Packaging

04/01/2005  Packaging Technology Ready For Change

Automating Hybrid Circuit Assembly

04/01/2005  Die Attach

NIST, Utah State University Form Partnership

03/31/2005  (March 31, 2005) Washington — NIST and Utah State University (USU) have joined together in a collaborative partnership to develop and calibrate optical sensors for defense, homeland security, weather prediction, and climate research.

Metals & Arsenic Removal Technology receives first order for ARTI-64 arsenic removal media from Kelly International

03/31/2005  RALEIGH, NC -- (MARKET WIRE) -- 03/31/2005 -- HydroFlo, Inc. today announced that its portfolio company, Metals & Arsenic Removal Technology, Inc. (MARTI) has received the first order of arsenic removal media (ARTI-64) from Kelly International.

SSA Global delivers SSA PLM 8.0 providing customers with enhanced integration, regulatory compliance and workflow

03/31/2005  CHICAGO--(BUSINESS WIRE)--March 30, 2005--SSA Global, a leading global provider of extended enterprise solutions and services, announced SSA PLM 8.0, a new product lifecycle management solution designed to help customers achieve lower total cost of ownership through integration with other enterprise systems. The solution also provides the capability to more easily meet regulatory compliance and accelerate the time to market for new products.

Semiconductor Technology Demand Growing in Medical Imaging

03/31/2005  (March 31, 2005) Palo Alto, Calif. — Semiconductors in medical imaging modalities are increasing, and should continue to do so until 2008; therefore, semiconductor vendors anticipate growth opportunities, especially in imaging systems such as ultrasounds and computed tomography (CT) scanners.