04/01/2017 With rapidly increasing use of “cloud” client:server computing there is motivation to find cost-savings in the cloud hardware, which leads to R&D of improved photonics chips.
04/01/2017 Jim Walker, who retired from Gartner and is now consulting as World Level Packaging Concepts, gave a plenary talk at the recent IMAPS Device Packaging Conference in Scottsdale on the state of the semiconductor industry which contained some interesting perspectives on emerging new business models.
03/31/2017 Technavio market research analysts forecast the global MRAM market to grow at a CAGR of close to 94% during the forecast period, according to their latest report.
03/31/2017 Intermolecular, Inc. today announced a restructuring initiative to improve the overall effectiveness and efficiency of their materials innovation services.
03/31/2017 An innovative new technique to produce the quickest, smallest, highest-capacity memories for flexible and transparent applications could pave the way for a future golden age of electronics.
03/31/2017 A new way to grow narrow ribbons of graphene, a lightweight and strong structure of single-atom-thick carbon atoms linked into hexagons, may address a shortcoming that has prevented the material from achieving its full potential in electronic applications.
03/30/2017 Researchers at North Carolina State University have developed a technique for converting positively charged (p-type) reduced graphene oxide (rGO) into negatively charged (n-type) rGO, creating a layered material that can be used to develop rGO-based transistors for use in electronic devices.
03/30/2017 A new class of carbon nanotubes could be the next-generation clean-up crew for toxic sludge and contaminated water, say researchers at Rochester Institute of Technology.
03/30/2017 Leti, a research institute of CEA Tech, is marking its 50th anniversary this year during industry events and workshops in Grenoble, Tokyo, and Taipei and at both SEMICON West and IEDM 2017 in San Francisco.
03/29/2017 Synopsys, Inc. today announced that its IC Validator physical verification product has been successfully used for signoff on more than 100 tapeouts at advanced FinFET nodes.
03/29/2017 Soitec and Silicon Genesis Corporation (SiGen) have successfully brought an end to the dispute regarding the importation and sale in the United States of certain silicon-on-insulator (SOI) wafers.
03/28/2017 Ultratech, Inc. today announced that it has received follow-on, multiple system orders from several outsourced semiconductor assembly and test (OSAT) companies in Taiwan, Korea and China.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
