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ams launches AS7225 tunable-white lighting smart system sensor

03/28/2017  ams today announced the AS7225 tunable-white lighting smart system sensor, further broadening the solution set for sensor-integrated tunable-white lighting solutions.

Silego announces GFET3 integrated power switches in wafer level chip scale packaging

03/27/2017  Silego Technology, a developer of Configurable Mixed-signal Integrated Circuits (CMICs), announced today an extension of its performance-driven GFET3 Integrated Power Switch (IPS) portfolio.

EUV lithography progress emphasized at SPIE Advanced Lithography

03/27/2017  New extreme-ultraviolet (EUV) lithography equipment unveiled by ASML, announcement by Intel of eight EUV programs ready to be rolled out, and introduction by IMEC of the industryÂ’s first comprehensive solution for EUVL-enabled high-volume manufacturing systems were among highlights at SPIE Advanced Lithography 2017 in San Jose earlier this month.

?ATTOPSEMI Technology joins FDXcelerator Program

03/27/2017  ATTOPSEMI Technology, Ltd. today announced that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program, to provide a scalable, non-volatile one-time programmable (OTP) memory IP to be compatible with GF's 22FDX technology.

Transphorm announces first automotive-qualified GaN FETs

03/27/2017  Transphorm Inc. announced that its second generation, JEDEC-qualified high voltage gallium nitride (GaN) technology is now the industry's first GaN solution to earn automotive qualification -- having passed the Automotive Electronics CouncilÂ’s AEC-Q101 stress tests for automotive-grade discrete semiconductors.

Imec to honor Samsung's Dr. Kinam Kim with "Lifetime of Innovation Award"

03/27/2017  The selection recognizes Dr. Kim's leadership and strategic vision, as well as his undeniable impact in the semiconductor industries.

Micron to establish its site for DRAM in Taiwan

03/24/2017  Micron has now completed the title acquisition process for the new site.

Ultratech receives follow-on multiple orders from China foundries for laser spike annealing systems

03/24/2017  Ultratech, Inc. this week announced that two China foundries placed follow-on orders for laser spike anneal systems.

ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems

03/24/2017  ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for uniform Descum and Ti etching processes.

Researchers make flexible glass for tiny medical devices

03/24/2017  Glass can bend over and over again on a nanoscale.

Argon is not the 'dope' for metallic hydrogen

03/24/2017  Hydrogen is both the simplest and the most-abundant element in the universe, so studying it can teach scientists about the essence of matter. And yet there are still many hydrogen secrets to unlock, including how best to force it into a superconductive, metallic state with no electrical resistance.

Intel elects two new members to Board of Directors

03/23/2017  Intel Corporation today announced that Omar Ishrak and Greg Smith have been elected to IntelÂ’s board of directors.

Microsemi to close China manufacturing facility

03/23/2017  Microsemi Corporation, a provider of semiconductor solutions, today announced the planned closure of its manufacturing facility in China.

Researchers discover new type of memory effect in transition metal oxides

03/23/2017  Dr. Amos Sharoni of Bar-Ilan University's Department of Physics, and Institute of Nanotechnology and Advanced Materials (BINA), has now uncovered a new kind of memory effect, unrelated to memory effects previously reported.

Scientists discover new 'boat' form of promising semiconductor GeSe

03/23/2017  Uncommon form attenuates semiconductor's band gap size.

Samsung and eSilicon taped-out 14nm network processor with Rambus 28G SerDes solution

03/22/2017  Samsung Electronics Co., Ltd.today announced a successful network processor tape-out based on SamsungÂ’s 14LPP (Low-Power Plus) process technology in close collaboration with eSilicon and Rambus.

MicroLEDs for displays: How we can make it happen

03/22/2017  Many large companies and startups are currently working on microLED technologies for display applications: from LED makers such as Epistar, Nichia or Osram to display makers like AUO, BOE or CSOT and OEMs such as Apple or Facebook/Oculus.

Imec scientist awarded ERC Advanced Grant to develop material stacks for video-rate holography

03/22/2017  Imec announces that Jan Genoe, one of its distinguished scientists, has been awarded an ERC Advanced Grant.

Vital control in fab materials supply-chains

03/20/2017  Expert panel discussion at Critical Materials Council (CMC) Conference.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.