01/18/2005 (January 18, 2005) Singapore and Fremont, Calif. — STATS ChipPAC Ltd. has earned the Asset Triple A Best High-Yield Bond for Asia, for STATS ChipPAC's US$215 million issue due 2011. The award is part of the annual selection of the best capital market deals published in the December 2004 issue of The Asset, an Asian finance magazine.
01/18/2005 Veeco, a Woodbury, N.Y.-based developer of solutions for nanoscale applications in the worldwide data storage, LED/wireless, semiconductor and scientific research markets, announced the release of its new NanoMan II atomic force microscope.
01/17/2005 (January 17, 2005) Washington, D.C. — The International Microelectronics and Packaging Society (IMAPS) and the American Ceramic Society (ACerS) have announced that plans are in place for the First Annual Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), co-located with the ACerS 107th Annual Meeting, Exposition, and Technology Fair, April 10-13, 2005, in Baltimore, Md. A final program has been issued and exhibit sales are well underway.
01/17/2005 January 17, 2005 - Hynix Semiconductor and Taiwan's ProMOS Technologies have finally signed a strategic alliance agreement to jointly produce DRAM chips using 300mm wafer processing technology, according to the Korea Times. Under the agreement, Hynix will share its DRAM semiconductor processing technology and ProMOS will provide foundry service at its 300mm wafer plant in Taiwan.
01/17/2005 January 17, 2005 - Formosa Plastics Corp. announced yesterday it will spend NT$7 billion (US$219 million) to build the island's first 12-inch silicon wafer plant through its unit, Formosa Komatsu Silicon Corp., reports the Financial Times .
01/17/2005 In many markets, you have to win the technology battle first to win the market competition. With its ability to catalyze innovation across markets and solve a broad array of problems, nanotech can help a company win this first battle. We see opportunities in lithography, photonic crystal technology and sensors.
01/14/2005 (January 14, 2005) Singapore — Advanced Interconnect Technologies (AIT) announces that it has entered into a technology partnership with Towa-Intercon to offer customers cost-effective services and singulation technologies.
01/14/2005 January 14, 2005 - Samsung Electronics Co. said Thursday it has begun shipping its multichip packages to Japanese electronics giant Sony Corp. for use in PlayStation Portable game consoles, reports Asia Pulse Pte.
01/14/2005 January 14, 2005 - Salem, NH-based AmberWave Systems Corp. and Korean semiconductor materials manufacturer LG Siltron have announced the signing of an intellectual property license agreement. LG Siltron will obtain rights to AmberWave's full suite of advanced materials intellectual property, including "bulk" strained silicon, strained silicon-on-insulator, and III-V heteromaterials.
01/13/2005 (January 13, 2005) Tokyo, Japan — SEMI has announced the keynote speakers for its upcoming Global FPD Partners Conference (GFPC), to be held February 27 through March 2, 2005, in Nago City (Okinawa, Japan). The inaugural GFPC will feature keynote speakers from China, Europe, Japan, Korea, Taiwan, and the U.S.
01/13/2005 January 13, 2005 - Samsung Electronics has announced that it has developed the largest 5-inch transmissive plastic TFT-LCD display for portable applications such as mobile phones and notebook computers. The display delivers qSVGA resolution with 100 pixels/inch.
01/13/2005 The fundamental objective of most businesses is to create wealth for their shareholders. When managementÂ’s sole focus is on the development of technology at the exclusion of other business activities that can generate revenue, at some point cash reserves will dwindle and the company will be at risk of a meltdown.
