03/20/2017 It takes a range of skills to create a successful business in the Internet of Things space, where chips sell for a few dollars and competition is intense. Circuit design and software support for multiple wireless standards must combine with manufacturing capabilities.
03/20/2017 For several years, a team of researchers at The University of Texas at Dallas has investigated various materials in search of those whose electrical properties might make them suitable for small, energy-efficient transistors to power next-generation electronic devices.
03/20/2017 Peregrine Semiconductor Corp., a Murata company and the founder of RF SOI (silicon on insulator), today announces the acquisition of Arctic Sand Technologies.
03/17/2017 The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, this week announced its support for the House "Better Way" corporate tax reform proposal as an appropriate starting point for reform.
03/17/2017 North America-based manufacturers of semiconductor equipment posted $1.97 billion in billings worldwide in February 2017 (three-month average basis), according to the February Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.
03/16/2017 Synopsys, Inc. today announced that TSMC has certified the complete suite of products in the Synopsys Galaxy Design Platform for the most current version of 12nm FinFET process technology.
03/16/2017 A silicon optical switch newly developed at Sandia National Laboratories is the first to transmit up to 10 gigabits per second of data at temperatures just a few degrees above absolute zero.
03/16/2017 Synopsys, Inc. (Nasdaq: SNPS) today announced its collaboration with TSMC to develop DesignWare Interface, Analog and Foundation IP for TSMC's 12FFC process.
03/15/2017 STMicroelectronics, a global semiconductor and a top MEMS supplier, and iFLYTEK, a voice-recognition cloud service provider in China, have introduced the market's first IoT development platform that enables voice-recognition cloud services in Chinese.
03/15/2017 A University of Kansas research team has observed the counterintuitive motion of electrons during experiments in KU's Ultrafast Laser Lab. Because this sort of 'quantum' transport is very efficient, it could play a key role in a new type of manmade material that could be used someday in solar cells and electronics.
03/15/2017 STATS ChipPAC Pte. Ltd., a provider of advanced semiconductor packaging and test services, announced today that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid Array (eWLB).
03/14/2017 Cadence Design Systems, Inc. today announced several new capabilities resulting from its close collaboration with TSMC to further 7nm FinFET design innovation for mobile and high-performance computing (HPC) platforms.
