11/29/2004 Many of small tech's success stories or at least promising prospects are based on technology from universities or research laboratories. But moving technology to market can be an unfamiliar, sometimes difficult process. Here, a group of technology-transfer experts shed light on the topic.
11/24/2004 (November 24, 2004) San Jose, Calif.—Building on its successful second annual Technology
Symposium held in San Jose, Calif. earlier this year, Tessera Technologies announces that it will take the first annual SiP Symposium to Tokyo, Japan.
11/24/2004 (November 24, 2004) Hsinchu, Taiwan—Taiwan Semiconductor Manufacturing Co. (TSMC) announces that volume production is available for its 0.18-micron process technology with 40-V capability. The high-voltage process will allow designers to produce single-chip TFT LCD drivers for portable applications that reduce chip count and save space and power.
11/24/2004 November 24, 2004 - Asyst Technologies Inc. has announced that Asyst Shinko, Inc. (ASI), the company's 51%-owned joint venture with Shinko Electric Co. Ltd. of Japan, has resolved the customer contract dispute referenced in the company's press release of Nov. 3, 2004.
11/24/2004 Accelrys, a San Diego provider of molecular modeling software, announced the launch of its nanotechnology consortium. Started in the summer of 2004, the consortium's broad goal is to accelerate the development of software for designing nanomaterials and nanodevices.
11/23/2004 Grace Semiconductor Manufacturing has received $90 million in funding from a Hong Kong businessman, to help expand its R&D for leading-edge chipmaking technologies and pave the way toward an initial public offering in 2005.
11/23/2004 (November 23, 2004) San Jose, Calif.—SEMI has announced a "call for innovations" for the third annual Technology Innovation Showcase, to be held in conjunction with SEMICON West 2005. The application deadline is February 6, 2005.
11/23/2004 (November 23, 2004) San Jose, Calif.—North American-based manufacturers of semiconductor equipment posted $1.39 billion in orders in October 2004 (three-month average basis) and a book-to-bill ratio of 0.96, according to the October 2004 Book-to-Bill Report published by SEMI. A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.
11/23/2004 November 23, 2004 - The book-to-bill ratio for Japanese chipmaking equipment manufacturers came in at 0.91 in October, below the key 1.00-mark, according to the Semiconductor Equipment Association of Japan (SEAJ), reported the Nihon Keizai Shimbun America.
11/23/2004 November 23, 2004 - North American-based manufacturers of semiconductor equipment posted $1.39 billion in orders in October 2004 (three-month average basis) and a book-to-bill ratio of 0.96, according to SEMI.
11/23/2004 Fifteen years ago, lab-on-a-chip was considered the next big thing for MEMS. The cluster of startups that brought lab-on-a-chip to market went public fairly quickly. Today those firms are still struggling to generate revenues, not to mention recover the huge sums spent on developing products.
11/22/2004 November 22, 2004 - Citing a need to reorganize and raise cash while divesting itself of its Semiconductor Equipment Group, Robotic Vision Systems Inc. (RVSI) has announced that it has filed a voluntary petition under Chapter 11 of the US Bankruptcy Code. The company intends to continue operating its business as a "debtor in possession."
11/22/2004 November 22, 2004 - Taiwan's Radiant Opto-Electronics Corp. will soon move to build a new LCD TV back-light module plant in Southern Taiwan Science Park at a total cost of NT$500 million (US$15.24 million). The new plant is scheduled to be completed by the end of 2005, according to the China Economic News Serivce.
11/22/2004 Seth Coe-Sullivan was heading to the Cleveland airport in late October after his new company had just received the top prize in a nanotechnology business idea competition. A few weeks earlier, he had taken top honors in the Nikon International Small World Competition.
11/19/2004 (November 19, 2004) Chandler, Ariz.—Amkor Technology announces that it is working with EDA tool provider, Sigrity Inc. of Santa Clara, Calif., to develop a package-design template library that will be incorporated into Sigrity's EDA tools. The library will address flip chip and high-end wire bond packages for SoC applications.
