03/14/2017 SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $41.24 billion in 2016, representing a year-over-year increase of 13 percent.
03/14/2017 Jim Walker, who retired from Gartner and is now consulting as World Level Packaging Concepts, gave a plenary talk at the recent IMAPS Device Packaging Conference in Scottsdale on the state of the semiconductor industry which contained some interesting perspectives on emerging new business models.
03/13/2017 Cadence Design Systems, Inc. today announced new optimization capabilities within its holistic, integrated design flow for TSMC's advanced wafer-level Integrated Fan-Out (InFO) packaging technology.
03/13/2017 Versum Materials, Inc. announced today it received the "Excellent Performance Award" by the world's largest dedicated semiconductor foundry, TSMC.
03/13/2017 Osaka University-based researchers simultaneously detect multiple spin states in a quantum dot in real time, holding great promise for quantum computing.
03/10/2017 The new Sandia metamaterials can be fabricated in multiple layers to form complex, three-dimensional meta-atoms that reflect more light than shiny gold surfaces, usually considered the ultimate in infrared reflectivity. The III-V materials also emit photons when excited -- something that silicon, which can reflect, transmit and absorb -- can't do.
03/10/2017 Now, University of Pennsylvania engineers have shown a way to make metamaterials with a single inclusion, providing easier fabrication, among other useful features.
03/10/2017 Applied Materials, Inc. today announced Thomas J. Iannotti as chairman of the Board of Directors effective immediately. Mr. Iannotti succeeds Willem P. Roelandts, who has retired from the board.
03/09/2017 Soitec has announced that the ramp up to high-volume production of 200mm silicon-on-insulator (SOI) wafers has begun at the manufacturing facility of its Chinese partner Shanghai Simgui Technology Co., Ltd.
03/09/2017 Synopsys, Inc. today announced the availability of a key technology in virtual prototyping which enables architecture performance requirements to be easily shared through the supply chain.
03/09/2017 NXP Semiconductors today announced the world's smallest single-chip SoC solution -- the MC9S08SUx microcontroller (MCU) family -- with an integrated 18V-to-5V LDO and MOSFET pre-driver that delivers ultra-high-voltage solution for drones, robots, power tools, DC fan, healthcare and other low-end brushless DC electric motor control (BLDC) applications.
03/09/2017 Imec and Holst Centre (initiated by imec and TNO) have developed a novel phase-tracking receiver bringing further power and cost reduction for the next generations of Bluetooth and IEEE802.15.4 radio chips.
03/09/2017 Russian physicists, with their colleagues from Europe through changing the light parameters, learned to generate quasiparticles - excitons, which were fully controllable and also helped to record information at room temperature.
03/08/2017 The company has leased an adjacent building at its Newark campus, adding 75,000 sq. ft. that is zoned for manufacturing and business operations.
03/08/2017 Researchers at the Technical University of Munich (TUM) have, for the first time ever, produced a composite material combining silicon nanosheets and a polymer that is both UV-resistant and easy to process.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
