11/01/2004 Scientists at the Fermi National Accelerator Laboratory (Fermilab) are working on a new major high-energy physics project, the BTeV (B physics at the Tevatron) experiment.
11/01/2004 Five years ago the promise of wafer-level processing for advanced packaging meant improved performance, reduced form factor, and the potential of reduced packaging costs.
11/01/2004 "Embossing" is an ancient technical term in the English language, traceable to the period 1350 to 1400, and used by Chaucer in its present sense.
11/01/2004 Flexibility is key when it comes to die attach capabilities critical for hybrid microelectronics, especially in North America's automotive, medical and military markets.
10/29/2004 October 29, 2004 - DuPont Photomasks Inc. said it is installing at its advanced photomask production facility in Round Rock, TX, a leading-edge photomask production line to support semiconductor devices at volume production with 90nm design rules and prototype devices with 65nm design rules. The total investment represents more than $30 million.
10/29/2004 Given the time and skills necessary to move from concept to commercial product, it is unlikely that the necessary people and capital exist in most companies. The properties of nano materials challenge even the most technically advanced businesses. The likely reality is that partnerships may be as important to your firmÂ’s future as its technology.
10/28/2004 (October 29, 2004) Taichung, Taiwan—Siliconware Precision Industries Co. Ltd. (SPIL) announces that its sales revenues for Q3 2004 were $8,946 million, representing a 2.7% increase QoQ and a 24.2% increase compared to the same period in 2003.
10/28/2004 (October 28, 2004) Sterling, Va.—NanoMarkets, an advanced technology analyst firm based in Sterling, Va., has released a market-analysis report that forecasts the market for nano-enabled electronics will reach $10.8 billion in 2007, and grow to $82.5 billion in 2011.
10/28/2004 (October 28, 2004) Austin, Texas—Recently at the 11th Annual KGD Packaging & Test Workshop in Napa, Calif., the Die Products Consortium (DPC) presented the Industry Achievement Award to Jim Wolbert of Chip Supply Inc. for his leadership in developing international standards for semiconductor die products. The DPC presents the award annually to an individual for exemplary contributions to enlarging the world-wide markets for die products.
10/28/2004 (October 28, 2004) Hsinchu, Taiwan—Taiwanese semiconductor memory specialist U-Chip and Ansoft Corporation jointly announce their partnership for IC design and simulation. The power of Ansoft's Nexxim circuit simulator is essential for U-Chip to predict transient behavior and power consumption of their embedded read-only memory (ROM) IC designs.
10/28/2004 (October 28, 2004) Blacksburg, Va.—To the average American, the importance of designing semiconductors rests in the hands of the electrical engineer. But when one considers that semiconductors are integral parts of everything from video games to diagnostic medical equipment to security devices, the demand for flawless design is universal.
10/28/2004 (October 28, 2004) Itaca, N.Y.—Cornell University researchers have demonstrated a device that allows one low-powered beam of light to switch another on and off on silicon, a key component for future "photonic" microchips in which light replaces electrons.
10/28/2004 October 28, 2004 - Powerful aftershocks that rocked Niigata Prefecture, Japan, and its vicinity after Saturday's large earthquakes have delayed rehabilitation work at manufacturing plants, said Kyodo News International.
10/28/2004 (October 28, 2004) Blacksburg, Va.—To the average American, the importance of designing semiconductors rests in the hands of the electrical engineer. But when one considers that semiconductors are integral parts of everything from video games to diagnostic medical equipment to security devices, the demand for flawless design is universal.
10/28/2004 October 28--Pall Corporation today announced it will acquire the BioSepra Process Division from Ciphergen Biosystems, Inc. for a purchase price of approximately $32 million, net of cash and debt. The transaction is
expected to close within 45 days.
