10/18/2004 October 18, 2004 - Fairchild Semiconductor has made a five-year foundry agreement with Jilin Sino-Microelectronics (JSMC) to manufacture selected Fairchild MOSFET and bipolar power products. JSMC will utilize its recently completed wafer fab in Jilin City, Jilin Province in China.
10/18/2004 October 18, 2004 - Materials metrology supplier Semilab R.T., Budapest, Hungary, has completed its acquisition of SemiTest Inc., Billerica, MA, the companies said Friday.
10/18/2004 (October 18, 2004) Naples, Fla.—Megan Wendling, president of MW Associates, has recognized a need within the electronics industry, and has introduced of a series of lead-free seminars to be held throughout China in 2004 and 2005.
10/18/2004 (October 18, 2004) Singapore and Fremont, Calif.—STATS ChipPAC announces that its wholly owned subsidiary ChipPAC Inc. is soliciting consents from holders of ChipPAC's 2.5% Convertible Subordinated Notes due 2008 to amend certain provisions of the indenture pursuant to which the Notes were issued. The consent solicitation will expire at 5:00 pm, New York City time, on Monday, November 1, 2004, unless extended by ChipPAC.
10/18/2004 After several years of helping others bring MEMS to market, a Tokyo-based fab facility is launching its own line. Oki Electric Industry Co. Ltd. has developed a tri-axis accelerometer module designed for mobile phones as well as other products. Oki expects to send sample shipments in October to Japanese and North American customers, and ramp up to high volume by April.
10/15/2004 October 15--Following the announcement of its equity position in AUECC (Asia Union Electronic Chemical Corporation), BOC Edwards announced today that AUECC is moving forward with plans to supply wet process chemicals to the growing electronics manufacturing industry in China, and has formed an equity joint venture with Shanghai Huayi (Group) Company. The new venture is called Shanghai Huayi Microelectronic Material Co. Ltd.
10/15/2004 BOC Edwards, a major supplier of materials, equipment and services to the global microelectronics industry, announced it will supply fluorine gas to Hynix Semiconductor, Inc. for its 300 mm semiconductor manufacturing facility in Ichon, South Korea.
10/15/2004 M+W Zander, subsidiary of the JENOPTIK AG technology group, has been given the contract for the construction of the new Infineon Technologies AG Memory Development Centre in Dresden.
10/15/2004 A new SKF Anti-Creep System (ACS) to eliminate "cage creep" in cross-roller precision rail guides has been introduced with PEEK material as an option. The specialized plastic exhibits low outgassing properties ideal for X/Y positioning applications in vacuum or cleanroom settings.
10/15/2004 October 15, 2004 - Following announcement of its equity position in AUECC (Asia Union Electronic Chemical Corp.), BOC Edwards has said that AUECC is moving forward with plans to supply wet process chemicals to the electronics manufacturing industry in China, and has formed an equity joint venture with Shanghai Huayi (Group) Co. The new venture is called Shanghai Huayi Microelectronic Material Co. Ltd.
10/15/2004 (October 15, 2004) Ottawa, Ontario, Canada—Ageus Solutions announces the launch of a complete, end-to-end WEEE compliance package. Ageus is now ready to provide full-service logistical, operational, financial, and engineering solutions for issues related to WEEE fulfillment.
10/15/2004 (October 15, 2004) Willow Grove, Pa.—Kulicke & Soffa Industries will hold a grand opening event on October 15, 2004 at its new state-of-the-art probe card manufacturing facility located in Hsin Chu, Taiwan.
10/15/2004 (October 15, 2004) Scharding and Radfeld, Austria—EV Group, a supplier of wafer-bonding and lithography equipment, and Datacon Technology AG, a supplier of flip chip and die bonding equipment, announces a development agreement in the field of advanced-chip-to-wafer (AC2W) technology. The two companies also have agreed on joint strategic marketing and sales activities to promote the cooperation.
10/15/2004 Peter Diamandis will now oversee the institute's Feynman Grand Prize as chairman of the prize steering committee. The $250,000 prize, still unclaimed eight years after its creation, will go to the first person to demonstrate both a working robotic arm less than 100-nanometers long and a calculation device that can fit within 50-cubic nanometers.
10/14/2004 October 13, 2004 - EV Group, Scharding, Austria, and Datacon Technology AG, Radfeld, Austria, have agreed to jointly develop and market a new chip-to-wafer bonding platform combining their technologies.
