03/08/2017 New IQ Aligner NT achieves double throughput and alignment accuracy over previous-generation platform; opens up new applications for EVG lithography solutions.
03/08/2017 Leti, a research institute of CEA Tech, today announced it has developed a shield that can help protect electronic devices against physical attacks from the chipsÂ’ backside.
03/08/2017 ClassOne Technology, manufacturer of wet processing equipment for 200mm and smaller wafers, announced that Scientech Corporation of Taipei, Taiwan, will become the companyÂ’s new representative for China, Taiwan and Southeast Asia, starting immediately.
03/07/2017 The Semiconductor Industry Association (SIA) today announced the addition of two leading U.S. semiconductor companies, Skyworks Solutions, Inc. and Western Digital Corporation, as SIA members.
03/07/2017 In a significant advance, particularly within the microelectronics realm, University of Massachusetts Amherst engineers have established electrical surface treatment of conducting thin films as a physical processing method to reduce surface roughness.
03/06/2017 Cypress Semiconductor Corp. (Nasdaq: CY) today announced it has sold the subsidiary that owns its semiconductor wafer fabrication facility in Bloomington, Minnesota to SkyWater Technology Foundry for $30 million.
03/06/2017 In 2016, the Nano-Bio Manufacturing Consortium (NBMC), a FlexTech-managed consortium focused on human performance monitoring technology, and funded in part by the Air Force Research Laboratories (AFRL), contracted with a broad-based team of industry and academia researchers, to develop a wearable monitor based on sweat analysis.
03/03/2017 Technavio analysts forecast the global carbon nanotube (CNT) market to grow at a staggering CAGR of almost 22% during the forecast period, according to their latest report.
03/03/2017 A Cornell-led group has demonstrated the ability to produce deep-ultraviolet emission using an LED light source, potentially solving several problems related to quantum efficiency of current devices.
03/02/2017 Today, FlexTech, a SEMI Strategic Association Partner, announced the agenda for 2017FLEX Japan, the first flexible hybrid electronics (FHE) conference in Tokyo on April 11-12.
03/02/2017 Seoul Semiconductor Europe, a subsidiary of Seoul Semiconductor Co. Ltd. today announced the availability of reference modules based on its package-free Wicop LEDs.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
