09/16/2004 September 15, 2004 - Infineon Technologies AG said it has agreed to plead guilty to charges of DRAM memory chip price-fixing from the US Department of Justice, and will pay a $160 million fine, one of the biggest antitrust fines ever levied in the US.
09/16/2004 (September 16, 2004) Taipei, Taiwan—A taskforce will review whether to allow Taiwanese integrated circuits packaging and testing firms to invest in China, announced Ho Mei-yueh, Taiwan's minister of economic affairs. The taskforce will consist of representatives from the industry, government and academia. No timeframe for a decision was given.
09/16/2004 The war on cancer has an unusual ally: the U.S. Department of Defense. The department has allocated more than $1.5 billion since 1992 for research efforts aimed at eradicating breast cancer. In recent years, it has added nanotechnology-based approaches to its arsenal.
09/15/2004 September 14, 2004 - A new joint development program between Synopsys Inc., Mountain View, CA, and Photronics Inc., Brookfield, CT, aims to tighten the links between design software and the production of advanced photomasks for 65nm and below processes.
09/15/2004 September 15, 2004 - Major Japanese electronics manufacturers Canon Inc. and Toshiba Corp. have agreed to jointly develop, make and sell next generation FPDs that are thinner than conventional flatscreens.
09/15/2004 September 14--Mykrolis Corporation, a leading supplier of components and subsystems to the semiconductor industry, today announced that it has shipped four Aeronex Infinity Gas Purification Systems to a major epi-wafer manufacturer located in Tainan, Taiwan.
09/15/2004 September 14, 2004 - Synopsys Inc., Mountain View, CA, and Photronics Inc., Brookfield, CT, are forming a joint program to improve design-for-manufacturing (DFM) and mask synthesis for advanced photomasks.
09/15/2004 September 15, 2004 - ASML MaskTools, Santa Clara, CA, and Micron Technology Inc., Boise, ID, have signed a multiyear deal to develop applications for resolution-enhancement techniques.
09/15/2004 September 15, 2004 - IBM Corp. and Suss MicroTec AG have struck an alliance to commercialize IBM's "C4NP" next-generation wafer solder-bump technology, described as the first flip-chip technology to support 100% lead-free packaging with a combination of fine-pitch connections, low cost, and the flexibility to use most types of solder compositions.
09/15/2004 (September 15, 2004) Santa Clara, Calif.—Alliance Semiconductor Corporation announced that it will continue to move toward offering environmentally safe and lead-free compliant products across its entire product portfolio. The company shipped millions of devices over the course of 2003 in lead-free packaging as part of this effort.
09/15/2004 In India, nanotech is frequently taking a prominent role in presidential speeches. The country's president, A.P.J. Abdul Kalam, is promoting the technology as a vehicle for increasing wealth and improving the quality of life in the poor nation of more than a billion people. An aeronautical engineer, Kalam has been encouraging the scientific and academic communities to embrace the opportunities nanotech offers.
09/14/2004 (September 14, 2004) Taipei, Taiwan—The semiconductor equipment market is taking a "temporary pause," but is still "fundamentally strong," according to yesterday's speakers at SEMICON Taiwan 2004. Prominent leaders in the semiconductor equipment industry participated in a panel discussion on the opening day of the conference.
09/14/2004 When Nanosys withdrew its initial public offering in early August, the debate over what its withdrawal meant was so loud and vociferous that it effectively drowned out the news that Cambridge Display Technology (CDT) Corp., a developer of organic molecules for display applications, had filed to go public just a few days earlier.
09/13/2004 (September 13, 2004) Munich, Germany and East Fishkill, N.Y.—IBM and SUSS MicroTec AG are working together to commercialize IBM's next-generation, lead-free semiconductor packaging technology, known as C4NP.
09/13/2004 September 10--Revised Recommended Practice is now available. The experts of IEST Working Group-CC006 have finished their revision of IEST-RP-CC006.3, Testing Cleanrooms.
09/13/2004 September 13, 2004 - IBM and SUSS MicroTec AG have signed an agreement to develop and commercialize IBM's next-generation, 100% lead-free semiconductor packaging technology.
