09/01/2004 Although the proliferation of semiconductor packages has been a part of the industry for the past 20 years, the last several years have seen the rate of proliferation accelerate.
09/01/2004 The Electronic Packaging Lab at the University at Buffalo has earned a reputation for its cutting-edge work in developing computational and experimental measurement tools for facilitating the development of the next-generation microelectronics packaging.
09/01/2004 It is once again with great pleasure that Advanced Packaging Magazine congratulates the winners and participants of the 2004 Advanced Packaging Awards.
08/31/2004 (August 31, 2004) San Jose, Calif.—Pac Tech GmbH, a German supplier of services, equipment and chemicals for semiconductor wafer bumping, has appointed Thorsten Teutsch, Ph.D., as president of its United States operation.
08/31/2004 August 31, 2004 - EV Group (EVG), a supplier of wafer-bonding and lithography equipment, has opened a second customer-support center in Japan with a significant increase in engineering staff to better serve its growing customer base in that country.
08/31/2004 August 31, 2004 - Wafer fab capacity utilization for integrated circuits climbed to 95.4% in the second quarter of 2004, the highest since the peak of the last IC boom period in 2000, according to recent data compiled by the Semiconductor International Capacity Statistics (SICAS).
08/31/2004 A Colorado-based government lab has moved forward in its quest to make a precise clock available to more industries. Researchers with the National Institute of Standards and Technology(NIST) reported last Friday that they have developed the core technology for a MEMS-based atomic clock.
08/30/2004 (August 30, 2004) Mountain View, Calif.—The Microelectronics Packaging and Test Engineering Council (MEPTEC) is gearing up to host two luncheons in September to unveil Dataquest's annual forecast. Jim Walker, VP of Semiconductor Manufacturing and Emerging Technologies at Gartner-Dataquest (and also a member of Advanced Packaging's advisory board), will present 'Up, Down, and All Around: Pedaling Your Way Through the Next Cycle.'
08/30/2004 (August 30, 2004) Ithaca, N.Y.—Time is fast running out for the semiconductor industry as transistors become ever smaller and their insulating layers of silicon dioxide, already only atoms in thickness, reach maximum shrinkage. In addition, the thinner the silicon layer becomes, the greater the amount of chemical dopants that must be used to maintain electrical contact. And the limit here also is close to being reached.
08/30/2004 (August 30, 2004) Los Angeles, Calif.—Perfisans Network Corp.'s holdings traded up 17.39% this past Friday on volume of 50,938—more than three times its average volume of 14,048—to close at $1.35, its high of the day.
08/30/2004 August 30, 2004 - Pall Corp. and Matheson Tri-Gas Inc., a member of Nippon Sanso Corp., have entered into a strategic alliance to jointly develop, manufacture, and sell gas purifiers to the semiconductor industry.
08/30/2004 (August 30, 2004) San Jose, Calif.—Intel Corp. announced today that it has achieved a milestone in shrinking the size of transistors that will power its next-generation chips. Specifically, the company has created a fully functional 70-mb memory chip with transistor switches measuring just 35 nm—about 30% smaller than those found on today's state-of-the-art chips.
08/30/2004 August 30, 2004 - Researchers from the Georgia Institute of Technology and Naval Research Laboratory have improved upon a method to directly write nanometer-scale patterns onto various surfaces.
08/30/2004 August 30, 2004 - Last week, Intel presented highlights of its 65nm process technology, which the company has demonstrated on fully functional 70Mbit SRAM chips containing more than 0.5 billion transistors (each cell contains six transistors). The news comes only nine months after the company's disclosure of its first 0.57 sq. micron SRAM logic cell at 65nm.
08/30/2004 IsraelÂ’s scientific community is hard at work to become a world-class nano research center. And the United States government, mainly through the U.S. Israel Science and Technology Foundation (USISTF), has joined the effort to bring nanotech to Israel. The USISTF is a scientific organization that promotes technological cooperation between the two countries by financing joint research projects.
08/27/2004 August 27--AMTEK Engineering has reported a 36% jump in net profit to $43.8 million, buoyed by a recovery in the global economy and gains from disposal of businesses.
08/27/2004 August 27--Mainboard-listed stainless steel group AnnAik has bought a controlling stake in a surgical and cleanroom equipment supplier, diversifying into a business which is burgeoning from a growing need for stringent contamination controls.
