03/01/2017 Tuesday, March 28, 2017 at 1pm ET / Sponsored by Epicor
The rise of Internet of Things (IoT) and the cloud and their associated technologies and platforms are slowly but surely fueling the emergence of new market segments that are shaping and transforming our way of life. Learn how the IoT applications and use-cases that span clients/devices, networks, and data centers are driving new requirements for semiconductors including ultra-low power, ultra-low leakage, smaller and denser packaging, and cost effectiveness. And find out exactly how this IoT trend represents a growth opportunity for the semiconductor industry that has not been seen since the early days of the Internet.
03/01/2017 ULVAC Technologies, Inc. has been selected by a global MEMS inertial sensor manufacturer to deliver an ULVAC ENVIRO-1Xa advanced plasma ashing system for running critical low-temp descum processes and high-temp bulk photoresist strip processes.
03/01/2017 Dow Corning further expanded the design flexibilities for LED packaging manufacturers today with the addition of five new optical encapsulants (OEs) to its portfolio of advanced LED solutions.
03/01/2017 Versum Materials, Inc. announced today that it would expand its manufacturing capacity at its Delivery Systems and Service (DS&S) headquarters in Allentown, Pennsylvania.
03/01/2017 Materion Corporation announced today that it has completed the previously announced acquisition of the target materials business of the Heraeus Group.
02/28/2017 Cadence Design Systems, Inc. today announced the Cadence Litho Physical Analyzer (LPA) Production Lithography Unified Solution (PLUS) developed in partnership with ASML, which seamlessly provides foundry-enabled lithography simulation capabilities during chip design implementation and signoff.
02/28/2017 The eBeam Initiative today announced that Semiconductor Manufacturing International Corporation (SMIC)--one of the world's leading global foundries--has joined its ranks.
02/27/2017 Ultra-low power voice processing and MEMS microphone circuitry enables sound detection and keyword recognition in a miniaturized single package.
02/27/2017 Dream Chip Technologies announced today the presentation of the industry`s first 22nm FD-SOI silicon for a new ADAS System-on-Chip (SoC) for automotive computer vision applications at the Mobile World Congress in Barcelona.
02/27/2017 At the SPIE Advanced Lithography conference in San Jose, Calif. (USA), imec and its partners will present a patterning solution for a 42nm-pitch M1 layer and a 32nm-pitch M2 layer in logic design compatible with the foundry N5 requirements.
02/24/2017 Versum Materials, Inc., a materials supplier to the semiconductor industry, announced today that Edward “Ed” Shober has been appointed to the position of senior vice president of its Materials segment.
